Patent application number | Description | Published |
20090129192 | DESIGN STRUCTURE FOR LOW OVERHEAD SWITCHED HEADER POWER SAVINGS APPARATUS - A design structure embodied in a machine readable medium used in a design process includes a tri-state power gating apparatus for reducing leakage current in a memory array. The apparatus includes a first distributed header device coupled to the memory array, the first distributed header device is configured for limiting leakage current through the memory array; and a header driver operatively coupled to the first distributed header device for enabling tri-state operation of the first distributed header device, wherein tri-state operation includes sleep mode, wake mode, and retention mode. | 05-21-2009 |
20090144504 | STRUCTURE FOR IMPLEMENTING REFRESHLESS SINGLE TRANSISTOR CELL eDRAM FOR HIGH PERFORMANCE MEMORY APPLICATIONS - A design structure embodied in a machine readable medium used in a design process includes a cache structure having a cache tag array associated with a eDRAM data cache comprising a plurality of cache lines, the cache tag array having an address tag, a valid bit and an access bit corresponding to each of the plurality of cache lines; and each access bit configured to indicate whether the corresponding cache line has been accessed as a result of a read or a write operation during a defined assessment period, which is smaller than retention time of data in the DRAM data cache; wherein, for any of the cache lines not accessed as a result of a read or a write operation during the defined assessment period, the individual valid bit associated therewith is set to a logic state that indicates the data in the associated cache line is invalid. | 06-04-2009 |
20090144506 | METHOD AND SYSTEM FOR IMPLEMENTING DYNAMIC REFRESH PROTOCOLS FOR DRAM BASED CACHE - A method for implementing dynamic refresh protocols for DRAM based cache includes partitioning a DRAM cache into a refreshable portion and a non-refreshable portion, and assigning incoming individual cache lines to one of the refreshable portion and the non-refreshable portion of the cache based on a usage history of the cache lines. Cache lines corresponding to data having a usage history below a defined frequency are assigned to the refreshable portion of the cache, and cache lines corresponding to data having a usage history at or above the defined frequency are assigned to the non-refreshable portion of the cache. | 06-04-2009 |
20090144507 | APPARATUS AND METHOD FOR IMPLEMENTING REFRESHLESS SINGLE TRANSISTOR CELL eDRAM FOR HIGH PERFORMANCE MEMORY APPLICATIONS - An apparatus for implementing a refreshless, embedded dynamic random access memory (eDRAM) cache device includes a cache structure having a cache tag array associated with a DRAM data cache with a plurality of cache lines, the cache tag array having an address tag, a valid bit and an access bit corresponding to each of the plurality of cache lines; and each access bit configured to indicate whether the corresponding cache line has been accessed as a result of a read or a write operation during a defined assessment period, the defined assessment period being smaller than retention time of data in the DRAM data cache. For any of the cache lines that have not been accessed during the defined assessment period, the individual valid bit associated therewith is set to a logic state that indicates the data in the associated cache line is invalid. | 06-04-2009 |
20090154270 | FAILING ADDRESS REGISTER AND COMPARE LOGIC FOR MULTI-PASS REPAIR OF MEMORY ARRAYS - An integrated circuit having an integrated circuit and method for moving a failing address into a next available FAR by utilizing the functional compare circuitry during BIST of redundant memory elements. A method of is disclosed that includes: providing a set of FARs and an associated set of redundant elements, wherein each FAR maps to a corresponding redundant element; testing a set of elements and placing an address of each failing element into a FAR; testing each redundant element and marking a FAR as bad when a redundant element corresponding to the FAR fails; and readdressing the set of elements and placing an address of an element being readdressed in a new FAR when the address of the element being readdressed matches an address in a FAR that has been marked as bad. | 06-18-2009 |
20090158224 | DESIGN STRUCTURE INCLUDING FAILING ADDRESS REGISTER AND COMPARE LOGIC FOR MULTI-PASS REPAIR OF MEMORY ARRAYS - Disclosed is design structure including an integrated circuit having a system for moving a failing address into a new FAR by utilizing the functional compare circuitry during BIST of redundant memory elements. Disclosed is an any-for-any scheme that eliminates the tri-state address bus. The design structure allows for easy, discrete scaling with the addition of more FARs, while also allowing larger addresses with no additional control circuit overhead. | 06-18-2009 |
