Tseng, Taichung
Cheng-Hui Tseng, Taichung TW
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20120067190 | BEVELED-EDGE MAKER - A beveled-edge maker ( | 03-22-2012 |
Chih-Hung Tseng, Taichung TW
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20090255739 | Power wheelchair - A power wheelchair includes a base frame and a seat frame. The base frame includes front and rear frame members, a pair of front wheels connected rotatably to the front frame member, a pair of rear wheels connected rotatably to the rear frame member, and a pair of mid-wheels connected rotatably to the front frame member and disposed between the front and rear wheels. The seat frame is connected to the rear frame member. The rear frame member is connected pivotally to the front frame member, and extends above the front frame member. | 10-15-2009 |
Ching-Hsing Tseng, Taichung TW
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20090288522 | SOCKET AND A METHOD FOR MAKING THE SAME - A socket includes a tubular metallic body, a corrosion-resistant layer unit, a pattern unit, and a corrosion-resistant protection layer unit. The tubular metallic body has an outer peripheral surface, which includes a first peripheral portion and a second peripheral portion. The second peripheral portion has a non-patterned region and a patterned region. The non-patterned region exhibits a body color. The corrosion-resistant layer unit is provided on the first peripheral portion. The pattern unit is provided on the patterned region of the second peripheral portion. The corrosion-resistant protection layer unit is provided on at least the pattern unit. The pattern unit is imparted with an anti-corrosion property and a color property distinguishable from the body color exhibited by the non-patterned region. | 11-26-2009 |
Chin-Jui Tseng, Taichung TW
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20110319485 | Composition Having Anti-Helicobacter Pylori Activity And Its Application To Inhibit Helicobacter Pylori - The present invention provides a composition having anti- | 12-29-2011 |
20130189296 | COMPOSITION FOR USE IN INHIBITING OR KILLING Phrphyromonas gingivalis AND USE IN APPLICATIONS FOR ALLEVIATING OR TREATING PERIDONTAL DISEASE AND RELATED DISEASES - A composition for use in inhibiting or killing | 07-25-2013 |
Chun-Hao Tseng, Taichung TW
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20110024718 | Nanowire Synthesis - A noble metal nanoparticle can be grown on a semiconductor substrate by contacting a predetermined region of the substrate with a solution including noble metal ions. The predetermined region of the semiconductor substrate can be exposed by applying a polymeric layer over the substrate selectively removing a portion of the polymeric layer. The nanoparticles can be prepared in a predetermined pattern. Nanowires having a predetermined diameter and a predetermined position can be grown from the nanoparticles. | 02-03-2011 |
20110024723 | Nanoparticle synthesis - A noble metal nanoparticle can be grown on a semiconductor substrate by contacting a predetermined region of the substrate with a solution including noble metal ions. The predetermined region of the semiconductor substrate can be exposed by applying a polymeric layer over the substrate selectively removing a portion of the polymeric layer. The nanoparticles can be prepared in a predetermined pattern. The nanoparticle can be formed with a barrier separating it from another nanoparticle on the substrate; for example, nanoparticle can be located in a pit etched in the substrate. The size and location of the nanoparticle can be stable at elevated temperatures. | 02-03-2011 |
20130140524 | Nanoparticle Synthesis - A noble metal nanoparticle can be grown on a semiconductor substrate by contacting a predetermined region of the substrate with a solution including noble metal ions. The predetermined region of the semiconductor substrate can be exposed by applying a polymeric layer over the substrate selectively removing a portion of the polymeric layer. The nanoparticles can be prepared in a predetermined pattern. The nanoparticle can be formed with a barrier separating it from another nanoparticle on the substrate; for example, nanoparticle can be located in a pit etched in the substrate. The size and location of the nanoparticle can be stable at elevated temperatures. | 06-06-2013 |
De-Sheng Tseng, Taichung TW
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20090161000 | Auto-Focusing Module - An auto-focusing module comprises a lens, an actuator and an external focusing assembly. The lens is a single-focus optical system and assembled in the actuator. The actuator includes an electric focusing element and conductive pins and is hollow in the direction along the optical axis to accommodate the lens therein. The actuator is exteriorly provided with protruding blocks. The external focusing assembly includes a focusing base and a conductive element. The focusing base is provided with inclined surfaces to engage the external protruding blocks of the actuator. The conductive element is electrically connected with the conductive pins of the actuator. By such arrangements, the actuator can drive the lens to move in the direction of the optical axis to realize automatic focusing. | 06-25-2009 |
