Nguyen, NY
Chieu Minh Nguyen, Brooklyn, NY US
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20150045157 | FEATHERED PROJECTILE TOY - A feathered projectile toy including a base having a proximal end, a distal end and a longitudinal axis extending between the proximal end and the distal end, a plurality of stacked elements disposed on the base with the longitudinal axis of the base extending through openings in each of the plurality of stacked elements, and a plurality of feathers extending from the distal end of the base. | 02-12-2015 |
20150045158 | FEATHERED PROJECTILE TOY - A feathered projectile toy including a base having a proximal end portion, a distal end portion and a longitudinal axis extending between the proximal end portion and the distal end portion, the base being composed of stems of a plurality of feathers, a plurality of stacked elements disposed on the base with the longitudinal axis of the base extending through openings in each of the plurality of stacked elements, and a contact element disposed at the proximal end portion of the base that provides the feathered projectile toy with a striking surface. | 02-12-2015 |
Dieu Nguyen, Webster, NY US
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20150044606 | POROUS TONER AND PROCESS FOR MAKING THE SAME - A process includes forming a filter cake from a slurry of emulsion aggregation toner particles and washing the filter cake with an alcohol to create porous toner particles. | 02-12-2015 |
Hong Ky Nguyen, Painted Post, NY US
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20100250166 | Methods And Devices For Evaluating The Operating Characteristics Of A DBR Laser Diode - In accordance with one embodiment of the present disclosure, a method of evaluating the operating characteristics of a DBR laser diode is provided. According to the method, a diagnostic electrical current is injected into the wavelength tuning section of the DBR laser to generate amplified spontaneous emission of light in the wavelength tuning section. Light emitted from the wavelength tuning section is absorbed by the gain section and photo current generated by the light absorbed in the gain section is measured. The photo current measured in the gain section can be correlated with an evaluation of the operating characteristics of the DBR laser diode. For example, the measured photo current can be correlated with a substandard operating characteristic when it departs from a given photo current metric by more than an acceptable amount. Alternatively, the measured photo current can be correlated with a certified operating characteristic when it departs from the given photo current metric by an acceptable amount. Additional embodiments are disclosed and claimed. | 09-30-2010 |
20100260215 | Split Control Of Front And Rear DBR Grating Portions - A method is provided for controlling a DBR laser diode wherein front and rear DBR section heating elements are controlled such that the reflectivity of the rear grating portion of the DBR section is lower than the reflectivity of the front grating portion of the DBR section. In this manner, lasing mode selection is dominated by the front grating portion and the front DBR section heating element can be controlled for wavelength tuning. In addition, the rear DBR section heating element can be controlled to narrow the spectral bandwidth of the DBR reflection spectra. Additional embodiments are disclosed and claimed. | 10-14-2010 |
20110255567 | Laser Diodes Comprising QWI Output Window and Waveguide Areas and Methods of Manufacture - In accordance with one embodiment of the present disclosure, a process of manufacturing a semiconductor laser diode comprising a gain section, a QWI output window, and QWI waveguide areas is provided. The QWI waveguide areas are fabricated using quantum well intermixing and define a QWI waveguide portion in the QWI output window of the laser diode. The QWI output window is transparent to the lasing wavelength λ | 10-20-2011 |
20130114635 | Heating Elements For Multi-Wavelength DBR Laser - A multi-wavelength distributed Bragg reflector (DBR) semiconductor laser is provided where DBR heating elements are positioned over the waveguide in the DBR section and define an interleaved temperature profile that generates multiple distinct reflection peaks corresponding to distinct temperature dependent Bragg wavelengths associated with the temperature profile. Neighboring pairs of heating elements of the DBR heating elements positioned over the waveguide in the DBR section are spaced along the direction of the axis of optical propagation by a distance that is equal to or greater than the laser chip thickness b to minimize the impact of thermal crosstalk between distinct temperature regions of the interleaved temperature profile. | 05-09-2013 |
Kelvin Nguyen, Macedon, NY US
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20130183454 | METHOD FOR COATING POLYMERS ON GLASS EDGES - The present disclosure is directed to a method, called herein the “wrap-around” method, of applying polymers to glass articles having one or a plurality of shaped edges. The glass articles have a selected length, selected width and selected thickness which define a first face, a second face and one or a plurality of edges. Circular and oval articles are deemed to have a single edge. Rectangular, square, hexagonal, octagonal, and other shapes having angled corners are deemed to have a plurality of edges defined by the faces and thickness of the glass. The glass articles can be either (1) flat or planar as shown in FIG. | 07-18-2013 |
20150160376 | ANTI-GLARE GLASS ARTICLE AND DISPLAY SYSTEM - A glass article including: at least one anti-glare surface having haze, distinctness-of-image, surface roughness, and uniformity properties, as defined herein. A method of making the article having an anti-glare surface includes, for example, forming a protective film on selected portions of at least one surface of the article; contacting the at least one surface with a liquid etchant; and removing the protective film from the surface of the article to form the anti-glare surface. A display system that incorporates the glass article, as defined herein, is also disclosed. | 06-11-2015 |
20150198752 | ANTI-GLARE SURFACE TREATMENT METHOD AND ARTICLES THEREOF - A glass article including: at least one anti-glare surface having haze, distinctness-of-image, surface roughness, and uniformity properties, as defined herein. A method of making the glass article includes, for example: depositing deformable particles on at least a portion of a glass surface of the article; causing the deposited deformable particles on the surface to deform and adhere to the surface; and contacting the surface having the adhered particles with an etchant to form the anti-glare surface. A display system that incorporates the glass article, as defined herein, is also disclosed. | 07-16-2015 |
Kelvin Nguyen, Rochester, NY US
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20080206925 | Methods and apparatus to improve frit-sealed glass package - A hermetically sealed package includes: a first plate including inside and outside surfaces; a second plate including inside and outside surfaces; frit material disposed on the inside surface of the second plate; and at least one dielectric layer disposed directly or indirectly on at least one of: (i) the inside surface of the first plate at least opposite to the frit material, and (ii) the inside surface of the second plate at least directly or indirectly on the frit material, wherein the frit material forms a hermetic seal against the dielectric layer in response to heating. | 08-28-2008 |
20090218253 | Hermetically-sealed packages for electronic components having reduced unused areas - Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate ( | 09-03-2009 |
20110008593 | METHODS FOR FORMING FRITTED COVER SHEETS WITH MASKS AND GLASS PACKAGES COMPRISING THE SAME - A method for forming a fritted cover sheet for sealing a glass package includes providing a transparent substrate having a sealing surface and a backing surface and forming at least one mask on one of the sealing surface of the substrate or the backing surface of the substrate. A sealing frit may be formed on the sealing surface of the substrate such that the at least one mask is positioned adjacent a perimeter defined by the sealing frit. | 01-13-2011 |
20120225506 | HERMETICALLY-SEALED PACKAGES FOR ELECTRONIC COMPONENTS HAVING REDUCED UNUSED AREAS - Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate ( | 09-06-2012 |
Kelvin Nguyen, Corning, NY US
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20100246016 | GLASS HAVING ANTI-GLARE SURFACE AND METHOD OF MAKING - A glass article having an anti-glare surface. The anti-glare surface has a distinctness-of-reflected image of less than 95, and a haze of less than or equal to 50%. In one embodiment, the glass article further includes a smudge-resistant surface disposed on the anti-glare surface. Methods of making the glass article and anti-glare surface are also described. | 09-30-2010 |
20100304513 | METHOD FOR FORMING AN ORGANIC LIGHT EMITTING DIODE DEVICE - A method for sealing an organic light emitting diode (OLED) device is disclosed wherein the OLED device comprises a color filter. A color filter is deposited on a first glass plate or substrate and a glass-based frit is then deposited in a loop around the color filter, The deposited fit loop is then heated by electromagnetic energy to evaporate organic constituents and to sinter the fit in a pre-sintering step. An OLED device may then be assembled by positioning a second glass plate comprising an organic light emitting material deposited thereon in overlying registration with the first glass plate, with the color filer and the organic light emitting material positioned between the plates. The fit is then heated with a laser to form a hermetic seal between the first and second glass plates. | 12-02-2010 |