20090193186 | EMBEDDED DRAM HAVING MULTI-USE REFRESH CYCLES - An embedded DRAM (eDRAM) having multi-use refresh cycles is described. In one embodiment, there is a multi-level cache memory system that comprises a pending write queue configured to receive pending prefetch operations from at least one of the levels of cache. A prefetch queue is configured to receive prefetch operations for at least one of the levels of cache. A refresh controller is configured to determine addresses within each level of cache that are due for a refresh. The refresh controller is configured to assert a refresh write-in signal to write data supplied from the pending write queue specified for an address due for a refresh rather than refresh existing data. The refresh controller asserts the refresh write-in signal in response to a determination that there is pending data to supply to the address specified to have the refresh. The refresh controller is further configured to assert a refresh read-out signal to send refreshed data to the prefetch queue of a higher level of cache as a prefetch operation in response to a determination that the refreshed data is useful. | 07-30-2009 |
20090193187 | DESIGN STRUCTURE FOR AN EMBEDDED DRAM HAVING MULTI-USE REFRESH CYCLES - A design structure for an embedded DRAM (eDRAM) having multi-use refresh cycles is described. In one embodiment, there is a multi-level cache memory system that comprises a pending write queue configured to receive pending prefetch operations from at least one of the levels of cache. A prefetch queue is configured to receive prefetch operations for at least one of the levels of cache. A refresh controller is configured to determine addresses within each level of cache that are due for a refresh. The refresh controller is configured to assert a refresh write-in signal to write data supplied from the pending write queue specified for an address due for a refresh rather than refresh existing data. The refresh controller asserts the refresh write-in signal in response to a determination that there is pending data to supply to the address specified to have the refresh. The refresh controller is further configured to assert a refresh read-out signal to send refreshed data to the prefetch queue of a higher level of cache as a prefetch operation in response to a determination that the refreshed data is useful. | 07-30-2009 |
20090268510 | DYNAMIC RANDOM ACCESS MEMORY CIRCUIT, DESIGN STRUCTURE AND METHOD - Disclosed is a DRAM circuit that incorporates an improved reference cell, has half the capacitance of the memory cell, does not require a particular reference voltage, and can be formed using the same fabrication processes as the memory cell. This DRAM circuit comprises a memory cell with a single trench capacitor and a reference cell having two trench capacitors. The two reference cell trench capacitors are connected in series through a merged buried capacitor plate such that they provide half the capacitance of the memory cell trench capacitor. Additionally, the reference cell trench capacitors have essentially the same structure as the memory cell trench capacitor so that they can be formed in conjunction with the memory cell trench capacitor. Also disclosed are a design structure for the above-described memory circuit and a method for forming the above-described memory circuit. | 10-29-2009 |
20100001709 | SYSTEM TO GENERATE A REFERENCE FOR A CHARGE PUMP AND ASSOCIATED METHODS - A system to generate a reference for a charge pump may include a diode-connected transistor providing a reference voltage, and an output transistor. The system may also include a reference circuit to provide a current that is substantially temperature insensitive and the reference circuit delivers the current across the diode-connected transistor thereby enabling the reference voltage to move with processing of the diode-connected transistor. | 01-07-2010 |
20100001788 | SYSTEM TO EVALUATE CHARGE PUMP OUTPUTS AND ASSOCIATED METHODS - A system to evaluate charge pump output may include a comparator to compare a charge pump output voltage to a reference voltage to generate a comparison result. The system may also include a divider to divide down a clock signal. The system may further include a logical conjunction unit to operate on the comparison result and the divided down clock signal. | 01-07-2010 |
