Patent application number | Description | Published |
20090161012 | Dynamic multilayer video processing method - In a dynamic multilayer video processing method applied to a signal receiving apparatus, the signal receiving apparatus is connected to a display device. To display a screen on the display device, the method transmits a request signal to a system control end connected to the signal receiving apparatus for receiving a video signal and a graphic/text data, and processes and divides the video signal and the graphic/text data into a video image layer and a graphic/text data image layer, and then displays a dynamic multilayer menu on the display device for users to select the required displayed image, and finally displays an image layer specified by a select instruction on the display device according to at least one select instruction received by the signal receiving apparatus, so that the contents of the TV video, graphic/text data or OSD information on the display panel can be processed, displayed or modified; | 06-25-2009 |
20090161909 | Method of dynamically showing a water mark - A method of dynamically showing a water mark is applied in an audio/video transmitter. The audio/video transmitter includes a plurality of display contents such as a playback area name, a playback date, a playback time and an identification mark. The audio/video transmitter continues obtaining a plurality of frames from an audio/video source such as an audio/video server or an audio/video database and temporarily stores the frames in a buffer. The audio/video transmitter also produces a water mark from at least one display content according to a plurality of display conditions such as display coordinates, appearance, time and frequency, and composes the water mark with at least one frame stored in the buffer to form at least one display screen, and shows the display screen on an output unit, such that the water mark on the display screen cannot be changed or overwritten, and viewers can identify the water mark easily. | 06-25-2009 |
20090165063 | Method for centrally distributing screensaver video to protect display devices - The present invention is to provide a method for centrally distributing screensaver video to protect display devices, which is implemented to a central VOD system comprising a remote video server, a plurality of signal transmission devices, and display devices each connected to a signal transmission device. The remote video server has a plurality of ordinary video data and at least a screensaver video data therein; each signal transmission device may receive a screensaver video data and at least one ordinary video data, and then transmit the screensaver video data and the ordinary video data to the display device connected thereto. The signal transmission device outputs the screensaver data on the display device when not receiving any control signal within a predetermined period of time, and does not resume the original ordinary video data on the display device unless the signal transmission device receives the control signal again. | 06-25-2009 |
Patent application number | Description | Published |
20110254152 | CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF - An IC chip and an IC chip manufacturing method thereof are provided. The IC chip has a chip body and at least one bump. The chip body has at least one conducting area on its surface. The bump is formed on the conducting area of the chip body. The bump includes a plurality of protrusions and at least one conducting material. The protrusions protrude out of the conducting area and are spaced apart from each other. The conducting material covers the protrusions and electrically connects the conducting area. The method includes: (A) providing a chip body having a conducting area on its surface; (B) forming a plurality of protrusions on the chip body, wherein the protrusions protrude out of the conducting area and are spaced apart from each other; and (C) forming at least one conducting material, wherein the conducting material covers the protrusions and electrically connects the conducting area. | 10-20-2011 |
20110254153 | DIE STRUCTURE AND DIE CONNECTING METHOD - A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block. | 10-20-2011 |
20120003817 | INTEGRATED CIRCUIT WAFER DICING METHOD - An integrated circuit wafer dicing method is provided. The method includes forming a plurality of integrated circuits and a plurality of test-keys on a wafer substrate, wherein the plurality of test-keys are disposed between the adjacent integrated circuits; forming a patterned protective film on the wafer to cover the plurality of integrated circuits and expose the plurality of test-keys; etching the plurality of test-keys by using the patterned protective film as a mask; and dicing an area between the plurality of integrated circuits to form a plurality of discrete integrated circuit dies. | 01-05-2012 |
20120018880 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure and a manufacture method thereof are disclosed. The semiconductor structure includes a semiconductor wafer having a plurality of semiconductor device dies, wherein each of the semiconductor device dies includes a die body, a metal wiring layer, a bump, and a metal layer. The metal wiring layer is formed on the die body while the bump is formed on the metal wiring layer during the semiconductor front-end-of-line (FEOL) process and protrudes from the die body. The metal layer is disposed on one side of the bump opposite to the metal wiring layer, wherein the activity of the metal layer is smaller than the activity of the bump. In this way, the semiconductor structure of the present invention is easy to be manufactured and the manufacture cost is also reduced. | 01-26-2012 |
20130249086 | CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF - A chip structure, a chip bonding structure, and manufacturing methods thereof are provided. The chip structure includes a chip, a plurality of bumps, and an insulation layer. The bumps are disposed on the chip. Each bump has a first bump portion and a second bump portion connected to each other, wherein the first bump portion and the second bump portion have different activities. The bumps are subjected to chemical reaction to form an insulation layer on the surface of one of the first bump portion and the second bump portion which has higher activity, so as to avoid short-circuit between the adjacent bumps. | 09-26-2013 |