20110014731 | METHOD FOR SEALING A PHOTONIC DEVICE - Methods for sealing a photonic device are disclosed. The photonic device may, for example, comprise a display device, a lighting device or a photovoltaic device. The device is sealed with a glass frit that is heated with a laser from both sides of the device (through both glass substrate plates), either sequentially or simultaneously. The methods can facilitate wider seal widths, and wider overall frit wall widths for increased device strength. | 01-20-2011 |
20110062849 | GLASS AND DISPLAY HAVING ANTI-GLARE PROPERTIES - A glass article that is ion-exchangeable and has at least one roughened surface. The roughened surface has a distinctness-of-reflected image DOI of less than 90 when measured at an incidence angle of 20°. A pixelated display system that includes such a glass article is also provided. | 03-17-2011 |
20110267697 | ANTI-GLARE SURFACE AND METHOD OF MAKING - A glass article including: at least one anti-glare surface having haze, distinctness-of-image, surface roughness, and uniformity properties, as defined herein. A method of making the article having an anti-glare surface includes, for example, forming a protective film on selected portions of at least one surface of the article; contacting the at least one surface with a liquid etchant; and removing the protective film from the surface of the article to form the anti-glare surface. A display system that incorporates the glass article, as defined herein, is also disclosed. | 11-03-2011 |
20110267698 | ANTI-GLARE SURFACE TREATMENT METHOD AND ARTICLES THEREOF - A glass article including: at least one anti-glare surface having haze, distinctness-of-image, surface roughness, and uniformity properties, as defined herein. A method of making the glass article includes, for example, depositing sacrificial particles on a surface of the article; and contacting the resulting particulated surface with an etchant. A display system that incorporates the glass article, as defined herein, is also disclosed. | 11-03-2011 |
20120134024 | ANTI-GLARE SURFACE TREATMENT METHOD AND ARTICLES THEREOF - A glass article including: at least one anti-glare surface having haze, distinctness-of-image, surface roughness, and uniformity properties, as defined herein. A method of making the glass article includes, for example: depositing deformable particles on at least a portion of a glass surface of the article; causing the deposited deformable particles on the surface to deform and adhere to the surface; and contacting the surface having the adhered particles with an etchant to form the anti-glare surface. A display system that incorporates the glass article, as defined herein, is also disclosed. | 05-31-2012 |
20120218640 | GLASS HAVING ANTIGLARE SURFACE WITH LOW DISPLAY SPARKLE - A glass article having a low level of grainy appearance that can appear to have a shift in the pattern of the grains with changing viewing angle of a display, or “sparkle.” The glass article—which, in some embodiments, is a transparent glass sheet—has small-angle-scattering properties and/or distinctness-of-reflected-image (DOI), leading to improved viewability in display applications, especially under high ambient lighting conditions. In some embodiments, the antiglare surface of the glass sheet is an etched surface, with no foreign coating present on the antiglare surface. | 08-30-2012 |
20130107370 | METHOD FOR SPARKLE CONTROL AND ARTICLES THEREOF | 05-02-2013 |
Long Khac Nguyen, Rochester, NY US
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20120125162 | COMBINATION ER WRENCH - A combination ER wrench is disclosed for use in installing and tightening collet holders in connection with milling machines or machining centers. The disclosed wrench combines the function of multiple wrenches. The disclosed wrench has two open ends and two box ends that fit various collets and collet holders common in the industry, along with a box end to fit a retention knob. The open ends of the wrench have arcurate jaws and five points to contact the collet and/or collet nut. The box ends of the wrench are openings shaped to contact the collect and/or collet nut. | 05-24-2012 |
Luan Trong Nguyen, Lindley, NY US
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20150028528 | FAST FIRING METHOD FOR HIGH POROSITY CERAMICS - A method for firing a green honeycomb ceramic body including heating the green honeycomb ceramic body from room temperature to a first temperature of less than or equal to about 350° C. with at least one heating rate of greater than or equal to about 80° C./hr. The green honeycomb ceramic body may be heated from the first temperature to a second temperature of greater than or equal to about 800° C. at a heating rate of greater than or equal to about 90° C./hr. The green honeycomb ceramic body may be heated from the second temperature to a third temperature of greater than or equal to about 1000° C. The green honeycomb ceramic body may include aluminum raw materials for forming an aluminum titanate ceramic body. | 01-29-2015 |
Nguyen Quang Nguyen, New York, NY US
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20110044577 | FIBER-OPTIC EXTENSOMETER - An extensometer having a loop of a single-mode optical fiber. At least two points of the loop are attached to desired locations on a specimen. Light is transmitted through the loop and the transmitted optical power is measured by a photodetector. The deformation of the specimen causes the size and shape of the loop to change, which changes the transmitted optical power. The change in optical power is related to extension or compression using calibration curves. The sensor works on the principle of transmitted power modulation through the curved section. | 02-24-2011 |
20130240718 | METHOD FOR MEASURING THE DEFORMATION OF A SPECIMEN USTING A FIBER OPTIC EXTENSOMETER - A method for measuring the deformation of a specimen using an extensometer having a loop of a single-mode optical fiber. At least two points of the loop are attached to desired locations on a specimen. Light is transmitted through the loop and the transmitted optical power is measured by a photodetector. The deformation of the specimen causes the size and shape of the loop to change, which changes the transmitted optical power. The change in optical power is related to extension or compression using calibration curves. The sensor works on the principle of transmitted power modulation through the curved section. | 09-19-2013 |
Nick H. Nguyen, Rochester, NY US
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20150265159 | NONCONTACT THERMOMETRY SYSTEMS AND METHODS - A method of determining a temperature of a patient includes determining that a temperature measurement device is located within at least one of a distance range and an alignment range of a portion of a measurement site of the patient, providing an indication to a user of the device that the device is located within the at least one of the distance range and the alignment range, and determining, with the device, a first temperature of a first location on the portion of the measurement site without contacting the patient with the device. Such a method also includes determining, with the device, a second temperature of a second location on the portion of the measurement site without contacting the patient with the device, wherein the second location is different from the first location. Such a method further includes determining a third temperature of the patient based on the first and second temperatures. | 09-24-2015 |
Peter Nguyen, Webster, NY US
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20150141572 | LATEX FORMATION PROCESS COMPRISING APROTIC SOLVENT - A process includes dissolving a first polymer in an aprotic solvent, absent a protic organic solvent, to form a polymer solution, neutralizing acidic residues present in the first polymer by adding a neutralizing agent to the polymer solution, contacting the polymer solution with water to form a latex, removing the aprotic solvent from the latex, capturing the removed aprotic solvent as recycled solvent, and dissolving a second polymer with the recycled solvent. | 05-21-2015 |
Peter V. Nguyen, Webster, NY US
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20080220359 | TONER PROCESSES - Disclosed herein are toner particles generated by emulsion/aggregation processes. The processes are conducted under conditions that shorten the time for coalescence and post-formation washing, thereby increasing efficiency of the processes as compared to conventional processes. | 09-11-2008 |
20110039199 | TONER COMPOSITIONS - A toner having a core with a first latex having a specific glass transition temperature, and further having a shell surrounding the core with a second latex having a specific glass transition temperature and possessing functional groups, and processes for producing the same. | 02-17-2011 |
20140370437 | Production of Latex using a Wipe Film Evaporator - A process is disclosed for making a resin emulsion suitable for use in forming toner particles including using a wiped film evaporator for removing residual solvents. | 12-18-2014 |
20160004175 | Magenta Toner - A process for making a latex emulsion where distillation occurs at an elevated temperature is used to make resin particles with a conditioned surface which can be used to make magenta toner with increased efficiency. | 01-07-2016 |
Peter Van Nguyen, Webster, NY US
