Margaret R.
Margaret R. Karagas, Cambridge, MA US
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20090155786 | COMPOSITIONS AND METHODS FOR DETECTING MARKERS OF CANCER - Disclosed herein are compositions and methods for detecting one or more markers indicative of cancer. In one instance the marker is one or more methylated genes, such as SFRPs. In another instance the marker is an altered protein, such as p53. | 06-18-2009 |
Margaret R. Millings, N. Augusta, SC US
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20100176065 | Process for treating waste water having low concentrations of metallic contaminants - A process for treating waste water having a low level of metallic contaminants by reducing the toxicity level of metallic contaminants to an acceptable level and subsequently discharging the treated waste water into the environment without removing the treated contaminants. | 07-15-2010 |
Margaret R. Simmons-Matthews, Richardson, TX US
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20100096738 | IC DIE HAVING TSV AND WAFER LEVEL UNDERFILL AND STACKED IC DEVICES COMPRISING A WORKPIECE SOLDER CONNECTED TO THE TSV - A method of forming integrated circuit (IC) die configured for attachment to another die or a package substrate, and stacked IC devices therefrom. At least one IC die having a top semiconductor surface and a bottom surface and at least one through substrate via (TSV) including a tip protruding beyond the bottom surface to a tip length is provided. The tip has an outer dielectric tip liner, and an electrically conductive portion within the outer dielectric tip liner. A compliant layer is applied to the bottom surface of the IC die. The dielectric tip liner is removed from a distal portion of the tip to expose an electrically conductive tip portion. A solder material is deposited on the exposed distal portion of the tip. The solder material is reflowed and coalesced to form a solder bump on the distal portion of the tip. | 04-22-2010 |
20100190294 | METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE - Various exemplary embodiments provide materials and methods for flip-chip packaging a thin TSV semiconductor die, which uses other packaging components, for example, a second die, as a packaging carrier to attach the thin TSV semiconductor die to a package substrate. Warpage and mis-alignment can be reduced or eliminated during the packaging process of the thin TSV die. | 07-29-2010 |
20130099384 | Stacked IC Devices Comprising a Workpiece Solder Connected to the TSV - A stacked integrated circuit (IC) device with at least one IC die having a top semiconductor surface and a bottom surface and at least one through substrate via (TSV) including a tip protruding beyond the bottom surface to a tip length is provided. The tip has an outer dielectric tip liner, and an electrically conductive portion within the outer dielectric tip liner. A compliant layer is applied to the bottom surface of the IC die. The dielectric tip liner is removed from a distal portion of the tip to expose an electrically conductive tip portion. A solder material is deposited on the exposed distal portion of the tip. The solder material is reflowed and coalesced to form a solder bump on the distal portion of the tip. | 04-25-2013 |
Margaret R. Skiljan, St. Louis, MO US
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20150310361 | AGGREGATION AND WORKFLOW ENGINES FOR MANAGING PROJECT INFORMATION - A system includes an aggregation engine that initiates a first interface module in response to a first request from a first user that indicates a first type of project information. The aggregation engine also receives, via the first interface module, the first type of project information and stores the first type of project information in a memory. The system additionally includes a workflow engine that initiates one or more workflows that indicate certain project information requested by an external group. The workflow engine retrieves, from the memory and based upon the initiated one or more workflows, a first subset of the first type of project information and formats the first subset of project information according to the workflow. The system also includes an export engine that transmits the formatted first subset of project information to the external group according to the initiated one or more workflows. | 10-29-2015 |
Margaret R. Stevens (nee Webber), Los Altos, CA US
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20100057046 | SYSTEMS FOR CHARACTERIZING PHYSIOLOGIC PARAMETERS AND METHODS FOR USE THEREWITH - Disclosed herein are systems and methods for continuously measuring a physiologic parameter of a patient, and can also include adjusting therapy based upon the physiologic parameter. The system can include a first probe having an elongate body, the probe configured to be inserted into a first location within a patient. At least one sensor can be operably connected to the first probe and configured to continuously provide real-time feedback information on one or more physiologic parameters at the first location within the patient, such as pH, pCO | 03-04-2010 |
Margaret R. Williams, Rowlett, TX US
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20100044385 | Spill-resistant beverage container - A spill-resistant beverage container having an inwardly projecting, annular contoured lip forming an aperture at the top of a beverage reservoir. The aperture is smaller than the diameter of the top rim of the reservoir. The contoured lip reduces spillage, especially when used with shallow containers such as a martini glass. A smaller aperture in the surface of the contoured lip enables beverage consumption, either directly by mouth or through a straw. | 02-25-2010 |