20100032742 | INTEGRATED CIRCUITS COMPRISING AN ACTIVE TRANSISTOR ELECTRICALLY CONNECTED TO A TRENCH CAPACITOR BY AN OVERLYING CONTACT AND METHODS OF MAKING - A method of forming an integrated circuit comprises: providing a semiconductor topography comprising an active transistor laterally adjacent to a trench capacitor formed in a semiconductor substrate, the active transistor comprising a source junction and a drain junction, wherein a barrier layer is disposed along a periphery of the trench capacitor for isolating the trench capacitor; forming an interlevel dielectric across the semiconductor topography; concurrently etching (i) a first opening through the interlevel dielectric to the drain junction of the active transistor and the trench capacitor, and (ii) a second opening through the interlevel dielectric to the source junction of the active transistor; and filling the first opening and the second opening with a conductive material to form a strap for electrically connecting the trench capacitor to the drain junction of the active transistor and to also form a contact for electrically connecting the source junction to an overlying level of the integrated circuit. | 02-11-2010 |
20100052053 | SOI BODY CONTACT USING E-DRAM TECHNOLOGY - A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a body contact disposed under the body/channel region and in the insulator layer. The body contact electrically connects with and contacts with the body/channel region of the semiconductor device and the substrate, to thereby form an ohmic contact and to eliminate floating body effects. | 03-04-2010 |
20100052100 | DEEP TRENCH ELECTROSTATIC DISCHARGE (ESD) PROTECT DIODE FOR SILICON-ON-INSULATOR (SOI) DEVICES - A semiconductor structure is disclosed. The semiconductor structure includes a bulk substrate of a first polarity type, a buried insulator layer disposed on the bulk substrate, an active semiconductor layer disposed on top of the buried insulator layer including a shallow trench isolation region and a diffusion region of the first polarity type, a band region of a second polarity type disposed directly beneath the buried insulator layer and forming a conductive path, a well region of the second polarity type disposed in the bulk substrate and in contact with the band region, a deep trench filled with a conductive material of the first polarity type disposed within the well region, and an electrostatic discharge (ESD) protect diode defined by a junction between a lower portion of the deep trench and the well region. | 03-04-2010 |
20100052108 | VERTICAL THROUGH-SILICON VIA FOR A SEMICONDUCTOR STRUCTURE - A semiconductor structure includes at least one silicon substrate having first and second planar surfaces, and at least one through silicon via filled with a conductive material and extending vertically through the first planar surface of the at least one silicon substrate to the second planar surface thereof. The through silicon via forms a vertical interconnection between a plurality of electronic circuits and an amount of dielectric insulation surrounding the through silicon via is varied based on a defined function of the through silicon via. | 03-04-2010 |
20100157698 | CAPACITIVELY ISOLATED MISMATCH COMPENSATED SENSE AMPLIFIER - According to an embodiment of the invention, a sense amplifier for, e.g., an array of DRAM data storage cells includes one or more amplifier stages connected together in series. The amplifier stages together form the sense amplifier for the DRAM array. Each amplifier stage includes an isolation capacitor to reduce to a relatively small value any mismatch between the threshold voltages of the transistors within each amplifier stage. A bitline from the DRAM array of memory cells connects to the first amplifier stage. An output from the last amplifier stage connects to a write back switch, the output of which connects to the bitline at the input of the first amplifier stage. | 06-24-2010 |
20110177659 | SOI BODY CONTACT USING E-DRAM TECHNOLOGY - A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a body contact disposed under the body/channel region and in the insulator layer. The body contact electrically connects with and contacts with the body/channel region of the semiconductor device and the substrate, to thereby form an ohmic contact and to eliminate floating body effects. | 07-21-2011 |
20110177660 | DEEP TRENCH CAPACITOR FOR SOI CMOS DEVICES FOR SOFT ERROR IMMUNITY - A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a deep trench capacitor disposed under the body/channel region of the semiconductor device. The deep trench capacitor electrically connects with and contacts the body/channel region of the semiconductor device, and is located adjacent to the gate of the semiconductor device. The semiconductor structure increases a critical charge Qcrit, thereby reducing a soft error rate (SER) of the semiconductor device. | 07-21-2011 |
