Patent application number | Description | Published |
20080210479 | VEHICULAR WHEEL ASSEMBLY WITH IMPROVED LOAD DISTRIBUTION - A vehicular wheel assembly includes a first bearing component including at least one frame connector configured to be coupled to a frame of a vehicle, a second bearing component rotatably coupled to the first bearing component, a motor including a stator and a rotor, the stator being coupled to the first bearing component and the rotor being coupled to the second bearing component such that rotation of the rotor relative to the stator causes the second bearing component to rotate relative to the first bearing component, the first bearing component and the motor being shaped such that a gap is formed between the at least one frame connector and the motor, and a brake mechanism coupled to the second bearing component to slow the rotation of the second bearing component and the rotor. | 09-04-2008 |
20080225482 | SEMICONDUCTOR COOLING SYSTEM FOR USE IN ELECTRIC OR HYBRID VEHICLE - A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through. | 09-18-2008 |
20080232026 | THIN FILM CAPACITOR AND METHODS OF MAKING SAME - A thin film capacitor and methods of making the capacitor are provided. The capacitor includes a first and a second conductive layer and a dielectric layer disposed therebetween. The dielectric layer includes a first polymer and a second polymer cross-linked to the first polymer. The capacitor may be made by forming a layer comprising a dielectric material including first and second polymers, each polymer capable of being cross-linked, and irradiating the layer to cross-link the first and second polymers and form the dielectric layer. | 09-25-2008 |
20080256782 | METHODS FOR FORMING A MAGNET IN A ROTOR - Methods are provided for forming/inserting a magnet in a rotor. One method includes coating a plurality of magnetizable particles with a non-metallic material, inserting the coated particles in a rotor, and magnetizing the coated particles. Another method includes inserting a plurality of magnetizable particles into a rotor, submersing the rotor in motor varnish to coat the particles with motor varnish, and magnetizing the particles. Yet another method includes inserting a plurality of magnetizable particles in a rotor, inserting a non-metallic material into the rotor, mixing the particles and non-metallic material to form a mixture, curing the mixture to coat each particle with non-metallic material, and magnetizing the particles. Still another method includes mixing a plurality of magnetizable particles with a non-metallic material, curing the non-metallic material to coat each particle with non-metallic material, inserting the coated particles in a rotor, and magnetizing the coated particles. | 10-23-2008 |
20080303056 | SEMICONDUCTOR SUBASSEMBLIES WITH INTERCONNECTS AND METHODS FOR MANUFACTURING THE SAME - A semiconductor subassembly is provided for use in a switching module of an inverter circuit for a high power, alternating current motor application. The semiconductor subassembly includes a wafer having first and second opposed metallized faces; a semiconductor switching device electrically coupled to the first metallized face of the wafer and having at least one electrode region; and an interconnect bonded to the semiconductor switching device. The interconnect includes a first metal layer bonded to the at least one electrode region of the semiconductor switching device, a ceramic layer bonded to the first metal layer, the ceramic layer defining a via for accessing the first metal layer, a second metal layer bonded to the ceramic layer, and a conducting substance disposed in the via of the ceramic layer to electrically couple the first metal layer to the second metal layer. | 12-11-2008 |
20080303137 | SEMICONDUCTOR DEVICES WITH LAYERS HAVING EXTENDED PERIMETERS FOR IMPROVED COOLING AND METHODS FOR COOLING SEMICONDUCTOR DEVICES - A semiconductor device is provided, and includes a wafer having first and second opposed metallized major faces and a transistor bonded to the first metallized face of the wafer. The transistor includes a first surface, and the first surface defines a first area. The device further includes a first metal layer bonded to the first surface of the transistor. The first metal layer has a first surface that defines a second area larger than the first area of the transistor. The device further includes a ceramic layer bonded to the first surface of the first metal layer. | 12-11-2008 |
20090001909 | AUTOMOTIVE POWER INVERTER WITH REDUCED CAPACITIVE COUPLING - An automotive power inverter is provided. The power inverter includes a chassis, a microelectronic die coupled to the chassis and having an integrated circuit formed thereon, and an insulating region between the chassis and the microelectronic die. | 01-01-2009 |
20090009980 | CAPACITOR WITH DIRECT DC CONNECTION TO SUBSTRATE - A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor. | 01-08-2009 |