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20150286156 | ROBUST PHASE INVERSION EMULSIFICATION PROCESS FOR POLYESTER LATEX PRODUCTION - The disclosure provides robust phase inversion emulsification (PIE) processes, which produces polyester latex particles having particle size distributions with high centering capability indexes (Cpk), for the preparation of toners of good quality. | 10-08-2015 |
Phong Nguyen, Brooklyn, NY US
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20130145884 | Unknown - A satellite electrical bicycle shift control device comprising: a mounting portion and a first electrical shift control switch portion attached to the mounting portion, the electrical shift control switch portion including an operating member moveable, relative to the mounting portion, between a neutral position and an actuating position. | 06-13-2013 |
Phuc Van Nguyen, Brooklyn, NY US
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20160089574 | EXCERCISE CLASS APPARATUS AND METHOD - Exercise class systems and methods may include a plurality of pieces of exercise equipment and/or a plurality of sensing systems adapted to be worn on people in the class, each piece of equipment or sensing system outputting plural exercise signals relating to exercise performance on the piece of equipment or of the person with the sensing system. A computer system may also be provided. The computer system may include at least one electronic storage device which stores the plural signals from the pieces of equipment or sensing system and at least one processor which generates an output signal containing an animation corresponding to at least two of the exercise signals from each of the pieces of equipment or sensing systems. At least one display device, visible from each of the pieces of equipment or people in the class, may receive the output signal and display the animation. | 03-31-2016 |
Phung T. Nguyen, Pleasant Valley, NY US
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20090068772 | ACROSS RETICLE VARIATION MODELING AND RELATED RETICLE - Methods of modeling across reticle variations and a related reticle are disclosed. One embodiment of the method includes defining a test for determination across a multiple chip wafer; identifying a measurement structure for performing the test; implementing the measurement structure on the multiple chip wafer using a reticle including the measurement structure between copies of the multiple chips on the reticle, wherein no one of the multiple chips covers an entirety of the reticle; performing the test on the multiple chip wafer using the measurement structure to acquire data across the reticle; using data from the performing to establish an across reticle variation model; and using the across reticle variation model to predict across chip variation for at least one of the multiple chips. | 03-12-2009 |
20090108287 | ONE-TRANSISTOR STATIC RANDOM ACCESS MEMORY WITH INTEGRATED VERTICAL PNPN DEVICE - A one-transistor static random access memory (1T SRAM) device and circuit implementations are disclosed. The 1T SRAM device includes a planar field effect transistor (FET) on the surface of the cell and a vertical PNPN device integrated to one side of the FET. A base of the PNP of the PNPN device is electrically common to the emitter/collector of the FET and a base of the NPN of the PNPN device is electrically common to the channel region of the FET. The anode pin of the PNPN device may be used as a word line or a bit line. A method of forming the 1T SRAM device is also disclosed. | 04-30-2009 |
20120139056 | BIPOLAR TRANSISTOR INTEGRATED WITH METAL GATE CMOS DEVICES - A high-k gate dielectric layer and a metal gate layer are formed and patterned to expose semiconductor surfaces in a bipolar junction transistor region, while covering a CMOS region. A disposable material portion is formed on a portion of the exposed semiconductor surfaces in the bipolar junction transistor area. A semiconductor layer and a dielectric layer are deposited and patterned to form gate stacks including a semiconductor portion and a dielectric gate cap in the CMOS region and a cavity containing mesa over the disposable material portion in the bipolar junction transistor region. The disposable material portion is selectively removed and a base layer including an epitaxial portion and a polycrystalline portion fills the cavity formed by removal of the disposable material portion. The emitter formed by selective epitaxy fills the cavity in the mesa. | 06-07-2012 |
Phung T. Nguyen, Hopewell Junction, NY US
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20110057266 | BIPOLAR TRANSISTOR INTEGRATED WITH METAL GATE CMOS DEVICES - A high-k gate dielectric layer and a metal gate layer are formed and patterned to expose semiconductor surfaces in a bipolar junction transistor region, while covering a CMOS region. A disposable material portion is formed on a portion of the exposed semiconductor surfaces in the bipolar junction transistor area. A semiconductor layer and a dielectric layer are deposited and patterned to form gate stacks including a semiconductor portion and a dielectric gate cap in the CMOS region and a cavity containing mesa over the disposable material portion in the bipolar junction transistor region. The disposable material portion is selectively removed and a base layer including an epitaxial portion and a polycrystalline portion fills the cavity formed by removal of the disposable material portion. The emitter formed by selective epitaxy fills the cavity in the mesa. | 03-10-2011 |
Son V. Nguyen, Schenectady, NY US
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20110193230 | FORMATION OF AIR GAP WITH PROTECTION OF METAL LINES - A method is provided for fabricating a microelectronic element having an air gap in a dielectric layer thereof. A dielectric cap layer can be formed which has a first portion overlying surfaces of metal lines, the first portion extending a first height above a height of a surface of the dielectric layer and a second portion overlying the dielectric layer surface and extending a second height above the height of the surface of the dielectric layer, the second height being greater than the first height. After forming the cap layer, a mask can be formed over the cap layer. The mask can have a multiplicity of randomly disposed holes. Each hole may expose a surface of only the second portion of the cap layer which has the greater height. The mask may fully cover a surface of the first portion of the cap layer having the lower height. Subsequently, an etchant can be directed towards the first and second portions of the cap layer to form holes in the cap layer aligned with the holes in the mask. Material can be removed from the dielectric layer where exposed to the etchant by the holes in the cap layer. At such time, the mask can protect the first portion of the cap layer and the metal lines from being attacked by the etchant. | 08-11-2011 |
20120032311 | MULTI COMPONENT DIELECTRIC LAYER - An in-situ process is described incorporating plasma enhanced chemical vapor deposition comprising flowing at least one of a Si, Si+C, B, Si+B, Si+B+C, and B+C containing precursor, and a N containing precursors at first times and removing the N precursor at second times and starting the flow of an oxidant gas and a porogen gas into the chamber. A dielectric layer is described comprising a network having inorganic random three dimensional covalent bonding throughout the network which contains at least one SiCN, SiCNH, SiN, SiNH, BN, BNH, CBN, CBNH, BSiN, BSiNH, SiCBN and SiCBNH as a first component and a low k dielectric as a second component adjacent thereto. | 02-09-2012 |
20120111825 | AIR GAP INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME - A metal interconnect structure includes at least a pair of metal lines, a cavity therebetween, and a dielectric metal-diffusion barrier layer located on at least one portion of walls of the cavity. After formation of a cavity between the pair of metal lines, the dielectric metal-diffusion barrier layer is formed on the exposed surfaces of the cavity. A dielectric material layer is formed above the pair of metal lines to encapsulate the cavity. The dielectric metal-diffusion barrier layer prevents diffusion of metal and impurities from one metal line to another metal line and vice versa, thereby preventing electrical shorts between the pair of metal lines. | 05-10-2012 |
20120248617 | MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRESSIVE STRESS PROPERTIES - The present disclosure provides a multilayered cap (i.e., migration barrier) that conforms to the substrate (i.e., interconnect structure) below. The multilayered cap, which can be located atop at least one interconnect level of an interconnect structure, includes, from bottom to top, a first layer comprising silicon nitride and a second layer comprising at least one of boron nitride and carbon boron nitride. | 10-04-2012 |
20130043514 | MULTIPHASE ULTRA LOW K DIELECTRIC MATERIAL - A multiphase ultra low k dielectric process incorporating an organo-silicon precursor including an organic porogen, high frequency radio frequency power just above plasma initiation in a PECVD chamber and energy post treatment. A porous SiCOH dielectric material having a k less than 2.7 and a modulus of elasticity greater than 7 GPa. A graded carbon adhesion layer of SiO | 02-21-2013 |
20130087756 | HEAT SHIELD LINER IN A PHASE CHANGE MEMORY CELL - A memory cell structure and method to form such structure. An example memory cell includes a bottom electrode formed within a substrate. The memory cell also includes a phase change memory element in contact with the bottom electrode. The memory cell includes a liner laterally surrounding the phase change memory element. The liner includes dielectric material that is thermally conductive and electrically insulating. The memory cell includes an insulating dielectric layer laterally surrounding the liner. The insulating dielectric layer includes material having a lower thermal conductivity than that of the liner. | 04-11-2013 |