20110180862 | EMBEDDED DYNAMIC RANDOM ACCESS MEMORY DEVICE AND METHOD - Embodiments of the invention provide an integrated circuit for an embedded dynamic random access memory (eDRAM), a semiconductor-on-insulator (SOI) wafer in which such an integrated circuit may be formed, and a method of forming an eDRAM in such an SOI wafer. One embodiment of the invention provides an integrated circuit for an embedded dynamic random access memory (eDRAM) comprising: a semiconductor-on-insulator (SOI) wafer including: an n-type substrate; an insulator layer atop the n-type substrate; and an active semiconductor layer atop the insulator layer; a plurality of deep trenches, each extending from a surface of the active semiconductor layer into the n-type substrate; a dielectric liner along a surface of each of the plurality of deep trenches; and an n-type conductor within each of the plurality of deep trenches, the dielectric liner separating the n-type conductor from the n-type substrate; wherein the n-type substrate, the dielectric liner, and the n-type conductor form a buried plate, a node dielectric, and a node plate, respectively, of a cell capacitor. | 07-28-2011 |
20110267916 | VDD PRE-SET OF DIRECT SENSE DRAM - A direct sense memory array architecture and method of operation includes a plurality of memory cells where a bit-line restore voltage level is optimized to reduce memory cell leakage during a first inactive period, and a bit-line preset voltage level is optimized for signal sensing during a second active period. The architecture includes a sense head having of a pair of cross coupled gated inverters. Each of the gated inverters is responsive to a first and second gate control signal which can independently gate a power supply to the inverter circuit within each gated inverter. During the second active period, a first gated inverter senses the data state on the first bit-line, and a second gated inverter performs a preset and write-back function on the first bit-line. | 11-03-2011 |
20120083091 | DEEP TRENCH ELECTROSTATIC DISCHARGE (ESD) PROTECT DIODE FOR SILICON-ON-INSULATOR (SOI) DEVICES - A semiconductor includes a bulk substrate of a first polarity type, a buried insulator layer disposed on the bulk substrate, an active semiconductor layer disposed on top of the buried insulator layer including a shallow trench isolation region and a diffusion region of the first polarity type, a band region of a second polarity type disposed directly beneath the buried insulator layer and forming a conductive path, a well region of the second polarity type disposed in the bulk substrate and in contact with the band region, a deep trench filled with a conductive material of the first polarity type disposed within the well region, and an electrostatic discharge (ESD) protect diode defined by a junction between a lower portion of the deep trench and the well region. | 04-05-2012 |
20120205732 | INTEGRATED CIRCUITS COMPRISING AN ACTIVE TRANSISTOR ELECTRICALLY CONNECTED TO A TRENCH CAPACITOR BY AN OVERLYING CONTACT - An integrated circuit includes an active transistor laterally adjacent to a trench capacitor formed in a semiconductor substrate, the active transistor comprising a source junction and a drain junction, wherein a barrier layer is disposed along a periphery of the trench capacitor for isolating the trench capacitor; a passive transistor laterally spaced from the active transistor, wherein at least a portion of the trench capacitor is interposed between the active and passive transistors; an interlevel dielectric disposed upon the active and passive transistors; and a first conductive contact extending through the interlevel dielectric to the drain junction of the active transistor and the at least a portion of the trench capacitor between the active and passive transistors, wherein the first conductive contact electrically connects the trench capacitor to the drain junction of the active transistor. | 08-16-2012 |
20130015515 | FET eDRAM TRENCH SELF-ALIGNED TO BURIED STRAPAANM Anderson; Brent A.AACI JerichoAAST VTAACO USAAGP Anderson; Brent A. Jericho VT USAANM Barth, JR.; John E.AACI WillistonAAST VTAACO USAAGP Barth, JR.; John E. Williston VT USAANM Nowak; Edward J.AACI Essex JunctionAAST VTAACO USAAGP Nowak; Edward J. Essex Junction VT USAANM Rankin; Jed H.AACI RichmondAAST VTAACO USAAGP Rankin; Jed H. Richmond VT US - A structure and method of making a field effect transistor (FET) embedded dynamic random access memory (eDRAM) cell array, which includes: a buried silicon strap extending into a buried oxide (BOX) layer of a silicon-on-insulator (SOI) substrate; a recessed trench capacitor extending down into the substrate layer of the SOI substrate; a lateral surface of a conductive top plate formed on the recessed trench capacitor that contacts a first lateral surface of the buried silicon strap; a dielectric cap disposed above the conductive top plate; a first FET formed from the silicon layer of the SOI substrate, in which a source/drain region of the first FET contacts a second lateral surface of the buried silicon strap; and a passing wordline disposed on a portion of the dielectric cap opposite to and separate from the buried silicon strap and connected to a gate of a second FET in an adjacent row of the FET eDRAM cell array. | 01-17-2013 |
