Patent application number | Description | Published |
20090218078 | VARIABLE FLOW COMPUTER COOLING SYSTEM FOR A DATA CENTER AND METHOD OF OPERATION - Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center. | 09-03-2009 |
20090234705 | VARIABLE PERFORMANCE SERVER SYSTEM AND METHOD OF OPERATION - Disclosed herein is a server system having a plurality of computer systems and a liquid cooling system. The computer systems are capable of operating in a first mode of operation at a first operating speed and a first temperature. The computer systems are further capable of operating in a second mode of operation at a second operating speed and a second temperature. The server system switches from the second mode and the first mode in response to a request for processing services rising above a first threshold. The server system further uses a cold battery to store coolant during times of low demand and releases coolant from said cold battery when the system switches to the first mode. | 09-17-2009 |
20100290188 | INTEGRATED CIRCUIT STACK - The invention relates to an integrated circuit stack ( | 11-18-2010 |
20110036538 | METHOD AND DEVICE FOR COOLING A HEAT GENERATING COMPONENT - The invention relates to a cooling arrangement comprising a heat spreader ( | 02-17-2011 |
20110205708 | DOUBLE-FACE HEAT REMOVAL OF VERTICALLY INTEGRATED CHIP-STACKS UTILIZING COMBINED SYMMETRIC SILICON CARRIER FLUID CAVITY AND MICRO-CHANNEL COLD PLATE - A plurality of heat-dissipating electronic chips are arranged in a vertical chip stack. The electronic chips have electronic components thereon. A cold plate is secured to a back side of the chip stack. A silicon carrier sandwich, defining a fluid cavity, is secured to a front side of the chip stack. An inlet manifold is configured to supply cooling fluid to the cold plate and the fluid cavity of the silicon carrier sandwich. An outlet manifold is configured to receive the cooling fluid from the cold plate and the fluid cavity of the silicon carrier sandwich. The cold plate, the silicon carrier sandwich, the inlet manifold, and the outlet manifold are configured and dimensioned to electrically isolate the cooling fluid from the electronic components. A method of operating an electronic apparatus and a method of manufacturing an electronic apparatus are also disclosed. Single-sided heat removal with double-sided electrical input-output and double-sided heat removal with double-sided electrical input-output are also disclosed. | 08-25-2011 |
20120331433 | INTEGRATED CIRCUIT STACK - The invention relates to an integrated circuit stack ( | 12-27-2012 |
20130008632 | HEAT SPREADER - A flexible, self-contained active multi-phase heat spreader apparatus for cooling electronic components, the heat spreader having fluid sealed between two plates and a pumping mechanism to actuate multi-phase flow of the fluid. Thermal energy from an electronic component in contact with the heat spreader is dissipated from a core region via the working fluid to the entire heat spreader, and then to a heat sink. Surface enhancement features located between the two plates aid transfer of thermal energy from a first metal plate into the fluid. | 01-10-2013 |
20140078672 | ELECTRONIC ASSEMBLY WITH DETACHABLE COOLANT MANIFOLD AND COOLANT-COOLED ELECTRONIC MODULE - Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module. | 03-20-2014 |
20140198452 | DISASSEMBLABLE ELECTRONIC ASSEMBLY WITH LEAK-INHIBITING COOLANT CAPILLARIES - Cooled electronic assemblies and methods of fabrication are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic component(s), and one or more coolant-carrying channel(s) integrated within the module, and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure facilitates flow of coolant to the coolant-carrying channel(s) of the electronic module, and the coolant manifold structure and electronic module include adjoining surfaces. One surface of the adjoining surfaces includes a plurality of coolant capillaries or passages. The coolant capillaries are sized to inhibit, for instance, via surface tension, leaking of coolant therefrom at the one surface with decoupling of the coolant manifold structure and electronic module along the adjoining surfaces. | 07-17-2014 |
20140238071 | ADSORPTION HEAT EXCHANGER DEVICES - Adsorption heat exchanger devices ( | 08-28-2014 |
20150176911 | METHOD AND DEVICE FOR COOLING A HEAT GENERATING COMPONENT - The invention relates to a cooling arrangement comprising a heat spreader ( | 06-25-2015 |
20150195955 | METHOD AND DEVICE FOR COOLING A HEAT GENERATING COMPONENT - The invention relates to a cooling arrangement comprising a heat spreader ( | 07-09-2015 |
Patent application number | Description | Published |
20100241278 | VARIABLE FLOW COMPUTER COOLING SYSTEM FOR A DATA CENTER AND METHOD OF OPERATION - Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center. | 09-23-2010 |
20100246117 | VARIABLE FLOW COMPUTER COOLING SYSTEM FOR A DATA CENTER AND METHOD OF OPERATION - Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center. | 09-30-2010 |
20120261819 | BRIDGING ARRANGEMENT AND METHOD FOR MANUFACTURING A BRIDGING ARRANGEMENT - A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type. | 10-18-2012 |
20140027932 | MANUFACTURING AN UNDERFILL IN A SEMICONDUCTOR CHIP PACKAGE - A method for manufacturing an underfill in a semiconductor chip stack having a cavity between a first surface and a second surface includes providing at least one access hole in one of the first or second surface; providing at least one vent hole in the one of the first or second surfaces; and applying a viscous filling material through the at least one access hole into the cavity thereby squeezing out air or gas through the at least one vent hole. | 01-30-2014 |
20140071628 | CHIP STACK STRUCTURES THAT IMPLEMENT TWO-PHASE COOLING WITH RADIAL FLOW - A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold. | 03-13-2014 |
20150155186 | BRIDGING ARRANGEMENT AND METHOD FOR MANUFACTURING A BRIDGING ARRANGEMENT - A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type. | 06-04-2015 |