20130087923 | MULTI COMPONENT DIELECTRIC LAYER - An in-situ process is described incorporating plasma enhanced chemical vapor deposition comprising flowing at least one of a Si, Si═C, B, Si═B, Si═B═C, and B═C containing precursor, and a N containing precursors at first times and removing the N precursor at second times and starting the flow of an oxidant gas and a porogen gas into the chamber. A dielectric layer is described comprising a network having inorganic random three dimensional covalent bonding throughout the network which contains at least one SiCN, SiCNH, SiN, SiNH, BN, BNH, CBN, CBNH, BSiN, BSiNH, SiCBN and SiCBNH as a first component and a low k dielectric as a second component adjacent thereto. | 04-11-2013 |
20130113106 | THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-COPPER BONDING - At least one metal adhesion layer is formed on at least a Cu surface of a first device wafer. A second device wafer having another Cu surface is positioned atop the Cu surface of the first device wafer and on the at least one metal adhesion layer. The first and second device wafers are then bonded together. The bonding includes heating the devices wafers to a temperature of less than 400° C., with or without, application of an external applied pressure. During the heating, the two Cu surfaces are bonded together and the at least one metal adhesion layer gets oxygen atoms from the two Cu surfaces and forms at least one metal oxide bonding layer between the Cu surfaces. | 05-09-2013 |
20130134590 | FORMATION OF AIR GAP WITH PROTECTION OF METAL LINES - A microelectronic substrate which includes a dielectric layer overlying a semiconductor region of a substrate, the dielectric layer having an exposed top surface; a plurality of metal lines of a first metal disposed within the dielectric layer, each metal line having edges and a surface exposed at the top surface of the dielectric layer; a dielectric cap layer having a first portion overlying the surfaces of the metal lines and a second portion overlying the dielectric layer between the metal lines, the first portion has a first height above the surface of the dielectric layer, and the second portion has a second height above the surface of the dielectric layer, the second height being greater than the first height; and an air gap disposed between the metal lines, the air gap underlying the second portion of the cap layer. | 05-30-2013 |
20130200520 | THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-COPPER BONDING - At least one metal adhesion layer is formed on at least a Cu surface of a first device wafer. A second device wafer having another Cu surface is positioned atop the Cu surface of the first device wafer and on the at least one metal adhesion layer. The first and second device wafers are then bonded together. The bonding includes heating the devices wafers to a temperature of less than 400° C., with or without, application of an external applied pressure. During the heating, the two Cu surfaces are bonded together and the at least one metal adhesion layer gets oxygen atoms from the two Cu surfaces and forms at least one metal oxide bonding layer between the Cu surfaces. | 08-08-2013 |
20130333923 | MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN CONFORMAL SiNx DIELECTRICS USED IN NANO DEVICE FABRICATION - A layer of silicon nitride having a thickness from 0.5 nanometers to 2.4 nanometers is deposited on a substrate. A plasma nitridation process is carried out on the layer. These steps are repeated for a plurality of additional layers of silicon nitride, until a predetermined thickness is attained. Such steps can be used to provide a multilayer silicon nitride dielectric formed on a substrate having an upper surface of dielectric material with Cu and other conductors embedded within, and a plurality of steps. The multilayer silicon nitride dielectric has a plurality of individual layers each having a thickness from 0.5 nanometers to 2.4 nanometers, and the multilayer silicon nitride dielectric conformally covers the steps of the substrate with a conformality of at least seventy percent. A multilayer silicon nitride dielectric, and a multilevel back end of line interconnect wiring structure using same, are also provided. | 12-19-2013 |
20140050860 | MATERIALS CONTAINING VOIDS WITH VOID SIZE CONTROLLED ON THE NANOMETER SCALE - A method of forming a porous composite material in which substantially all of the pores within the composite material are small having a diameter of about 5 nm or less and with a narrow PSD is provided. The porous composite material includes a first solid phase having a first characteristic dimension and a second phase comprised of pores having a second characteristic dimension, wherein the characteristic dimensions of at least one of said phases is controlled to a value of about 5 nm or less | 02-20-2014 |
20140113433 | WAFER BONDING FOR 3D DEVICE PACKAGING FABRICATION - An apparatus and method bond a first wafer to a second wafer. The apparatus includes a first pressure application device configured to apply pressure at a central region of the first wafer in a direction toward the second wafer to initiate a bonding process between the first wafer and the second wafer. The apparatus also includes one or more second pressure application devices configured to apply pressure between the central region and an outer edge of the first wafer to complete the bonding process. The one or more second pressure application devices apply pressure on the first wafer after the first pressure application device has initiated the bonding process and while the first pressure application device continues to apply pressure at the central region. A controller controls the first pressure application device and the one or more second pressure application devices. | 04-24-2014 |
20140199832 | TITANIUM OXYNITRIDE HARD MASK FOR LITHOGRAPHIC PATTERNING - A vertical stack including a dielectric hard mask layer and a titanium nitride layer is formed over an interconnect-level dielectric material layer such as an organosilicate glass layer. The titanium nitride layer may be partially or fully converted into a titanium oxynitride layer, which is subsequently patterned with a first pattern. Alternately, the titanium nitride layer, with or without a titanium oxynitride layer thereupon, may be patterned with a line pattern, and physically exposed surface portions of the titanium nitride layer may be converted into titanium oxynitride. Titanium oxynitride provides etch resistance during transfer of a combined first and second pattern, but can be readily removed by a wet etch without causing surface damages to copper surfaces. A chamfer may be formed in the interconnect-level dielectric material layer by an anisotropic etch that employs any remnant portion of titanium nitride as an etch mask. | 07-17-2014 |
20140252502 | MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES - Multilayer dielectric structures are provided having silicon nitride (SiN) and silicon oxynitride (SiNO) films for use as capping layers, liners, spacer barrier layers, and etch stop layers, and other components of semiconductor nano-devices. For example, a semiconductor structure includes a multilayer dielectric structure having multiple layers of dielectric material including one or more SiN layers and one or more SiNO layers. The layers of dielectric material in the multilayer dielectric structure have a thickness in a range of about 0.5 nanometers to about 3 nanometers. | 09-11-2014 |
20140256153 | MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES - Multilayer dielectric structures are provided having silicon nitride (SiN) and silicon oxynitride (SiNO) films for use as capping layers, liners, spacer barrier layers, and etch stop layers, and other components of semiconductor nano-devices. For example, a semiconductor structure includes a multilayer dielectric structure having multiple layers of dielectric material including one or more SiN layers and one or more SiNO layers. The layers of dielectric material in the multilayer dielectric structure have a thickness in a range of about 0.5 nanometers to about 3 nanometers. | 09-11-2014 |
20140302685 | DIELETRIC CAP HAVING MATERIAL WITH OPTICAL BAND GAP TO SUBSTANTIALLY BLOCK UV RADIATION DURING CURING TREATMENT, AND RELATED METHODS - A dielectric cap and related methods are disclosed. In one embodiment, the dielectric cap includes a dielectric material having an optical band gap (e.g., greater than about 3.0 electron-Volts) to substantially block ultraviolet radiation during a curing treatment, and including nitrogen with electron donor, double bond electrons. The dielectric cap exhibits a high modulus and is stable under post ULK UV curing treatments for, for example, copper low k back-end-of-line (BEOL) nanoelectronic devices, leading to less film and device cracking and improved reliability. | 10-09-2014 |
20150028491 | Improved SiCOH Hardmask with Graded Transition Layers - A structure and method for fabricating an improved SiCOH hardmask with graded transition layers having an improved profile for forming sub-20 nm back end of the line (BEOL) metallized interconnects are provided. In one embodiment, the improved hardmask may be comprised of five layers: an oxide adhesion layer, a graded transition layer, a dielectric layer, an inverse graded transition layer, and an oxide layer. In another embodiment, the improved hardmask may be comprised of four layers; an oxide adhesion layer, a graded transition layer, a dielectric layer, and an oxide layer. In another embodiment, a method of forming an improved hardmask may comprise a continuous five step plasma enhanced chemical vapor deposition (PECVD) process utilizing a silicon precursor, a porogen, and oxygen. In yet another embodiment, a method of forming an improved hardmask may comprise a continuous four step PECVD process utilizing a silicon precursor, a porogen, and oxygen. | 01-29-2015 |
