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Sushumna Iruvanti
WAPPINGERS FALLS, NY US
1. 20090109628 Chip Cooling System with Convex Portion - Integrated circuit chip cooling methods and systems are disclosed 04-30-20092. 20080299707 THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES 12-04-2008
3. 20080225484 THERMAL PILLOW - Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow 09-18-2008
4. 20080220998 REVERSIBLE THERMAL THICKENING GREASE - for microelectronic packages in which the grease contains filler particles 09-11-2008