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Claudius Feger
POUGHKEEPSIE, NY US
1. 20090251698 METHOD AND SYSTEM FOR COLLECTING ALIGNMENT DATA FROM COATED CHIPS OR WAFERS 10-08-20092. 20090108472 WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN 04-30-2009
3. 20090102070 Alignment Marks on the Edge of Wafers and Methods for Same 04-23-2009
4. 20090080833 APPARATUS AND METHODS FOR REMAKEABLE CONNECTIONS TO OPTICAL WAVEGUIDES 03-26-2009
5. 20090032962 CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WITH POWDERED MATERIALS FOR CIRCUIT FORMATION 02-05-2009
6. 20080284052 VACUUM EXTRUSION METHOD OF MANUFACTURING A THERMAL PASTE 11-20-2008
7. 20080265445 Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same 10-30-2008
8. 20080231311 PHYSICALLY HIGHLY SECURE MULTI-CHIP ASSEMBLY 09-25-2008
9. 20080220998 REVERSIBLE THERMAL THICKENING GREASE - for microelectronic packages in which the grease contains filler particles 09-11-2008