Patent application number | Description | Published |
20090152547 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME INTERPOSER AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a substrate; mounting a base integrated circuit on the substrate; forming a leadframe interposer, over the base integrated circuit, by: providing a metal sheet, mounting an integrated circuit die on the metal sheet, injecting a molded package body on the integrated circuit die and the metal sheet, and forming a ball pad, a bond finger, or a combination thereof from the metal sheet that is not protected by the molded package body; coupling a circuit package on the ball pad; and forming a component package on the substrate, the base integrated circuit, and the leadframe interposer. | 06-18-2009 |
20090236754 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE - An integrated circuit package system includes: providing a module substrate having dimension predetermined for attachment adjacent a device; attaching a module die adjacent the module substrate; and applying a module molding material cantilevered from the module substrate and over the module die. | 09-24-2009 |
20110147906 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED INTERCONNECT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit with an adhesive attached thereto; connecting the integrated circuit and a plated interconnect pad; attaching an embedded interconnect to the plated interconnect pad; and forming an encapsulation, having an encapsulation first side and an encapsulation second side, around the integrated circuit, the embedded interconnect, and the plated interconnect pad with the embedded interconnect exposed from the encapsulation second side and the plated interconnect pad and the adhesive exposed from the encapsulation second side. | 06-23-2011 |
Patent application number | Description | Published |
20130200514 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other. | 08-08-2013 |
20130256186 | MAGAZINE FOR LOADING A LEAD FRAME - A strip member loading magazine, which may load strip members such as semiconductor integrated circuit lead frames, for example, may include a bottom plate, a plurality of first slot plates provided at opposite sides of the bottom plate, a top plate fixed to a top portion of the first slot plates to be parallel to the bottom plate, second slot plates disposed to face each other between the first slot plates and be able to be moved, and locking units fastening the second slot plates to at least the top or bottom plate, the second slot plates being fastened parallel to the first slot plates. | 10-03-2013 |
20150125996 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other. | 05-07-2015 |
Patent application number | Description | Published |
20100123485 | Switch Driving Circuit And Switch Driving Method - Disclosed is a switch driving circuit for controlling the switching operation of a switch. The switch driving circuit includes a driver generating a normal gate signal for controlling the switching operation of the switch, and a gate signal correction circuit comparing the normal gate signal with a gate signal applied to a gate electrode of the switch so as to correct the gate signal in accordance with the comparison. | 05-20-2010 |
20110290323 | SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME - A solar cell is discussed. The solar cell includes a substrate of a first conductivity type, the substrate having a via hole, an emitter disposed at the substrate and having a second conductivity type opposite the first conductivity type, an anti-reflection layer disposed on a first surface of the substrate and inside the via hole, a first electrode disposed on the first surface of the substrate and in the via hole, a first electrode bus bar disposed on a second surface of the substrate that is opposite the first surface and in the via hole, and a second electrode disposed on the second surface of the substrate and connected to the substrate. | 12-01-2011 |
20120042924 | SOLAR CELL MODULE - A solar cell module is discussed. The solar cell module includes a plurality of solar cells, each solar cell including a substrate and an electrode part positioned at a surface of the substrate, an interconnector electrically connecting at least one of the solar cells to another of the solar cells; and a first conductive adhesive film including a first resin and a plurality of first conductive particles dispersed in the first resin. The first conductive adhesive film is positioned between the electrode part of the at least one solar cell and the interconnector to electrically connect the electrode part of the at least one solar cell to the interconnector. A contact surface between the first conductive particles and the interconnector is an uneven surface. | 02-23-2012 |
20130167898 | BIFACIAL SOLAR CELL MODULE - A bifacial solar cell module includes a solar cell panel including a plurality of strings arranged in a row direction. Each of the plurality of strings is formed by electrically connecting a plurality of bifacial solar cells arranged adjacent to one another in a column direction using an interconnector. The bifacial solar cell module further includes a plurality of lead wires electrically connecting an interconnector of the bifacial solar cell positioned at an end of each string to a junction box. At least one of the plurality of strings includes the n bifacial solar cells, and other strings not including the n bifacial solar cells include more than n bifacial solar cells, where n is a positive integer equal to or greater than 1. | 07-04-2013 |
20140042871 | PIEZOELECTRIC DRIVING CIRCUIT AND DRIVING METHOD THEREOF - A piezoelectric driving circuit generates a first PWM output according to a result of comparison between a ramp signal and a reference sinewave and generates a second PWM according to a result of comparison between the ramp signal and an inverse reference sinewave of the reference sinewave. The switching operation of the first and third switches of the piezoelectric driving circuit are controlled according to the first PWM output and the switching operation of the second and fourth switches of the piezoelectric driving circuit are controlled according to the second PWM output during a first cycle of the reference sinewave and the inverse reference sinewave. The switching operation of the first and third switches are controlled according to the second PWM output and the switching operation of the second and fourth switches are controlled according to the first PWM output during the next second cycle. | 02-13-2014 |
20140042935 | PIEZOELECTRIC DRIVING CIRCUIT AND PIEZOELECTRIC DRIVING METHOD - A piezoelectric driving circuit and a driving method thereof are provided. The piezoelectric driving circuit drives a piezoelectric circuit by using a first driving switch connected to one end of a piezoelectric circuit, a second driving switch corresponding to the first driving switch and connected to the other end of the piezoelectric circuit, and a sensing resistor for sensing a current flowing in the piezoelectric circuit. A fire angle and a duty cycle of an upper switch are adjusted such that a peak of a sense voltage generated in the sensing resistor at a timing at which the first driving switch is turned on, in a state in which the second driving switch is turned on. | 02-13-2014 |
20140332058 | SOLAR CELL MODULE AND EDGE TAPE USABLE WITH THE SAME - Discussed is a solar cell module including a solar cell panel, and a tape shaped sealing member surrounding an edge of the solar cell panel. The sealing member contains at least one of silicone and polyolefin. | 11-13-2014 |
20140376185 | COOLING DEVICE - A cooling device according to an exemplary embodiment of the present invention includes: a chamber including at least one flexible surface; a piezoelectric element formed in the at least one flexible surface and generating a volume change in the chamber by bending the at least one flexible surface in a first direction or a second direction to generates a first directional air flow or a second directional air flow; an opening formed in the chamber and becoming a channel of the first direction air flow or the second directional air flow; and at least one connection unit connected to the outer side of the chamber and the outer side of a heat source that is provided at a distance from the chamber and connecting the chamber and the heat source. | 12-25-2014 |
20150027535 | BACK SHEET AND SOLAR CELL MODULE INCLUDING THE SAME - Discussed is a back sheet for a solar cell module. The back sheet includes a base member and a first layer formed on one surface of the base member, the first layer including a resin. A reflector is formed in at least a portion of the back sheet. | 01-29-2015 |
20150381109 | SOLAR CELL MODULE - A solar cell module includes an upper substrate, a lower substrate opposite the upper substrate, a solar cell panel positioned between the upper substrate and the lower substrate, the solar cell panel including a plurality of solar cells which are arranged in a matrix form and are connected to one another through a wiring member to form strings, a passivation layer configured to package the solar cell panel, a frame configured to surround an outer perimeter of the solar cell panel, a connection terminal configured to connect two adjacent strings in the solar cell panel, and a cover member configured to cover the connection terminal. | 12-31-2015 |