20130114361 | SENSE AMPLIFIER HAVING AN ISOLATED PRE-CHARGE ARCHITECTURE, A MEMORY CIRCUIT INCORPORATING SUCH A SENSE AMPLIFIER AND ASSOCIATED METHODS - Disclosed are a sense amplifier and a memory circuit that incorporates it. The amplifier comprises cross-coupled inverters, each with a pull-down transistor and a pull-up transistor connected in series. One inverter has a voltage-controlled switch controlling the electrical connection between drain nodes of the transistors. During a read operation, the pull-up transistor drain node is pre-charged high and the pull-down transistor drain node receives an input signal. The switch is tripped, thereby making the electrical connection only when the voltage at the pull-down transistor drain node is less than the switch's trip voltage. In this case, the sense node discharges to the same level as the input signal. Otherwise, the switch prevents the electrical connection and the sense node remains high. The trip voltage depends on a reference voltage, which can be variable, thereby allowing the sensitivity of the sense amplifier to be selectively adjusted. Also disclosed are associated methods. | 05-09-2013 |
20130249052 | CREATING DEEP TRENCHES ON UNDERLYING SUBSTRATE - A semiconductor structure and method of fabricating the same are disclosed. In an embodiment, the structure includes a first substrate having a buried plate or plates in the substrate. Each buried plate includes at least one buried plate contact, and a plurality of deep trench capacitors disposed about the at least one buried plate contact. A first oxide layer is disposed over the first substrate. The deep trench capacitors and buried plate contacts in the first substrate may be accessed for use in a variety of memory and decoupling applications. | 09-26-2013 |
20130256830 | SEMICONDUCTOR-ON-OXIDE STRUCTURE AND METHOD OF FORMING - Semiconductor-on-oxide structures and related methods of forming such structures are disclosed. In one case, a method includes: forming a first dielectric layer over a substrate; forming a first conductive layer over the first dielectric layer, the first conductive layer including one of a metal or a silicide; forming a second dielectric layer over the first conductive layer; bonding a donor wafer to the second dielectric layer, the donor wafer including a donor dielectric and a semiconductor layer; cleaving the donor wafer to remove a portion of the donor semiconductor layer; forming at least one semiconductor isolation region from an unremoved portion of the donor semiconductor layer; and forming a contact to the first conductive layer through donor dielectric and the second dielectric layer. | 10-03-2013 |
20130262792 | MEMORY DEVICE SUPPORT OF DYNAMICALLY CHANGING FREQUENCY IN MEMORY SYSTEMS - An embodiment is a method includes writing a first set of memory device parameters to a first mode register in a memory device, wherein the first set of memory device parameters correspond to a first frequency, monitoring selected parameters for the memory system while the memory device operates at the first frequency and predicting a second frequency that the memory device will operate at subsequent to the first frequency, the predicting being based on the monitored selected parameters. The method further includes writing a second set of memory device parameters to second mode register in the memory device, receiving a frequency change request at a memory controller associated with the memory device, the frequency change request to operate at a new frequency and updating the first mode register with the second set of memory device parameters from the second mode register responsive to the new frequency being equal to the second frequency. | 10-03-2013 |
20130285193 | METAL-INSULATOR-METAL (MIM) CAPACITOR WITH DEEP TRENCH (DT) STRUCTURE AND METHOD IN A SILICON-ON-INSULATOR (SOI) - A structure forming a metal-insulator-metal (MIM) trench capacitor is disclosed. The structure comprises a multi-layer substrate having a metal layer and at least one dielectric layer. A trench is etched into the substrate, passing through the metal layer. The trench is lined with a metal material that is in contact with the metal layer, which comprises a first node of a capacitor. A dielectric material lines the metal material in the trench. The trench is filled with a conductor. The dielectric material that lines the metal material separates the conductor from the metal layer and the metal material lining the trench. The conductor comprises a second node of the capacitor. | 10-31-2013 |
