Patent application number | Description | Published |
20090144937 | SWING HINGE MODULE AND PORTABLE TERMINAL EMPLOYING THE SAME - A swing hinge module bidirectionally swinging a movable body and a portable terminal having the same are disclosed. The swing hinge module includes a rotation cam, a rotation shaft, a fixed plate, and a guide pin. The rotation cam is fixed to the movable body to be rotated with the movable body, and has stopping recesses on an outer circumference of the rotation cam to set a rotation angle of the movable body. The rotation shaft is coupled with a central area of the rotation cam, and the fixed plate is coupled to the fixed body and has a guide hole to receive the rotation shaft. The guide pin is coupled to the fixed plate and contacts the outer circumference of the rotation cam to support the rotation cam. | 06-11-2009 |
20090309767 | EXTENDIBLE KEYPAD MODULE AND MOBILE TERMINAL HAVING THE SAME - An extendible keypad module and a mobile terminal having the same are provided. The keypad module includes a plurality of key supports for mounting keys; a guide unit for housing the plurality of key supports; a driver for moving to the inside and the outside of the guide unit at one side of the guide unit; and a link for connecting the driver and the plurality of key supports, wherein gaps between the plurality of key supports are changed by movement of the driver. Thereby, when using a mobile terminal, gaps between keys can be widened and thus the keys can be more conveniently input. Further, by adjusting locations of coupling protrusions formed in a link, gaps between the keys can be adjusted. | 12-17-2009 |
20100016042 | SLIDING-TYPE PORTABLE COMMUNICATION DEVICE - A sliding-type portable communication device is provided. The sliding-type portable communication device includes a first housing, a second housing slidably engaged with the first housing, face to face, and first and second sliding cover portions at both sides of the first housing, for sliding from both sides of the first housing, while sliding the second housing, thereby widening or narrowing the first housing. | 01-21-2010 |
20100087233 | EXTENDABLE SLIDING MODULE AND MOBILE TERMINAL HAVING THE SAME - An extendable sliding module is disclosed, including a main body, a plurality of plates disposed at an upper part thereof and movable in a longitudinal direction thereof, a guide groove formed in at least one of opposite side surfaces of the main body and extending in the longitudinal direction thereof, and a hinge having one side slidably housed in the guide groove and the other side attached to the plurality of plates, and being extendable and retractable by a sliding movement between a first retracted state in which the plurality of plates are disposed to contact each other in the longitudinal direction of the main body and a second extended state in which the plurality of plates are disposed at a predetermined separation from each other. | 04-08-2010 |
Patent application number | Description | Published |
20110014826 | Lead pin for package substrate - Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate that is bonded to a package substrate by interposing a solder paste between the lead pin for the package substrate and the package substrate, the lead pin for the package substrate including: a cylindrical connection pin; and a head part that is formed on one end of the connection pin, wherein the head part includes a disk shaped flange part, and a round part that is formed on one surface of the flange part and is configured to include first and second curved surfaces having different radii of curvature, the first and second curved surfaces each having different radii of curvature selected from a range of 1:0.1 to 1:5 as compared to a diameter of the connection pin. | 01-20-2011 |
20110014827 | Lead pin for package substrate - Disclosed herein is a lead pin for a package substrate. | 01-20-2011 |
20110067899 | Lead pin for package substrate - A lead pin for a package substrate includes a coupling pin, a head portion, and a flowing prevention portion. The coupling pin is to be inserted into a hole which is formed in an external substrate. The head portion is formed at one end of the coupling pin. The flowing prevention portion is formed on the top surface of the head portion and prevents a solder paste from flowing toward the coupling pin on the top surface of the head portion when the head portion is mounted on the package substrate. | 03-24-2011 |
20110068473 | Lead pin for package substrate - There is provided a lead pin for a package substrate including: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate. | 03-24-2011 |