20150162239 | TITANIUM OXYNITRIDE HARD MASK FOR LITHOGRAPHIC PATTERNING - A vertical stack including a dielectric hard mask layer and a titanium nitride layer is formed over an interconnect-level dielectric material layer such as an organosilicate glass layer. The titanium nitride layer may be partially or fully converted into a titanium oxynitride layer, which is subsequently patterned with a first pattern. Alternately, the titanium nitride layer, with or without a titanium oxynitride layer thereupon, may be patterned with a line pattern, and physically exposed surface portions of the titanium nitride layer may be converted into titanium oxynitride. Titanium oxynitride provides etch resistance during transfer of a combined first and second pattern, but can be readily removed by a wet etch without causing surface damages to copper surfaces. A chamfer may be formed in the interconnect-level dielectric material layer by an anisotropic etch that employs any remnant portion of titanium nitride as an etch mask. | 06-11-2015 |
20150191824 | MICROWAVE PLASMA AND ULTRAVIOLET ASSISTED DEPOSITION APPARATUS AND METHOD FOR MATERIAL DEPOSITION USING THE SAME - A deposition apparatus for depositing a material on a substrate is provided. The deposition apparatus has a processing chamber defining a processing space in which the substrate is arranged, an ultraviolet radiation assembly configured to emit ultraviolet radiation and a microwave radiation assembly configured to emit microwave radiation into an excitation space that can be the same as the processing space, and a gas feed assembly configured to feed a precursor gas into the processing space and a reactive gas into the excitation space. The ultraviolet radiation assembly and the microwave radiation assembly are operated in combination to excite the reactive gas in the excitation space. The material is deposited on the substrate from the reaction of the excited reactive gas and the precursor gas. A method for using the deposition apparatus to deposit a material on a substrate is provided. | 07-09-2015 |
20150214157 | ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS - An electrical device comprising including an opening in a low-k dielectric material, and a copper including structure present within the opening for transmitting electrical current. A liner is present between the opening and the copper including structure. The liner includes a superlattice structure comprised of a metal oxide layer, a metal layer present on the metal oxide layer, and a metal nitride layer that is present on the metal layer. A first layer of the superlattice structure that is in direct contact with the low-k dielectric material is one of said metal oxide layer and a final layer of the superlattice structure that is in direct contact with the copper including structure is one of the metal nitride layers. | 07-30-2015 |
20150270124 | COMPOSITE DIELECTRIC MATERIALS WITH IMPROVED MECHANICAL AND ELECTRICAL PROPERTIES - A low k dielectric material with enhanced electrical and mechanical properties is provided which, in some applications, can also reduce the capacitance of a semiconductor device. The low k dielectric material includes CNT nanotubes that are randomly dispersed within a low k dielectric material matrix. The low k dielectric material can be used in a variety of electronic devices including, for example, as an insulator layer within a back end of line interconnect structure. | 09-24-2015 |
20150279667 | ADVANCED ULTRA LOW K SICOH DIELECTRICS PREPARED BY BUILT-IN ENGINEERED PORE SIZE AND BONDING STRUCTURED WITH CYCLIC ORGANOSILICON PRECURSORS - Disclosed herein is an ultra-low dielectric (k) film and methods of making thereof. A ultra-low k film has a covalently bonded network comprising atoms of silicon, oxygen, carbon, and hydrogen, a cyclotrisilane structure, and a plurality of pores having a pore size distribution (PSD) of less than about 1.1 nanometers (nm). The ultra-low k film has a k value of less than about 2.4 and at least about 28 atomic percent of carbon. | 10-01-2015 |
20150348868 | SEMICONDUCTOR CHIPS WITH SMALL SCALE STRUCTURES FOR LIQUID COOLING - A semiconductor assembly for use with forced liquid and gas cooling. A relatively rigid nano-structure (for example, array of elongated nanowires) extends from an interior surface of a cap toward a top surface of a semiconductor chip, but, because of the rigidness and structural integrity of the nano-structure built into the cap, and of the cap itself, the nano-structure is reliably spaced apart from the top surface of the chip, which helps allow for appropriate cooling fluid flows. The cap piece and nano-structures built into the cap may be made of silicon or silicon compounds. | 12-03-2015 |
20160005597 | ADVANCED ULTRA LOW K SICOH DIELECTRICS PREPARED BY BUILT-IN ENGINEERED PORE SIZE AND BONDING STRUCTURED WITH CYCLIC ORGANOSILICON PRECURSORS - Disclosed herein is an ultra-low dielectric (k) film and methods of making thereof. A ultra-low k film has a covalently bonded network comprising atoms of silicon, oxygen, carbon, and hydrogen, a cyclotrisilane structure, and a plurality of pores having a pore size distribution (PSD) of less than about 1.1 nanometers (nm). The ultra-low k film has a k value of less than about 2.4 and at least about 28 atomic percent of carbon. | 01-07-2016 |
20160035618 | ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS - An electrical device including an opening in a low-k dielectric material, and a copper including structure present within the opening for transmitting electrical current. A liner is present between the opening and the copper including structure. The liner includes a superlattice structure comprised of a metal oxide layer, a metal layer present on the metal oxide layer, and a metal nitride layer that is present on the metal layer. A first layer of the superlattice structure that is in direct contact with the low-k dielectric material is one of said metal oxide layer and a final layer of the superlattice structure that is in direct contact with the copper including structure is one of the metal nitride layers. | 02-04-2016 |
20160056076 | INTERCONNECT STRUCTURE - Low capacitance and high reliability interconnect structures and methods of manufacture are disclosed. The method includes forming a copper based interconnect structure in an opening of a dielectric material. The method further includes forming a capping layer on the copper based interconnect structure. The method further includes oxidizing the capping layer and any residual material formed on a surface of the dielectric material. The method further includes forming a barrier layer on the capping layer by outdiffusing a material from the copper based interconnect structure to a surface of the capping layer. The method further includes removing the residual material, while the barrier layer on the surface of the capping layer protects the capping layer. | 02-25-2016 |
20160056112 | INTERCONNECT STRUCTURE - Low capacitance and high reliability interconnect structures and methods of manufacture are disclosed. The method includes forming a copper based interconnect structure in an opening of a dielectric material. The method further includes forming a capping layer on the copper based interconnect structure. The method further includes oxidizing the capping layer and any residual material formed on a surface of the dielectric material. The method further includes forming a barrier layer on the capping layer by outdiffusing a material from the copper based interconnect structure to a surface of the capping layer. The method further includes removing the residual material, while the barrier layer on the surface of the capping layer protects the capping layer. | 02-25-2016 |
20160064307 | LIQUID COOLING OF SEMICONDUCTOR CHIPS UTILIZING SMALL SCALE STRUCTURES - A semiconductor assembly for use with forced liquid and gas cooling. A relatively rigid nano-structure (for example, array of elongated nanowires) extends from an interior surface of a cap toward a top surface of a semiconductor chip, but, because of the rigidness and structural integrity of the nano-structure built into the cap, and of the cap itself, the nano-structure is reliably spaced apart from the top surface of the chip, which helps allow for appropriate cooling fluid flows. The cap piece and nano-structures built into the cap may be made of silicon or silicon compounds. | 03-03-2016 |
Son V. Nguyen, Yorktown Heights, NY US
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20080197513 | BEOL INTERCONNECT STRUCTURES WITH IMPROVED RESISTANCE TO STRESS - A chip is provided which includes a back-end-of-line (“BEOL”) interconnect structure. The BEOL interconnect structure includes a plurality of interlevel dielectric (“ILD”) layers which include a dielectric material curable by ultraviolet (“UV”) radiation. A plurality of metal interconnect wiring layers are embedded in the plurality of ILD layers. Dielectric barrier layers cover the plurality of metal interconnect wiring layers, the dielectric barrier layers being adapted to reduce diffusion of materials between the metal interconnect wiring layers and the ILD layers. One of more of the dielectric barrier layers is adapted to retain compressive stress while withstanding UV radiation sufficient to cure the dielectric material of the ILD layers, making the BEOL structure better capable of avoiding deformation due to thermal and/or mechanical stress. | 08-21-2008 |