Gin-Feng Tseng, Taichung TW
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20130303338 | TREADMILL - A treadmill includes a frame, two rollers, and an endless belt. The frame is placed on a ground and has a left plate and a right plate. The rollers have two opposite ends pivoted between the left plate and the right plate, and the endless belt is wound around the rollers. The left plate and the right plate are provided with a protective layer a top side thereof respectively. The protective layers may prevent unwanted injuries once if the user falls while using the treadmill. | 11-14-2013 |
Hsiang-Jung Tseng, Taichung TW
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20150181902 | Aging Delaying Material for Fruits and Vegetables and Producing Method Thereof - A producing method of an aging delaying material for fruits or vegetables having steps of: adding and blending a silicon material, the silicon material has porous structures or layer structures; gradually adding an ethylene reducing material and water or solvent in the silicon material during blending; and gradually removing the water or the solvent during blending until the water or the solvent being partially removed from the silicon material and the ethylene reducing material to form a dry mixing powder which is able to postpone fruits or vegetables become over mature. | 07-02-2015 |
Hsien-Chun Tseng, Taichung TW
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20090076050 | SYNERGISTIC TUMOR-KILLING EFFECT OF RADIATION AND BERBERINE COMBINED TREATMENT IN LUNG CANCER - A method for treating a subject suffering cancer, comprising administering an effective amount of berberine or its acid or ester derivates to the subject in need of such treatment, and radiating the cancer of the subject. | 03-19-2009 |
Kai-Chung Tseng, Taichung TW
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20090019972 | Guiding device for use in a rotatably interchangeable driver - A guiding device for use in a rotatably interchangeable driver comprises a driver body including a compartment mounted and a guide member for communicating therewith secured at the rear end thereof; a rotatable cartridge pivotally disposed in the compartment and having a plurality of grooves formed therein; a grip mounted at the rear end of the driver body and including a shaft having a magnetic element thereon affixed at the end portion thereof, the shaft may insert into the guide member and one of the grooves so as to push a bit to move out of the groove; a ratchet device secured at the front end of the driver body and including a tubular member and a rotatory collar for the cooperation with a ratchet seat, the tubular member including a polygonal bore formed at the front end thereof and a circular segment provided at the rear end thereof for the communication with the polygonal bore and for receiving the bit therein. | 01-22-2009 |
Ming-Kuo Tseng, Taichung TW
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20130303338 | TREADMILL - A treadmill includes a frame, two rollers, and an endless belt. The frame is placed on a ground and has a left plate and a right plate. The rollers have two opposite ends pivoted between the left plate and the right plate, and the endless belt is wound around the rollers. The left plate and the right plate are provided with a protective layer a top side thereof respectively. The protective layers may prevent unwanted injuries once if the user falls while using the treadmill. | 11-14-2013 |
Nico Tseng, Taichung TW
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20080216355 | Lightweight and Flexible Article of Footwear - An article of footwear with an outer member including slots that increase flexibility is disclosed. The outer member also includes an inner plate including a set of protective strips. The inner plate is disposed along an inner surface of the outer member so that the protective strips are aligned with and cover the slots in the outer member. | 09-11-2008 |
20100313447 | Lightweight And Flexible Article Of Footwear - An article of footwear with an outer member including slots that increase flexibility is disclosed. The outer member also includes an inner plate including a set of protective strips. The inner plate is disposed along an inner surface of the outer member so that the protective strips are aligned with and cover the slots in the outer member. | 12-16-2010 |
20130055596 | Article of Footwear with Support Members and Connecting Members - An article of footwear includes an upper and a midsole positioned beneath the upper. The midsole includes an upper portion formed of a first material and a lower portion formed of a second material and positioned beneath the upper portion. The lower portion includes a plurality of support members spaced from adjacent support members. A plurality of connecting members extend between and are connected to adjacent support members, with the connecting members having a height that is less than a height of the support members to which the connecting members are connected, and an upper surface that is substantially flush with an upper surface of the support members to which the connecting members are connected. | 03-07-2013 |