20110127676 | Lead pin for semiconductor package and semiconductor package - Disclosed is a lead pin for a semiconductor package. The lead pin includes a coupling pin inserted into a hole formed in an external device, a head portion disposed at one end of the coupling pin, and a step portion formed in a stepped manner between the coupling pin and the head portion, the step portion having a smaller size than the head portion. | 06-02-2011 |
20120043653 | LEAD PIN FOR PACKAGE SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE WITH THE SAME - Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an opposite side to the one surface; and a connection pin having a pin shape bonded to the other surface of the head part, wherein the head part has a concave depression part toward the package substrate. | 02-23-2012 |
20120118620 | LEAD PIN FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed herein are a lead pin for a printed circuit board and a printed circuit board using the same. The lead pin for a printed circuit board includes: a connection pin; and a pin head part formed at one end portion of the connection pin and including a protrusion, the diameter thereof being formed to be increasingly small based on a surface contacting the connection pin and the outer peripheral surface thereof being provided with a protrusion-shaped or depression-shaped band, whereby it forms a protrusion-shaped band or a depression-shaped band on the pin head part of the lead pin to increase a contacting area with the solder, thereby improving an adhesion between the lead pin and the printed circuit board. | 05-17-2012 |
20120120623 | LEAD PIN FOR PACKAGE SUBSTRATE AND PACKAGE SUBSTRATE USING THE SAME - Disclosed herein are a lead pin for a package substrate and a package substrate using the same. The lead pin for a package substrate, includes: a connection pin having a first through hole; and a pin head part provided with a groove including a second through hole formed therein and having a first head formed at one end part of the connection pin in a trapezoidal column shape, wherein the first through hole and the groove are connected to each other through the second through hole through which the upper portion and the lower portion the lead pin penetrate each other, whereby voids generated at the time of reflow can be discharged to the outside through the through hole formed in the lead pin, thereby making it possible to reduce a defect rate generated during a process of manufacturing a package substrate. | 05-17-2012 |
20140291851 | LEAD PIN FOR PACKAGE SUBSTRATE - A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate. | 10-02-2014 |
Patent application number | Description | Published |
20100151079 | TRANS FATTY ACID FREE FAT FOR MARGARINE PRODUCED BY ENZYMATIC INTERESTERIFICATION AND METHOD FOR PREPARING THE SAME - The present invention can provide margarine oil with the enzymatic interesterification reaction, in which trans fatty acid, different from the existing partially hydrogenerated oil, is not formed in the process, and it has solid fat value profile and melting point corresponding to that of partially hydrogenerated oil and contains less than 1% of trans fatty acid, less than 27% of palmitic acid, more than 99% of triglyceride, less than 1% of diglyceride and monoglyceride, less than 1% of trans fatty acid and based on total fatty acid content. Accordingly, the margarine oil of the present invention is eco-friend and has lower trans fatty acid compared to the existing partially hydrogenerated oil and is easily to use for substituting in the ratio of 1:1 because of its physical properties corresponding to that of partially hydrogenerated oil for margarine oil and is also nutritionally excellent since it has lower palmitic acid content than natural palm oil which is usually used as a substitute for the existing margarine oil such as partially hydrogenerated oil. | 06-17-2010 |
20100178386 | TRANS FATTY ACID FREE FAT FOR FRYING PRODUCED BY ENZYMATIC INTERESTERIFICATION AND METHOD FOR PREPARING THE SAME - The present invention can provide frying oil with the enzymatic interesterification reaction, in which trans fatty acid is not formed in the process different from the existing partially hydrogenerated oil and the frying oil contains less than 1% of trans fatty acid content and less than 27% of palmitic acid based on total fatty acid content and has solid fat content at temperature of 37.8° C. and melting point corresponding to that of partially hydrogenerated oil. Accordingly, the frying oil of the present invention is eco-friend and has lower trans fatty acid compared to the existing partially hydrogenerated oil and has higher triglyceride content without side reaction, and is also nutritionally excellent since it has lower palmitic acid content than natural palm oil which is usually used as a substitute for the existing frying oil such as partially hydrogenerated oil, and has taste corresponding to partially hydrogenerated oil. | 07-15-2010 |