20100028695 | LOW k DIELECTRIC CVD FILM FORMATION PROCESS WITH IN-SITU IMBEDDED NANOLAYERS TO IMPROVE MECHANICAL PROPERTIES - A low k dielectric stack having an effective dielectric constant k, of about 3.0 or less, in which the mechanical properties of the stack are improved by introducing at least one nanolayer into the dielectric stack. The improvement in mechanical properties is achieved without significantly increasing the dielectric constant of the films within the stack and without the need of subjecting the inventive dielectric stack to any post treatment steps. Specifically, the present invention provides a low k dielectric stack that comprises at least one low k dielectric material and at least one nanolayer present within the at least one low k dielectric material. | 02-04-2010 |
20110012238 | ENGINEERED INTERCONNECT DIELECTRIC CAPS HAVING COMPRESSIVE STRESS AND INTERCONNECT STRUCTURES CONTAINING SAME - A dielectric capping layer having a dielectric constant of less than 4.2 is provided that exhibits a higher mechanical and electrical stability to UV and/or E-Beam radiation as compared to conventional dielectric capping layers. Also, the dielectric capping layer maintains a consistent compressive stress upon post-deposition treatments. The dielectric capping layer includes a tri-layered dielectric material in which at least one of the layers has good oxidation resistance, is resistance to conductive metal diffusion, and exhibits high mechanical stability under at least UV curing. The low k dielectric capping layer also includes nitrogen content layers that contain electron donors and double bond electrons. The low k dielectric capping layer also exhibits a high compressive stress and high modulus and is stable under post-deposition curing treatments, which leads to less film and device cracking and improved device reliability. | 01-20-2011 |
20110108992 | AIR GAP INTERCONNECT STRUCTURES AND METHODS FOR FORMING THE SAME - A metal interconnect structure includes at least a pair of metal lines, a cavity therebetween, and a dielectric metal-diffusion barrier layer located on at least one portion of walls of the cavity. After formation of a cavity between the pair of metal lines, the dielectric metal-diffusion barrier layer is formed on the exposed surfaces of the cavity. A dielectric material layer is formed above the pair of metal lines to encapsulate the cavity. The dielectric metal-diffusion barrier layer prevents diffusion of metal and impurities from one metal line to another metal line and vice versa, thereby preventing electrical shorts between the pair of metal lines. | 05-12-2011 |
Tam Nguyen, Upton, NY US
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20080311658 | COMBINED HAIRPIN-ANTISENSE COMPOSITIONS AND METHODS FOR MODULATING EXPRESSION - A nucleotide construct comprising a nucleotide sequence that forms a stem and a loop, wherein the loop comprises a nucleotide sequence that modulates expression of a target, wherein the stem comprises a nucleotide sequence that modulates expression of a target, and wherein the target modulated by the nucleotide sequence in the loop and the target modulated by the nucleotide sequence in the stem may be the same or different. Vectors, methods of regulating target expression, methods of providing a cell, and methods of treating conditions comprising the nucleotide sequence are also disclosed. | 12-18-2008 |
Thanhchau T. Nguyen, Rochester, NY US
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20090169749 | INKS FOR HIGH SPEED DURABLE INKJET PRINTING - An inkjet ink composition comprising water, and at least one water-dispersible polyurethane/urea polymer having at least a first soft segment formed from a polyol prepolymer and at least a second soft segment formed from a polyamine prepolymer, wherein the polyol prepolymer forms urethane bonds in the polyurethane/urea and the polyamine prepolymer forms urea bonds in the polyurethane/urea, and further wherein at least about 4% by weight of the combined soft segments is formed by polyamine prepolymers that form urea bonds in the polyurethane/urea polymer. | 07-02-2009 |
20090170986 | PIGMENT-BASED INKS WITH IMPROVED JETTING LATENCY - An inkjet ink composition comprising water, pigment particles dispersed with a polymeric dispersant, at least one water-dispersible polyurethane, at least one pyrrolidinone compound, glycerol, and a 1,2-alkanediol having from four to eight carbon atoms. | 07-02-2009 |
Thanh Tien Nguyen, New York, NY US
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20110213669 | Allocation of Resources - Allocation of resources is described for example, where the resources are computers, communications network resources or advertisement slots. In an example a weighted proportional resource allocation mechanism is described in which a resource provider seeks to maximize revenue whilst users seek to maximize their satisfaction in terms of the utility of any resource allocation they receive minus any payment they make for the resource allocation. In an example, the provider determines discrimination weights (using information about resource constraints and other factors). For example, the discrimination weights are published to the users; the users submit bids for the resources in the knowledge of the discrimination weights and the provider allocates the resources according to the bids and the discrimination weights. In an example keyword auctions for sponsored search are considered where the resources are advertisement slots and where the constraints include the relative positions of the advertisements. | 09-01-2011 |
Thao N. Nguyen, Katonah, NY US
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20080215459 | METHOD AND APPARATUS FOR META-SHOPPING AND DYNAMIC SETUP OF B2B ECOMMERCE - A method, apparatus, and computer implemented instructions for generating a customized catalog for an entity or organization. Items from a base catalog are presented to a user located at a remote data processing system. One or more items are selected by a user through a process of “meta-shopping”. The selected items are placed in a set, also referred to as a “meta-shopping cart”, used to generate the customized catalog. Terms for purchasing items in the customized catalog are associated with the customized catalog. Further, a protocol for purchasing items from the customized catalog may be established, and the customized catalog is then placed on a Web site. | 09-04-2008 |
20080260287 | METHOD AND APPARATUS FOR ADDING SIGNATURE INFORMATION TO ELECTRONIC DOCUMENTS - In one embodiment, the present invention is a method and apparatus for adding signature information to electronic documents. One embodiment of the inventive method involves adding the signature information into a signature data field template corresponding to the electronic document, converting the signature data field template, including the added signature information, to an image file, and superimposing the image file over the electronic document to produce a signed electronic document. The inventive method substantially eliminates the potential for human error and security breaches in the signing of electronic documents. | 10-23-2008 |
20080263438 | METHOD AND APPARATUS FOR CREATING AND EDITING ELECTRONIC DOCUMENTS - In one embodiment, the present invention is a method and apparatus for creating and editing electronic documents. One embodiment of the inventive method involves generating an electronic document in a first document format type, in accordance with one or more user-specified parameters, and converting the electronic document from the first document format type into a second document format type, in accordance with a user instruction to finalize the electronic document. In one embodiment, the first document format type is a structured document format type, such as hypertext markup language or extensible markup language, while the second document format type is a secure document format type such as portable document format. | 10-23-2008 |
20090106271 | SECURE SEARCH OF PRIVATE DOCUMENTS IN AN ENTERPRISE CONTENT MANAGEMENT SYSTEM - An enterprise content management system such as an electronic contract system manages a large number of secure documents for many organizations. The search of these private documents for different organizational users with role-based access control is a challenging task. A content-based extensible mark-up language (XML)-annotated secure-index search mechanism is provided that provides an effective search and retrieval of private documents with document-level security. The search mechanism includes a document analysis framework for text analysis and annotation, a search indexer to build and incorporate document access control information directly into a search index, an XML-based search engine, and a compound query generation technique to join user role and organization information into search query. By incorporating document access information directly into the search index and combining user information in the search query, search and retrieval of private contract documents can be achieved very effectively and securely with high performance. | 04-23-2009 |
20100005443 | System and Methods to Create a Multi-Tenancy Software as a Service Application - A method for providing multi-tenant services includes receiving a request from a user, establishing tenancy information for the user, wherein the tenancy information is selected which corresponds to a tenant of the user from among multiple tenants, customizing the request according to the tenancy information established for the user, forwarding the request to an application that is not multi-tenant aware, receiving results of the request from the application, customizing the results according to the tenancy information established for the user and corresponding to the tenant of the user, and returning customized results to the user. | 01-07-2010 |