20140084411 | SEMICONDUCTOR-ON-INSULATOR (SOI) DEEP TRENCH CAPACITOR - Aspects of the present invention relate to a semiconductor-on-insulator (SOI) deep trench capacitor. One embodiment includes a method of forming a deep trench capacitor structure. The method includes: providing a SOI structure including a first and second trench opening in a semiconductor layer of the SOI structure, forming a doped semiconductor layer covering the semiconductor layer, forming a first dielectric layer covering the doped semiconductor layer, forming a node metal layer over the first dielectric layer, forming a second dielectric layer covering the node metal layer, filling a remaining portion of each trench opening with a metal layer to form an inner node in each of the trench openings, the metal layer including a plate coupling each of the inner nodes, and forming a node connection structure to conductively connect the node metal layer in the first trench opening with the node metal layer in the second trench opening. | 03-27-2014 |
20140092728 | FAULTY CORE RECOVERY MECHANISMS FOR A THREE-DIMENSIONAL NETWORK ON A PROCESSOR ARRAY - Embodiments of the invention relate to faulty recovery mechanisms for a three-dimensional (3-D) network on a processor array. One embodiment comprises a multidimensional switch network for a processor array. The switch network comprises multiple switches for routing packets between multiple core circuits of the processor array. The switches are organized into multiple planes. The switch network further comprises a redundant plane including multiple redundant switches. Multiple data paths interconnect the switches. The redundant plane is used to facilitate full operation of the processor array in the event of one or more component failures. | 04-03-2014 |
20140095923 | FINAL FAULTY CORE RECOVERY MECHANISMS FOR A TWO-DIMENSIONAL NETWORK ON A PROCESSOR ARRAY - Embodiments of the invention relate to faulty recovery mechanisms for a two-dimensional (2-D) network on a processor array. One embodiment comprises a processor array including multiple processors core circuits, and a redundant routing system for routing packets between the core circuits. The redundant routing system comprises multiple switches, wherein each switch corresponds to one or more core circuits of the processor array. The redundant routing system further comprises multiple data paths interconnecting the switches, and a controller for selecting one or more data paths. Each selected data path is used to bypass at least one component failure of the processor array to facilitate full operation of the processor array. | 04-03-2014 |
20140191359 | SEMICONDUCTOR-ON-OXIDE STRUCTURE AND METHOD OF FORMING - Semiconductor-on-oxide structures and related methods of forming such structures are disclosed. In one case, a method includes: forming a first dielectric layer over a substrate; forming a first conductive layer over the first dielectric layer, the first conductive layer including one of a metal or a silicide; forming a second dielectric layer over the first conductive layer; bonding a donor wafer to the second dielectric layer, the donor wafer including a donor dielectric and a semiconductor layer; cleaving the donor wafer to remove a portion of the donor semiconductor layer; forming at least one semiconductor isolation region from an unremoved portion of the donor semiconductor layer; and forming a contact to the first conductive layer through donor dielectric and the second dielectric layer. | 07-10-2014 |
20140204654 | COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) DYNAMIC RANDOM ACCESS MEMORY (DRAM) CELL WITH SENSE AMPLIFIER - A complementary metal-oxide-semiconductor (CMOS) dynamic random access memory (DRAM) cell with sense amplifier is described. In one embodiment, the DRAM cell includes an n-type field-effect transistor (NFET), a p-type field-effect transistor (PFET), and a storage capacitor accessed through both the NFET and the PFET. A pair of bit lines is coupled to the DRAM cell. A sense amplifier with a single-ended read path reads data in the DRAM cell through only one of the bit lines and a data-dependent write-back path writes back data to the DRAM cell through either one of the bit lines. The bit line used by the sense amplifier to write back the data to the DRAM cell depends on the logical value of the data. | 07-24-2014 |