20090032320 | POWER CONVERTER ASSEMBLY WITH SYMMETRICAL LAYOUT OF POWER MODULES - A power converter assembly is provided. The power converter assembly includes first, second, and third power modules. The second power module is coupled to the first power module such that the second power module is separated from the first power module by a first distance. The third power module is coupled to the first and second power modules such that the third power module is separated from the second power module by a second distance and is separated from the first power module by a third distance. The first, second, and third distances are substantially the same. | 02-05-2009 |
20090032937 | COOLING SYSTEMS FOR POWER SEMICONDUCTOR DEVICES - A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction. | 02-05-2009 |
20090034310 | COMPACT TERMINAL ASSEMBLY FOR POWER CONVERTERS - A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component. | 02-05-2009 |
20090052210 | TEMPERATURE SENSING ARRANGEMENTS FOR POWER ELECTRONIC DEVICES - A cooling system is provided for controlling temperature in a power electronic device. The power electronic device includes a semiconductor having a major surface. The cooling system includes a temperature sensor coupled to the major surface of the semiconductor; and a control circuit coupled the temperature sensor. The control circuit is configured to reduce current to the inverter circuit when the temperature exceeds a predetermined temperature. | 02-26-2009 |
20090161301 | BUSBAR ASSEMBLY WITH INTEGRATED COOLING - A busbar assembly is configured such that the power devices (e.g., IGBT die) and diodes are directly mounted to the busbars. The busbars act as heat sinks, and may be cooled using micro channels, micropin fins, direct cooling, or any other heat transfer method. One assembly includes a plurality of busbars, a plurality of power semiconductor devices bonded to the plurality of busbars, and an integrated cooling system within one or more of the busbars. | 06-25-2009 |
20090284213 | POWER MODULE LAYOUT FOR AUTOMOTIVE POWER CONVERTERS - An automotive power converter is provided. The automotive power converter includes a substrate, first and second electronic devices on the substrate, at least one conductive member coupled to the substrate and having a first device portion electrically coupled to the first electronic device and a second device portion electrically coupled to the second electronic device, and first and second terminals electrically coupled to the at least one conductive member. When a power supply is coupled to the first and second terminals, current flows from the first terminal to the first device portion substantially in a first direction and from the second terminal to the second device portion substantially in a second direction. The first direction has a first component and the second direction has a second component opposing the first component. | 11-19-2009 |
20090294675 | SECURE ENCLOSURE - A system is provided for detecting when an enclosure having a body and a removable cover is opened. The system comprises a light source for generating a light beam, a light detector for detecting the light beam, and at least one reflector all mounted inside the enclosure. The reflector reflects the light beam along a predetermined pathway toward the light detector when the removable cover is closed over the body. | 12-03-2009 |
20100033038 | SYSTEM AND METHOD FOR COOLING AN ELECTRIC MOTOR - A cooling system is provided for an electric motor and comprises a rotor assembly, an intake assembly, and a first reservoir. The rotor assembly is coupled to and rotatable within a housing, and comprises a rotor having a first and second ends having a first plurality of veins extending therebetween, each vein having an inlet and an outlet. The rotor assembly also comprises a first manifold coupled to and rotatable with the first end of the rotor in fluid communication with the inlets of the first plurality of veins. The intake assembly is coupled to the housing and is in fluid communication with the first manifold. The first reservoir is configured to contain a motor coolant and is coupled to the housing for collecting the motor coolant from the outlets of the first plurality of veins, and for providing a source of motor coolant to the intake assembly. | 02-11-2010 |
20100053889 | INVERTER POWER MODULE FOR WITH DISTRIBUTED SUPPORT FOR DIRECT SUBSTRATE COOLING - Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal. | 03-04-2010 |
20100109351 | SYSTEM AND METHOD FOR CLAMPING A CHASSIS COVER - A system is provided for securing a cover having a first surface onto a chassis having a rim, the rim having a second surface. The system comprises a clamping rail and a fastener coupled to the rail. The clamping rail is configured to form a loop that circumferentially engages the first surface and the second surface and, when constricted, produces a first force substantially coplanar with the loop. The fastener is configured to constrict the rail, the rail and the first and second surfaces configured to produce a second force having a component substantially orthogonal to the loop when the rail is constricted. | 05-06-2010 |
