Patent application number | Description | Published |
20090160038 | Semiconductor package with leads on a chip having multi-row of bonding pads - A LOC leadframe-based semiconductor package includes a chip with multiple rows of bonding pads. At least a bus bar is attached to the chip and is disposed between a first row of bonding pads and the fingers of the leads. A plurality of bonding wires electrically connect the first row of bonding pads to the fingers of the leads. The portion of the bus bar attached to the active surface of the chip includes a bent section bent away from the fingers. A long bonding wire electrically connects one of a second row of bonding pads to one of the fingers of the leads by overpassing the bent section. Therefore, the distance between the long bonding wire and the bus bar is increased to avoid electrical short between the long bonding wire and the bus bar and to enhance the quality of electrical connections of the LOC semiconductor package. | 06-25-2009 |
20090283878 | LEAD-ON-CHIP SEMICONDUCTOR PACKAGE AND LEADFRAME FOR THE PACKAGE - A LOC semiconductor package with the leadframe for the package is revealed. The LOC semiconductor package primarily comprises a plurality of leadframe's leads, at least a tie bar, a chip, and an encapsulant encapsulating the components mentioned above. Each lead has a bonding finger. The tie bar has a dummy finger where the dummy finger is linearly disposed at one side of the disposition area of the bonding fingers. The chip has an active surface with the bonding fingers. When the dummy finger and the bonding fingers are disposed above the active surface by a die-attaching layer, the dummy finger is adjacent to one edge of the active surface. The bonding fingers are electrically connected with the bonding pads. The dummy finger will bear the concentrated stresses to avoid the bonding fingers on the active surface to delamination or break due to external stresses and to avoid the interference to the layout of the leads. | 11-19-2009 |
20090302443 | LEADFRAME-BASED SEMICONDUCTOR PACKAGE HAVING ARCHED BEND IN A SUPPORTING BAR AND LEADFRAME FOR THE PACKAGE - A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die- bonding plane under the chip is desirably prevented. | 12-10-2009 |
20100127362 | SEMICONDUCTOR PACKAGE HAVING ISOLATED INNER LEAD - A semiconductor package with isolated inner lead(s) is revealed. A chip is disposed on a leadframe segment and encapsulated by an encapsulant. The leadframe segment includes a plurality of leads, an isolated lead, and an external lead where each lead has an internal portion and an external portion. The isolated inner lead is completely formed inside the encapsulant and the external lead is partially formed inside and extended outside the encapsulant. At least one of the internal portions of the leads is located between the isolated inner lead and the external lead. Two fingers are formed at two opposing ends of the isolated inner lead without covering by the chip. One of the fingers imitates a plurality of fingers of the leads to arrange along a first side of the chip. The other finger of the isolated inner lead and a finger of the external lead are arranged along a second side of the chip. A jumping wire electrically connecting the isolated inner lead and the external lead is adjacent to the second side to achieve the redistribution of pin assignments without affecting wire-bonding. Especially, this package can be applied for multi-chip stacking. | 05-27-2010 |
Patent application number | Description | Published |
20120222835 | HEAT DISSIPATING DEVICE - A heat dissipating device includes a heat sink, two support arms, two securing units, four first fasteners, and four second fasteners. The two support arms are attached to the heat sink. Each of the support arms defines a groove and a first slot. Each of the securing units includes a sliding arm and a fixing arm. The sliding arm defines a receiving recess and a second slot. The fixing arm defines a third slot. The sliding arm is configured for moving the fixing arm toward or away from the heat sink to align the third slot with mounting holes of a motherboard. The first fasteners fix the two fixing arms on the circuit board. The second fasteners are engagingly received in the communicating first and second slots to fixedly attach the two sliding arms to the two support arms. | 09-06-2012 |
20120223731 | TEST BRACKET FOR CIRCUIT BOARD - A test bracket for testing a circuit board includes a base, two connection pieces, and a supporting member for supporting the circuit board. The base includes a board and two posts extending up from the board. The supporting member includes two poles and a number of ribs slidably connected between the poles. First ends of the connection pieces are respectively detachably connected to the posts of the base, and second ends of the connection pieces opposite to the first ends are respectively pivotably connected to the poles. | 09-06-2012 |
20120311384 | WAKE-UP SIGNAL TEST SYSTEM AND TEST CARD - A wake-up signal test system to test a wake-up signal output by a platform controller hub (PCH) of a motherboard includes a test card and an oscillograph. The test card includes a board with an edge connector, and a button. The button is connected between a first ground pin and a first wake-up signal pin of the edge connector. When the edge connector is inserted into a peripheral component interconnect express (PCIe) socket of the motherboard, the first ground pin is connected to a second ground pin of the PCIe socket, the first wake-up signal pin is connected to a second wake-up pin of the PCIe socket. When the button is pressed, the first wake-up signal pin is connected to the first ground pin to output a low level signal to the PCH to wake up the motherboard. The oscillograph displays a voltage state of the low level signal. | 12-06-2012 |