20130018764 | Methodology For Charging Of Discrete Resource Reservation Based ServicesAANM Deng; YuAACI Yorktown HeightsAAST NYAACO USAAGP Deng; Yu Yorktown Heights NY USAANM Nguyen; Thao N.AACI KatonahAAST NYAACO USAAGP Nguyen; Thao N. Katonah NY USAANM Perng; Chang-ShingAACI Bedford HillsAAST NYAACO USAAGP Perng; Chang-Shing Bedford Hills NY USAANM Rendahl; Randy A.AACI RaleighAAST NCAACO USAAGP Rendahl; Randy A. Raleigh NC USAANM Sailer; AncaAACI ScarsdaleAAST NYAACO USAAGP Sailer; Anca Scarsdale NY USAANM Swirszcz; Grzegorz M.AACI OssiningAAST NYAACO USAAGP Swirszcz; Grzegorz M. Ossining NY US - Methods, apparatus, and articles of manufacture are disclosed. These perform the following: accessing records of previous usage within a billing period of service units for customers, wherein the service units are discrete sizes of services for resource types, wherein each usage of an individual one of the service units has start and stop events, and wherein each resource type has a price fixed as of a date of the previous usage; dividing the billing period into time periods determined using the start and stop events for the usage of all of the service units; using the accessed records and the time periods and based on one or more criteria, assigning resource types to the previous usage in the time periods of the service units by the customers; and determining total charge for a selected customer based on the assignments of the resource types and corresponding prices for the selected customer. | 01-17-2013 |
Thao Ngoc Nguyen, Katomah, NY US
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20080235227 | SYSTEMS AND METHODS TO EXTRACT DATA AUTOMATICALLY FROM A COMPOSITE ELECTRONIC DOCUMENT - A system and method for automatically extracting contract data from electronic contracts includes an administrator module configured to provide templates for inputting document patterns and a list of contract data tags for each of a plurality of contract document types. A parser is configured to convert an electronic contract document into a contract text document and reformat the contract text document to provide a pattern for the text contract document. A pattern recognition engine is configured to determine a list of contract document types in the electronic contract by comparing and matching patterns of all known contract document types with the pattern of the contract text document. A contract data extraction engine is configured to extract contract data for each contract document type on the list. | 09-25-2008 |
Thao Ngoc Nguyen, Katonah, NY US
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20090067013 | SYSTEMS AND METHODS TO ASSOCIATE INVOICE DATA WITH A CORRESPONDING ORIGINAL INVOICE COPY IN A STACK OF INVOICES - A system and method for associating documents includes providing a plurality of scanned documents of different types and identifying a document type for each scanned document by comparing a determined pattern for each scanned document to known document patterns. Metadata values are extracted from each scanned document using metadata labels, and each scanned document is identified by using extracted metadata values. A stored electronic record is associated with each scanned document by employing the extracted metadata values such that a relationship between the stored electronic record and the associated scanned document is determined and stored. | 03-12-2009 |
20120197942 | Controlling Access to Documents by Parties - Illustrative embodiments disclose a computer process controlling access to one or more documents by one or more parties, the parties organized over one or more organizations. In response to a party associated with a first organization attempting to access documents, determining an access level associated with the party as a first access level, a second access level, a third access level, or a fourth access level. The first, second, third and fourth access levels are ordered from the first access level to the fourth access level such that the first access level provides a greatest degree of access to the documents and the fourth access level provides a least degree of access to the documents. In response to determining the access level associated with the party, permitting the party to access the documents, or preventing the party from accessing the documents, according to the access level associated with the party. | 08-02-2012 |
Thong Nguyen, Vestal, NY US
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20110150557 | PRODUCT DISPENSER - A product dispenser assembly for dispensing a liquid or gel composition, the assembly including a container housing having a head portion and an internal chamber for holding a composition, the head portion including a plurality of apertures, a moveable member structured to enable a user to selectively deploy the composition from within the internal chamber through the plurality of apertures, a cap assembly, a first absorbent pad arranged on top of the head portion for receiving the composition as it is deployed from the container, a plurality of absorbent pads arranged in a stacked configuration within cap assembly, each of the plurality of pads being adapted to be sequentially arranged on top of the head portion after the first removable pad has used to apply the composition and then removed by the user. | 06-23-2011 |
20110150558 | PRODUCT DISPENSER AND ABSORBENT ARTICLE KIT - A kit including a product dispenser assembly and an absorbent article, the assembly including a container housing having a head portion and an internal chamber for holding a composition, the head portion including a plurality of apertures, a moveable member structured to enable a user to selectively deploy the composition from within the internal chamber through the plurality of apertures, a cap assembly, a first absorbent pad arranged on top of the head portion for receiving the composition as it is deployed from the container, a plurality of absorbent pads arranged in a stacked configuration within cap assembly, each of the plurality of pads being adapted to be sequentially arranged on top of the head portion after the first removable pad has used to apply the composition and then removed by the user. | 06-23-2011 |
20110152398 | COMPOSITIONS FOR REPELLING FLUID AND USES THEREOF - Provided are compositions for repelling fluids comprising a volatile liquid carrier, a powder-feel agent and less than 5 weight % of an ester selected from the group consisting of formula I, formula II, formula III, and combinations of two or more thereof: | 06-23-2011 |
Thong N. Nguyen, Wappingers Falls, NY US
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20090211083 | Method and Assembly For Extracting And Installing Dual In-Line Memory Module Cardlets - A method and a tool assembly for engaging and disengaging a cardlet housing electronic components from a computer environment. The cardlet, in a preferred embodiment is a dual in-line memory module (DIMM) cardlet. The tool comprises a carrier having a handle on one end and a plurality of retention features and engaging members on an opposing side. The carrier release mechanism is secured to the carrier and the engaging members such that activating the carrier release mechanism moves the engaging members from a first to a second position such that engagement and disengagement of the carrier and said cardlet housing electronic components can be achieved. In addition, a removable latch release member is also secured to the carrier, the release member having a durable tip for engaging and disengaging latches on the computer cardlet without damaging the cardlet or its surrounding sensitive components. | 08-27-2009 |
Thong N. Nguyen, Poughkeepsie, NY US
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20140250683 | SYSTEM FOR INSERTING AND REMOVING CABLES - A method and system for installing and removing a row of cables from a cable array is provided. The method includes providing an installation tool having a first body with a plurality of arms extending from one side. The plurality of arms being configured to receive a cable connector body, the plurality of arms including at least one first projection extending from one of the plurality of arms. The installation tool is moved onto a row of cables held coupled together by a bracket, each of the cables in the row of cables having a cable connector body. The connector bodies are engaged into receptacles and the bracket is moved with the at least one first projection. | 09-11-2014 |
20150020385 | A SYSTEM FOR INSERTING AND REMOVING CABLES - A method for installing and removing a row of cables from a cable array is provided. The method includes providing an installation tool having a first body with a plurality of arms extending from one side. The plurality of arms being configured to receive a cable connector body, the plurality of arms including at least one first projection extending from one of the plurality of arms. The installation tool is moved onto a row of cables held coupled together by a bracket, each of the cables in the row of cables having a cable connector body. The connector bodies are engaged into receptacles and the bracket is moved with the at least one first projection. | 01-22-2015 |
20160043535 | SYSTEM FOR INSERTING AND REMOVING CABLES - A method and system for installing and removing a row of cables from a cable array is provided. The method includes providing an installation tool having a first body with a plurality of arms extending from one side. The plurality of arms being configured to receive a cable connector body, the plurality of arms including at least one first projection extending from one of the plurality of arms. The installation tool is moved onto a row of cables held coupled together by a bracket, each of the cables in the row of cables having a cable connector body. The connector bodies are engaged into receptacles and the bracket is moved with the at least one first projection. | 02-11-2016 |