20130333245 | Lightweight And Flexible Article Of Footwear - An article of footwear with an outer member including slots that increase flexibility is disclosed. The outer member also includes an inner plate including a set of protective strips. The inner plate is disposed along an inner surface of the outer member so that the protective strips are aligned with and cover the slots in the outer member. | 12-19-2013 |
Po-Hao Tseng, Taichung TW
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20150275383 | SYSTEMS AND METHODS FOR FORMING NANOWIRES USING ANODIC OXIDATION - Structures, devices and methods are provided for forming nanowires on a substrate. A first protruding structure is formed on a substrate. The first protruding structure is placed in an electrolytic solution. Anodic oxidation is performed using the substrate as part of an anode electrode. One or more nanowires are formed in the protruding structure. The nanowires are surrounded by a first dielectric material formed during the anodic oxidation. | 10-01-2015 |
Shin-Chin Tseng, Taichung TW
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20110316450 | BACKLIGHT DEVICE WITH ZONE CONTROL - A backlight unit usable in a liquid crystal display. In one embodiment, the backlight unit includes a substrate having an edge zone and a central zone surrounded by the edge zone, a first plurality of light emitting elements positioned in the central zone of the substrate, a second plurality of light emitting elements positioned in the edge zone of the substrate, and an electronic controlling means for controlling the light emitted from the first plurality of light emitting elements and the second plurality of light emitting elements such that in operation, the output power per unit area by the second plurality of light emitting elements in the edge zone is less than that by the first plurality of light emitting elements in the central zone. | 12-29-2011 |
Te Sheng Tseng, Taichung TW
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20110052164 | PHOTOGRAPHING MODULE - This invention provides a photographing module at least including: an electric drive assembly comprising a movable member, a holder, a magnetic circuit system and an elastic member, wherein the magnetic circuit system comprises at least three magnets and at least three coils so as to drive the movable member to perform a linear movement with respect to the optical axis and an angle of inclination with respect to at least an axis, and a magnetic pole direction of each magnet is perpendicular to the optical axis, an axis with respect to the coil winding axis of each coil is perpendicular to the optical axis; a photo sensor positioned on an image side of the photographing module and connected to the holder of the electric drive assembly; and a vibration sensor at a proper position of the photographing module capable of detecting directions and magnitude of a vibration. | 03-03-2011 |
20120236293 | APPARATUS FOR DETECTING POSITION AND DEPTH AND A METHOD THEREOF - The present invention provides an apparatus for detecting the position and depth of a Device Under Test (DUT) having a surface and a method thereof. The apparatus comprises an electrically-controlled swing element whose swing angle is controlled by an electrically-driven actuator, a light source whose light beam is redirected to the surface by the electrically-controlled swing element to form a light point, an optical system configured to receive the projection information of the light point, a storage unit configured to store the default information of the light point projected onto a default plane (DP) and a computation unit for calculating the depth information of the DUT according to the projection information and the default information. | 09-20-2012 |
Tien-Tsai Tseng, Taichung TW
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20140127064 | Valve Assembly for a Pump - A pump includes a bottle, an air-pumping device, a cover, a valve assembly and a buoyant. The air-pumping device is operable to pump air out of the bottle and therefore pump liquid into the bottle. The cover includes an opening and a channel. The bottle is in communication with the exterior thereof via the opening and in communication with the air-pumping device via the channel when the cover is attached to the bottle and the air-pumping device. The valve assembly is movable in the bottle between a first position for releasing the channel as the pump is in an upright position and a second position for blocking the channel as the pump is in a tilted position. The buoyant floats on the liquid in the bottle and moves the valve assembly into the second position as the bottle is almost full of the liquid in the upright position. | 05-08-2014 |
Wei-Ming Tseng, Taichung TW
