Patent application number | Description | Published |
20080233331 | METHOD AND DEVICE FOR PRODUCING A NANOPATTERNED DISC - The invention relates to a method and a device according to the preambles of claims | 09-25-2008 |
20080267743 | APPARATUS FOR IMPRINTING AND/OR EMBOSSING SUBSTRATES - The invention relates to an apparatus for imprinting and/or embossing substrates ( | 10-30-2008 |
20080284999 | DEVICE FOR TRANSFERRING STRUCTURES WHICH ARE PROVIDED IN A MASK ONTO A SUBSTRATE - The invention concerns a device for transferring structures which are provided in a mask onto a substrate,
| 11-20-2008 |
20090158947 | Stamp Comprising a Nanostamping Structure, Device and Method for the Production Thereof - The invention relates to a stamp comprising a nanostructure for introducing and/or applying nanostructures into/onto components as well as a device and a method for producing said stamp. The inventive stamp is provided with a rigid support for the nanostamping structure while the nanostamping structure is joined to the support. | 06-25-2009 |
20090258583 | DEVICE AND PROCESS FOR APPLYING AND/OR DETACHING A WAFER TO/FROM A CARRIER - The invention relates to a device for applying and/or detaching a wafer to/from a carrier with
| 10-15-2009 |
20090274872 | Device and Method for Coating a Micro-and/or Nano-Structured Structural Substrate and Coated Structural Substrate - The present invention relates to a device ( | 11-05-2009 |
20090298207 | METHOD FOR BONDING WAFERS - The invention relates to a method for bonding wafers along their corresponding surfaces. | 12-03-2009 |
20110042010 | COMBINATION OF A SUBSTRATE AND A WAFER - The invention pertains to a combination of a substrate ( | 02-24-2011 |
20110045240 | COMBINATION OF A SUBSTRATE AND A WAFER - The invention pertains to a combination of a substrate ( | 02-24-2011 |
20110127785 | HANDLING DEVICE AND HANDLING METHOD FOR WAFERS - The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume. | 06-02-2011 |
20110133500 | HANDLING DEVICE AND HANDLING METHOD FOR WAFERS - The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 μm. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume. | 06-09-2011 |
20110265822 | DEVICE AND METHOD FOR LOOSENING A POLYMER LAYER FROM A SURFACE OF A SUBSTRATE - The invention relates to a device for loosening a polymer layer from a surface of a substrate. | 11-03-2011 |
20120045575 | METHOD AND DEVICE FOR PRODUCING A NANOPATTERNED DISC - A method of producing a nanopattern on an upper side and a lower side of a disc. | 02-23-2012 |
20120135143 | DEVICE AND METHOD FOR COATING A MICRO- AND/OR NANO-STRUCTURED STRUCTURAL SUBSTRATE AND COATED STRUCTURAL SUBSTRATE - The present invention relates to a device and a method for coating a microstructured and/or nanostructured structured substrate. According to the present invention, the coating is performed in a vacuum chamber. The pressure level in the vacuum chamber is elevated during or after the charging of the vacuum chamber with coating substance. | 05-31-2012 |
20120216959 | COMBINATION OF A SUBSTRATE AND A WAFER - The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer. | 08-30-2012 |
20120247640 | COMBINATION OF A SUBSTRATE AND A WAFER - The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer. | 10-04-2012 |
20130037975 | METHOD AND DEVICE FOR PRODUCING A MICROLENS - This invention relates to a method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method. Furthermore the invention relates to a device for producing a microlens as well as a microlens. | 02-14-2013 |
20130139972 | METHOD FOR STRIPPING A WAFER FROM A CARRIER - Method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means. | 06-06-2013 |
20130295746 | COMBINATION OF A SUBSTRATE AND A WAFER - The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer. | 11-07-2013 |
20130306242 | DEVICE AND METHOD FOR THE APPLICATION OF A SHEET-LIKE JOINTING MEANS ONTO A CONTACT AREA OF A WAFER - The invention concerns a device and a corresponding method for the jointing of wafers along their corresponding surfaces. | 11-21-2013 |
20130309840 | COMBINATION OF A SUBSTRATE AND A WAFER - The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer. | 11-21-2013 |
20130327485 | DEVICE FOR RELEASING AN INTERCONNECT LAYER THAT PROVIDES CONNECTION BETWEEN A CARRIER AND A WAFER - A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination. | 12-12-2013 |
20140196846 | METHOD AND DEVICE FOR BONDING TWO WAFERS - A device for bonding of two wafers on one joining surface V of the wafers. The device includes a pressure transfer means with a pressure surface D for applying a bond pressure to the two wafers on the pressure surface D, wherein the pressure surface D is smaller than the joining surface V. The invention also relates to a method for bonding of two wafers on one joining surface V of the two wafers, by pressure transfer means with a pressure surface D for action on the wafers ( | 07-17-2014 |