20130046502 | MOTHERBOARD TEST DEVICE - A test device for testing a motherboard includes a connector, a processor, and a controller. The motherboard includes a slot including a sleep unit and a wake port. The connector is inserted into the slot to make an electrical connection with the motherboard. The processor includes a first pin connected to the wake port, a second pin connected to the sleep unit, and a control port sending control signals to the first pin and the second pin. The controller includes a first control module, a second control module, and a timer. The timer is programmed with at least two time points. Wherein the first control module and the second control module respectively send signals to the control port at each time point, to control the motherboard to enter the sleep mode and wake mode by turns. | 02-21-2013 |
20130070435 | POWER CONNECTOR AND MOTHERBOARD USING THE SAME - A power connector for mounting on a circuit board is provided. The power connector includes a case and several sets of pins. A set of pins includes several pins. Each one of one set of pins includes an embedded end, a median portion, and a distal end, where the embedded end protrudes from one side of the case, the median portion is angled from the embedded end; and the distal end is angled from the media portion and fixed to the circuit board. A part of the power connector case projects outside an edge of the circuit board. | 03-21-2013 |
Patent application number | Description | Published |
20100212509 | SAFETY AND GUIDE TYPE BREWING KETTLE - A safety and guide type brewing kettle includes a kettle body, a water stopper, a screen filter, and a retention disk. The kettle body has a cove that forms a flow guide plate for guiding liquid droplets formed on the cover into the kettle body. The kettle body has a bottom forming a through bore that receives therein a plug, which forms a through hole and an engagement section. The water stopper is arranged to block the through hole for eliminating undesired leaking. The kettle body has a lower circumference forming a projecting wall that forms legs to enclose and stably hold the kettle body. The kettle body forms at least one locking section, which engages an upper side of the screen filter. The screen filter forms a grip section that facilitates assembling/disassembling and cleaning. The screen filter forms a positioning section for positioning the water stopper. | 08-26-2010 |
20110005400 | COFFEE MAKING KETTLE USING VENTURI - Provided is a coffee making kettle using Venturi, including a kettle body having a bottom forming a through opening and defining a first chamber and a second chamber. The opening has an upper circumference from which two opposite inclined surfaces extend upward. Top edges of the inclined surfaces form a circular opening. The first chamber is located above the second chamber and is greater in volume than the second chamber. The second chamber is in communication with the through opening. When a paper filter that contains an object-to-be-brewed (such as coffee powders) is positioned in the kettle body and liquid (such as hot water) is added, the liquid is filtered by the paper filter and is guided by the inclined surfaces into the second chamber, so that the brewing liquid is subjected to the effect of Venturi to induce a pressure difference and increase of flowing speed. | 01-13-2011 |
20130019754 | BREWING DEVICE WITH LEAK-PROOF STRUCTURE - A brewing device includes a receptacle, which has a bottom forming a bore. A filtering member is received in the receptacle. A flow control assembly is arranged below the receptacle and is vertically movable with respect to the receptacle. The flow control assembly includes a bar extendible through the bore. An upward movement of the flow control assembly pushes away a closure member sitting on the bore. A guidance section is formed below the bore. The flow control assembly includes a flow guide section corresponding to the guidance section. When the flow control assembly is moved upward, the guidance section and the flow guide section collectively form a water passage. A brewing liquid contained in the receptacle, when discharged through the bore, is shielded by the water passage and is confined and concentrated for smooth flow thereby eliminate the occurrence of leak, splash, and overflow of the brewing liquid. | 01-24-2013 |
20130019755 | BREWING DEVICE - The brewing device contains a container and a functional unit beneath the container conductive to the container. The functional unit contains a pressure section and an exit section. The pressure section is conductive to and is smaller than the container. The pressure section is configured with air holes for drawing outside air. The exit section is conductive to and is smaller than the exit section. As the brewed liquid (such as the coffee brewed from the coffee powder) flows through the pressure section, it undergoes a pre-determined pressure through the air holes. Additionally, the container and the functional unit jointly achieve Venturi effect so that the brewed liquid is sped up under greater pressure difference as it passes through the exit section. As such, the molecules of the brewed liquid are activated and thinned to achieve enhanced flavor. | 01-24-2013 |
20130233179 | BREWING STRUCTURE FEATURING STABILITY AND WATER CONFINEMENT - A brewing structure featuring stability and water confinement is provided, including a support frame, a container, a filter, and a movable assembly. The support frame has a retention device. The container has a positioning section and a fitting section. The positioning section and the fitting section are retained on the retention device so that a brewing operation can be carried out in a stable manner at a predetermined altitude. The container forms a bore and a guide section is formed around the bore and extends downward. The movable assembly controls water discharging through the bore or blocks the bore. The movable assembly includes a body forming a water collection hole. A joint section and a water collection section are formed around a circumference of the water collection hole. | 09-12-2013 |