20160079140 | COMPUTE INTENSIVE MODULE PACKAGING - A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system. | 03-17-2016 |
20160081197 | COMPUTE INTENSIVE MODULE PACKAGING - A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system. | 03-17-2016 |
Tony Nguyen, Valhalla, NY US
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20080300919 | ARCHITECTURE FOR HEALTH MONITORING SYSTEMS - An architecture allows individual system components to be developed and tested individually, i.e., as distinct modules, and to be subsequently combined through standardized electrical and communication interfaces. Any combination of these modules can be implemented to form different products that provide any number of functions, such as an integrated system for monitoring a health condition and/or delivering a medication. The architecture also provides an approach for dynamically updating the product and offering its users the latest generation of technology even after the users have already purchased the product. In particular, the embodiments employ the communication interfaces to also provide connection to a remote network that can update or upgrade the product's software when the product is out in the field. | 12-04-2008 |
20080301665 | ARCHITECTURE FOR FIELD UPGRADE OF A HEALTH MONITORING SYSTEM - An architecture allows individual system components to be developed and tested individually, i.e., as distinct modules, and to be subsequently combined through standardized electrical and communication interfaces. Any combination of these modules can be implemented to form different products that provide any number of functions, such as an integrated system for monitoring a health condition and/or delivering a medication. The architecture also provides an approach for dynamically updating the product and offering its users the latest generation of technology even after the users have already purchased the product. In particular, the embodiments employ the communication interfaces to also provide connection to a remote network that can update or upgrade the product's software when the product is out in the field. | 12-04-2008 |
20090098657 | METHOD AND ASSEMBLY FOR DETERMINING THE TEMPERATURE OF A TEST SENSOR - An assembly determines an analyte concentration in a sample of body fluid. The assembly includes a test sensor having a fluid-receiving area for receiving a sample of body fluid, where the fluid-receiving area contains a reagent that produces a measurable reaction with an analyte in the sample. The assembly also includes a meter having a port or opening configured to receive the test sensor; a measurement system configured to determine a measurement of the reaction between the reagent and the analyte; and a temperature-measuring system configured to determine a measurement of the test-sensor temperature when the test sensor is received into the opening. The meter determines a concentration of the analyte in the sample according to the measurement of the reaction and the measurement of the test-sensor temperature. | 04-16-2009 |
20090211989 | SYSTEMS AND METHODS FOR CONVEYING MULTIPLE BLOOD COMPONENTS TO A RECIPIENT - Systems and methods are provided for conveying an amount of red blood cells and an amount of plasma to a blood source. Blood is conveyed from a blood source into a separation device and the separation device is operated to separate the blood into a layer containing red blood cells and a layer containing plasma. Red blood cells and plasma are removed from the separation device and volumes of the red blood cells and plasma are conveyed to the blood source. The volumes of red blood cells and plasma are alternately conveyed to the blood source for said amounts of red blood cells and plasma. | 08-27-2009 |
20120100625 | Method and Assembly for Determining the Temperature of a Test Sensor - An assembly determines an analyte concentration in a sample of body fluid. The assembly includes a test sensor having a fluid-receiving area for receiving a sample of body fluid, where the fluid-receiving area contains a reagent that produces a measurable reaction with an analyte in the sample. The assembly also includes a meter having a port or opening configured to receive the test sensor; a measurement system configured to determine a measurement of the reaction between the reagent and the analyte; and a temperature-measuring system configured to determine a measurement of the test-sensor temperature when the test sensor is received into the opening. The meter determines a concentration of the analyte in the sample according to the measurement of the reaction and the measurement of the test-sensor temperature. | 04-26-2012 |
20130061663 | METHOD AND ASSEMBLY FOR DETERMINING THE TEMPERATURE OF A TEST SENSOR - An assembly determines an analyte concentration in a sample of body fluid. The assembly includes a test sensor having a fluid-receiving area for receiving a sample of body fluid, where the fluid-receiving area contains a reagent that produces a measurable reaction with an analyte in the sample. The assembly also includes a meter having a port or opening configured to receive the test sensor; a measurement system configured to determine a measurement of the reaction between the reagent and the analyte; and a temperature-measuring system configured to determine a measurement of the test-sensor temperature when the test sensor is received into the opening. The meter determines a concentration of the analyte in the sample according to the measurement of the reaction and the measurement of the test-sensor temperature. | 03-14-2013 |
20150143356 | Architecture for Field Upgrade of A Health Monitoring System - An architecture allows individual system components to be developed and tested individually, i.e., as distinct modules, and to be subsequently combined through standardized electrical and communication interfaces. Any combination of these modules can be implemented to form different products that provide any number of functions, such as an integrated system for monitoring a health condition and/or delivering a medication. The architecture also provides an approach for dynamically updating the product and offering its users the latest generation of technology even after the users have already purchased the product. In particular, the embodiments employ the communication interfaces to also provide connection to a remote network that can update or upgrade the product's software when the product is out in the field. | 05-21-2015 |
True Minh Nguyen, New York, NY US
Patent application number | Description | Published |
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20090325939 | 1H-INDAZOLES, BENZOTHIAZOLES, 1,2-BENZOISOXAZOLES, 1,2-BENZOISOTHIAZOLES, AND CHROMONES AND PREPARATION AND USES THEREOF - The present invention relates generally to the field of ligands for nicotinic acetylcholine receptors (nAChR), activation of nAChRs, and the treatment of disease conditions associated with defective or malfunctioning nicotinic acetylcholine receptors, especially of the brain. Further, this invention relates to novel compounds (indazoles and benzothiazoles), which act as ligands for the α7 nAChR subtype, methods of preparing such compounds, compositions containing such compounds, and methods of use thereof. | 12-31-2009 |
20100137288 | INDAZOLES, BENZOTHIAZOLES, BENZOISOTHIAZOLES, BENZISOXAZOLES, PYRAZOLOPYRIDINES, ISOTHIAZOLOPYRIDINES, AND PREPARATION AND USES THEREOF - The present invention relates generally to the field of ligands for nicotinic acetylcholine receptors (nACh receptors), activation of nACh receptors, and the treatment of disease conditions associated with defective or malfunctioning nicotinic acetylcholine receptors, especially of the brain. Further, this invention relates to novel compounds (e.g., indazoles and benzothiazoles), which act as ligands for the α7 nACh receptor subtype, methods of preparing such compounds, compositions containing such compounds, and methods of use thereof. | 06-03-2010 |
Vuong B. Nguyen, Liverpool, NY US
Patent application number | Description | Published |
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20150077268 | Continuous Patient Monitoring - A system for providing continuous monitoring of a patient includes: a first monitor device configured to measure one or more physiological attributes associated with the patient, the first monitor device being a contactless device; and a second monitor device configured to measure one or more physiological attributes associated with the patient, the second monitor device including one or more sensors contacting the patient; wherein, upon an alarm condition by the first monitor device, the second monitor device is configured to measure a physiological attribute and suppress the alarm condition when the second monitor device detects a non-alarm condition. | 03-19-2015 |
20150133742 | MEDICAL INSTRUMENT WITH REMAINING VISITS INDICATOR - A medical instrument includes a remaining visits indicator. The remaining visits indicator visually identifies a number of patient visits that can be completed before recharging the medical instrument. | 05-14-2015 |
Xuan T. Nguyen, Syracuse, NY US
Patent application number | Description | Published |
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20150184346 | SULFONATION OF PULP PRODUCED BY ALKALI PULPING PROCESS - This invention relates to the delignification of lignocellulosic pulp. More particularly, the invention relates to sulfonation and bleaching of the alkali pulping produced by Kraft pulp processes or produced through combination of alkali pulping processes and extended delignification stages. | 07-02-2015 |