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20140063474 | Electronic Device - An electronic device includes a lens assembly, a lens focusing rod, a power switch and a lens protective cover. When the lens protective cover is located in the first position, the lens assembly is shielded by the lens protective cover, the power switch is turned off, and the lens protective cover is separated from the lens focusing rod. When the lens protective cover is located in the second position, the power switch is turned on, and the lens protective cover is contacted with the lens focusing rod. When the lens protective cover is moved between the second position and the third position, the power switch is turned on, and the lens assembly is driven by the lens protective cover through the lens focusing rod for focusing operation. | 03-06-2014 |
Wen-Tsung Tseng, Taichung TW
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20080213942 | Method for fabricating semiconductor device and carrier applied therein - This invention provides a method for fabricating a semiconductor device and a carrier applied therein. The method includes the steps of: disposing a chip-mounted substrate in an opening of a carrier; forming at least a storage aperture and at least an inspection aperture in the carrier; infusing an adhesive into the storage aperture to fill a gap between the substrate and carrier with the adhesive by capillarity; determining whether the inspection aperture is filled with the adhesive to ascertain whether the gap is completely filled with the adhesive; in response to a positive result, performing a molding process to form a molding compound for encapsulating the chip; and performing implantation of solder ball and a singulation process to form a semiconductor device with desirable dimensions. The inspection aperture is inspected with a naked eye to determine whether the gap is completely filled with the adhesive, thereby reducing inspection costs and increasing yields of products with no additional packaging costs. | 09-04-2008 |
20080258294 | Heat-dissipating semiconductor package structure and method for manufacturing the same - A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking. | 10-23-2008 |
20090288866 | ELECTRONIC CARRIER BOARD - An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening. | 11-26-2009 |
20110287588 | METHOD FOR MANUFACTURING HEAT-DISSIPATING SEMICONDUCTOR PACKAGE STRUCTURE - A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking. | 11-24-2011 |
20140127838 | METHOD OF TESTING A SEMICONDUCTOR PACKAGE - A method of testing a semiconductor package is provided, including: disposing at least an interposer on a top surface of an adhesive layer, the interposer having a first surface and a second surface opposite to the first surface, a plurality of conductive elements disposed between the second surface of the interposer and the adhesive layer; disposing at least a semiconductor chip on the first surface of the interposer, and performing an electrical test on the semiconductor chip via the conductive elements, wherein if there are a plurality of semiconductor chips that are disposed on the first surface of the interposer, the step of disposing the semiconductor chip and performing the electrical test on the semiconductor chip is iterated; and removing the adhesive layer. By using the method, the fabrication cost and equipment cost of the semiconductor package are reduced, and product yield is increased. | 05-08-2014 |
20140179067 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE - A semiconductor package and a fabrication method thereof are disclosed. The fabrication method includes the steps of providing a semiconductor chip having an active surface and a non-active surface opposing to the active surface, roughening a peripheral portion of the non-active surface so as to divide the non-active surface into the peripheral portion formed with a roughened structure and a non-roughened central portion, mounting the semiconductor chip on a chip carrier via a plurality of solder bumps formed on the active surface, forming an encapsulant on the chip carrier to encapsulate the semiconductor chip. The roughened structure formed on the peripheral portion of the non-active surface of the semiconductor chip can reinforce the bonding between the semiconductor chip and the encapsulant, and the non-roughened central portion of the non-active surface of the semiconductor chip can maintain the structural strength of the semiconductor chip. | 06-26-2014 |
20150035163 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second of the carrier on a sidewall of the groove intact for the second portion to function as a supporting part. The present invention does not require formation of a silicon interposer, therefore the overall cost of the final product is much reduced. | 02-05-2015 |
20150035164 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced. | 02-05-2015 |
20150069628 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package is provided, including a semiconductor substrate having a plurality of conductive vias, a buffer layer formed on the semiconductor substrate, a plurality of conductive pads formed on end surfaces of the conductive vias and covering the buffer layer. During a reflow process, the buffer layer greatly reduces the thermal stress, thereby eliminating the occurance of cracking at the interface of conductive pads. A method of fabricating such a semiconductor package is also provided. | 03-12-2015 |