20140244971 | ARRAY OF PROCESSOR CORE CIRCUITS WITH REVERSIBLE TIERS - Embodiments of the invention relate to an array of processor core circuits with reversible tiers. One embodiment comprises multiple tiers of core circuits and multiple switches for routing packets between the core circuits. Each tier comprises at least one core circuit. Each switch comprises multiple router channels for routing packets in different directions relative to the switch, and at least one routing circuit configured for reversing a logical direction of at least one router channel. | 08-28-2014 |
20140293715 | SIGNAL MARGIN CENTERING FOR SINGLE-ENDED eDRAM SENSE AMPLIFIER - Apparatus and methods for signal margin centering for single-ended eDRAM sense amplifier. A plurality of DRAM cells is connected to an input side of a multiplexer by a first bitline. A single-ended sense amplifier is connected to an output side of the multiplexer by a second bitline. The single-ended sense amplifier has a switch voltage. The second bitline is precharged to a selected voltage level. The multiplexer passes a signal voltage from a selected one of the plurality of DRAM cells to the second bitline. The selected voltage level is selected such that reception of the signal voltage of a first type adjusts a voltage of the second bitline in a first direction and reception of the signal voltage of a second type adjusts the voltage of the second bitline in a second direction opposite from the first direction, centering the signal voltage around the switch voltage. | 10-02-2014 |
20140328122 | REDUCED STRESS HIGH VOLTAGE WORD LINE DRIVER - Exemplary embodiments of the present invention disclose a method and system for asserting a voltage transition from a low voltage to a high voltage with a voltage difference between the low and high voltages on a word line with a word line driver logic that is composed of thin-oxide MOS transistors, wherein the thin-oxide MOS transistors experience less than the voltage difference on the word line between any two of a source, a drain, and a gate. In a step, charging the word line from the low voltage to an intermediate voltage level. In another step, charging the word line to the high voltage from the intermediate voltage level. | 11-06-2014 |
20140344201 | PROVIDING TRANSPOSABLE ACCESS TO A SYNAPSE ARRAY USING COLUMN AGGREGATION - Embodiments of the invention relate to providing transposable access to a synapse array using column aggregation. One embodiment comprises a neural network including a plurality of electronic axons, a plurality of electronic neurons, and a crossbar for interconnecting the axons with the neurons. The crossbar comprises a plurality of electronic synapses. Each synapse interconnects an axon with a neuron. The neural network further comprises a column aggregation module for transposable access to one or more synapses of the crossbar using column aggregation. | 11-20-2014 |
20150021737 | METAL-INSULATOR-METAL (MIM) CAPACITOR WITH DEEP TRENCH (DT) STRUCTURE AND METHOD IN A SILICON-ON-INSULATOR (SOI) - A structure forming a metal-insulator-metal (MIM) trench capacitor is disclosed. The structure comprises a multi-layer substrate having a metal layer and at least one dielectric layer. A trench is etched into the substrate, passing through the metal layer. The trench is lined with a metal material that is in contact with the metal layer, which comprises a first node of a capacitor. A dielectric material lines the metal material in the trench. The trench is filled with a conductor. The dielectric material that lines the metal material separates the conductor from the metal layer and the metal material lining the trench. The conductor comprises a second node of the capacitor. | 01-22-2015 |
20150089329 | ELECTRONIC CIRCUIT FOR FITTING A VIRTUAL ADDRESS RANGE TO A PHYSICAL MEMORY CONTAINING FAULTY ADDRESS - A memory having variable size blocks of failed memory addresses is connected to a TCAM storing data values of ranges of addresses in the memory. The ranges of addresses correspond to virtual addresses that, in combination with an offset, point away from failed memory addresses. A reduction circuit connected to the TCAM produces an output for each programmed range of addresses based on a virtual address. A priority encoder, connected to the reduction circuit, selects a first range from the reduction circuit and passes the first range to a random-access memory (RAM). Responsive to the virtual address bring an address in one of the ranges of addresses, the priority encoder passes the first range containing the virtual address to the RAM, which passes a corresponding offset value to the Adder based on the first range. The Adder calculates a physical memory address directing the virtual address to a functional memory location. | 03-26-2015 |