20100199489 | METHODS FOR FORMING A MAGNET IN A ROTOR - Methods are provided for forming/inserting a magnet in a rotor. One method includes coating a plurality of magnetizable particles with a non-metallic material, inserting the coated particles in a rotor, and magnetizing the coated particles. Another method includes inserting a plurality of magnetizable particles into a rotor, submersing the rotor in motor varnish or another viscous, non-metallic material to coat the particles, and magnetizing the particles. Yet another method includes inserting a plurality of magnetizable particles in a rotor, inserting a non-metallic material into the rotor, mixing the particles and non-metallic material to form a mixture, curing the mixture to coat each particle with non-metallic material, and magnetizing the particles. Still another method includes mixing a plurality of magnetizable particles with a non-metallic material, curing the non-metallic material to coat each particle with non-metallic material, inserting the coated particles in a rotor, and magnetizing the coated particles. | 08-12-2010 |
20100302733 | STACKED BUSBAR ASSEMBLY WITH INTEGRATED COOLING - A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system including one or more fluid channels in communication with an inlet and an outlet. The busbar assemblies are stacked such that their respective inlets and outlets are aligned and a coolant may then flow in parallel therethrough. | 12-02-2010 |
20100302737 | POWER ELECTRONICS POWER MODULE WITH IMBEDDED GATE CIRCUITRY - A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated. | 12-02-2010 |
20100320014 | AUTOMOTIVE POWER ELECTRONICS WITH WIDE BAND GAP POWER TRANSISTORS - An automotive power electronics system is provided. The automotive power electronics system includes a support member and at least one electronic die mounted to the support member. The at least one electronic die has an integrated circuit formed thereon comprising at least one wide band gap transistor. | 12-23-2010 |
20110012425 | POWER MODULE LAYOUT FOR AUTOMOTIVE POWER CONVERTERS - An automotive power converter is provided. The automotive power converter includes a substrate, first and second electronic devices on the substrate, at least one conductive member coupled to the substrate and having a first device portion electrically coupled to the first electronic device and a second device portion electrically coupled to the second electronic device, and first and second terminals electrically coupled to the at least one conductive member. When a power supply is coupled to the first and second terminals, current flows from the first terminal to the first device portion substantially in a first direction and from the second terminal to the second device portion substantially in a second direction. The first direction has a first component and the second direction has a second component opposing the first component. | 01-20-2011 |
20110088957 | AXIALLY OFFSET MOTOR - A vehicle is provided. The vehicle comprises an axle having a longitudinal dimension along a first axis, the axle coupled to at least one wheel, and a motor coupled to the axle and adapted to turn the axle, the motor adapted to rotate around a second axis, wherein the motor is oriented such that the first axis is substantially perpendicular to the second axis. | 04-21-2011 |
20110095163 | DAMPING MECHANISMS AND MOTOR ASSEMBLIES - Damping mechanisms and motor assemblies are provided. In an embodiment, by way of example only, a damping mechanism includes an end cap, a bearing retainer plate, a bearing damper ring, a bearing assembly, and first and second lateral dampers. The bearing damper ring is disposed in an annular cavity inwardly from an inner diameter surface of the end cap and has a radially inwardly-extending flange. The bearing assembly is disposed in the annular cavity radially inwardly relative to the bearing damper ring. The first lateral damper is disposed between a radially inwardly-extending wall of the end cap and the bearing damper ring. The second lateral damper is disposed between the bearing damper ring and the bearing retainer plate. | 04-28-2011 |
20110141690 | POWER ELECTRONICS SUBSTRATE FOR DIRECT SUBSTRATE COOLING - Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface. | 06-16-2011 |
20110180855 | NON-DIRECT BOND COPPER ISOLATED LATERAL WIDE BAND GAP SEMICONDUCTOR DEVICE - Non-direct bond copper isolated lateral wide band gap semiconductor devices are provided. One semiconductor device includes a heat sink, a buffer layer directly overlying the heat sink, and an epitaxial layer formed of a group-III nitride overlying the buffer layer. Another semiconductor device includes a heat sink, a substrate directly overlying the heat sink, a buffer layer directly overlying the substrate, and an epitaxial layer formed of a group-III nitride overlying the buffer layer. Being formed of a group-III nitride enables the various epitaxial layers to be electrically isolated from their respective heat sinks. | 07-28-2011 |
20130279119 | ELECTRONIC ASSEMBLIES AND METHODS OF FABRICATING ELECTRONIC ASSEMBLIES - Electronic assemblies and methods of fabricating electronic assemblies are provided herein. The electronic assembly includes a heat sink, a metal layer, and an electrical insulator layer. The metal layer defines at least a portion of an electrical circuit. The electrical insulator layer is disposed between the heat sink and the metal layer and is directly bonded to the heat sink. | 10-24-2013 |