Yao-Ching Tseng, Taichung TW
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20120135341 | METHOD FOR DOUBLE PATTERNING LITHOGRAPHY AND PHOTOMASK LAYOUT - A method for double patterning lithography which is applied to a semiconductor substrate to form a plurality of trenches, includes a pattern formation process. In the pattern formation process, a plurality of predetermined patterns corresponding to the trenches are formed by using a graphic data system. A first pattern file and second pattern file are respectively formed. The first pattern file and the second pattern file respectively include a plurality of first patterns and a plurality of second patterns. The first patterns and the second patterns are intersected with each other to define a plurality of overlapped regions corresponding to the predetermined patterns. At least one of the first pattern file and the second file includes a plurality of dummy patterns therebeside. A photomask layout for double patterning lithography is also provided. | 05-31-2012 |
Yi-Chun Tseng, Taichung TW
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20080309172 | Module electric tool - A module electric tool comprises a lower cover including receiving compartments and a receiving cavity formed therein, an upper cover engaged with the lower cover, an gear box module received in the receiving compartment and including a rotary stem disposed at the front end thereof and an input sleeve mounted at the rear end thereof; an motor module received in the receiving compartment and including a driving shaft affixed at the front end thereof and electrical contacts formed on the rear end surface thereof, an electrical switch module received in the receiving compartment and including electrical contacts fixed at the front and rear ends thereof, respectively, and a press button attached at the peripheral side thereof, a battery module fitted in the receiving cavity and including electrical contacts provided at the front end thereof for couplingly contacting with the electrical contacts of the electrical switch module, thus obtaining an assembled convenience and lowering the production cost. | 12-18-2008 |
20090044668 | Torque device for use in tools - A torque device for use in tools comprises a tubular member; a bit receiver axially received at the front end of the tubular member and its front end may couple with tools; a shank inserted at the rear end of the tubular member and including a resilient element fitted thereon, and including a receiving chamber formed at the rear end thereof for receiving a driving tool, and a selector mechanism defined between the shank and the bit receiver; a fitting sleeve fitted on the shank for biasing against the resilient element and including inner threads arranged on the inner wall thereof, between the fitting sleeve and the tubular member being provided with a guiding mechanism; an adjusting member fitted at the rear end of the shank including outer threads for screwing with the inner threads of the fitting sleeve, and between the adjusting member and the tubular member being fixed a confining mechanism. | 02-19-2009 |
20090078165 | Multi-function worktable - A multi-function worktable comprises a bottom plate including two cylindrical members disposed at two sides thereof and having through grooves formed therein, and four leg assemblies affixed to the front and rear ends of the two cylindrical members individually for extension and extraction, an overturning mechanism fixed between the two cylindrical members for using the top plate in different modes, wherein the overturning mechanism includes two opposite guide slots formed in the two cylindrical members, and the top plate includes two rollers mounted on two sides thereof where correspond to one ends of the guide slots respectively, such that as moving the top plate upward, the two rollers may rollingly move frontward and backward along the two guide slots so as to change the top plate in different use modes. | 03-26-2009 |
20090078919 | Support device - A support device comprises a base including a receiving portion disposed on the top of one side thereof for receiving a post which allows to hold a heavy object, a stopping mechanism defined between the post and the base and including teeth arranged on one side of the post, the base also including a rotatable engaging member affixed thereon for correspondingly engaging with the teeth, wherein the base further includes a pedal fitted in another side thereof so as to move vertically. Besides, between the pedal and the post is defined with a transmitting mechanism including a rotatable wheel pivotally disposed on the base and having a chain, one end of which is coupled to the bottom of the post, and another end of which is connected to the pedal, mounted thereon, such that while the pedal moves vertically, the post is urged to move vertically as well, thereby obtaining a quick and safe operation. | 03-26-2009 |