Patent application number | Description | Published |
20080220345 | Device manufacturing method, computer program and lithographic apparatus - In a device manufacturing method using a lithographic apparatus, corrections to the dose are applied, within and/or between fields, to compensate for CD variations due to heating of elements of the projection system of the lithographic apparatus. | 09-11-2008 |
20090059192 | Lithographic apparatus and device manufacturing method - A lithographic apparatus includes a projection system configured to project a patterned radiation beam onto a target portion of a substrate. The apparatus also includes a barrier member, surrounding a space between the projection system and, in use, the substrate, to define in part with the projection system a reservoir for liquid. A radially outer surface of the barrier member facing a portion of projection system and a radially outer surface of the portion of the projection system facing the barrier member each have a liquidphobic outer surface. The liquidphobic outer surface of the barrier member and/or the liquidphobic outer surface of the portion of the projection system has an inner edge that defines in part the reservoir. | 03-05-2009 |
20090103062 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic apparatus includes a projection system configured to project a patterned radiation beam onto a target portion of a substrate. The projection system has a final element. The apparatus also includes a barrier member surrounding a space between the projection system and, in use, the substrate, to define in part with the final element a reservoir for liquid. The barrier member is spaced from the final element to define a gap therebetween. The apparatus further includes a deformable seal between a radially outer surface of the final element and a radially outer surface of the barrier member. The deformable seal is configured to substantially prevent a gas from flowing past the seal towards or away from the reservoir of liquid. | 04-23-2009 |
20090168039 | Device Manufacturing Method and Lithographic Apparatus - A device manufacturing method includes a measurement phase and an exposure phase. The measurement phase includes conditioning a radiation beam with a first beam condition, forming the patterned radiation beam by imparting the radiation beam with the first beam condition with a first pattern in its cross-section, and projecting the patterned beam onto a sensor capable of providing a sensor output signal. The exposure phase includes fast switching the conditioning of the radiation beam to a second beam condition, the second beam condition being different from the first beam condition, forming the patterned radiation beam by imparting the radiation beam with the second beam condition with a second pattern in its cross-section, the second pattern being provided by a patterning device, and projecting the patterned beam onto a target portion of the substrate. | 07-02-2009 |
20100045956 | Lithographic Apparatus, Method for Determining at Least One Polarization Property Thereof, Polarization Analyzer and Polarization Sensor Thereof - A lithographic apparatus includes an illumination system configured to condition a radiation beam; a polarization sensor configured at least in part to couple to a reticle stage, wherein components of the reticle polarization sensor can be loaded and unloaded in the lithographic apparatus in the manner used for conventional reticles. In one configuration an active reticle tool includes a rotatable retarder configured to vary the retardation applied to polarized light received from a field point in the illumination system. In another configuration, a passive reticle tool is configured as an array of polarization sensor modules, where the amount of retardation applied to received light by fixed retarders varies according to position of the polarization sensor module. Accordingly, a plurality of retardation conditions for light received at a given field point can be measured, wherein a complete determination of a polarization state of the light at the given field point can be determined. In another configuration, the polarization sensor is configured to measure the effect of a projection lens on a polarization state of light passing through the projection lens. | 02-25-2010 |
20100118288 | Lithographic projection system and projection lens polarization sensor - A lithographic apparatus includes an illumination system configured to condition a radiation beam; a polarization sensor configured at least in part to couple to a reticle stage, wherein components of the reticle polarization sensor can be loaded and unloaded in the lithographic apparatus in the manner used for conventional reticles. In one configuration an active reticle tool includes a rotatable retarder configured to vary the retardation applied to polarized light received from a field point in the illumination system. In another configuration, a passive reticle tool is configured as an array of polarization sensor modules, where the amount of retardation applied to received light by fixed retarders varies according to position of the polarization sensor module. Accordingly, a plurality of retardation conditions for light received at a given field point can be measured, wherein a complete determination of a polarization state of the light at the given field point can be determined. In another configuration, the polarization sensor is configured to measure the effect of a projection lens on a polarization state of light passing through the projection lens. | 05-13-2010 |
20100149507 | Dedicated Metrology Stage for Lithography Applications - A system and method are used to detect parameters regarding an exposure portion or an exposure beam. The system comprising a substrate stage and a metrology stage. The substrate stage is configured to position a substrate to receive an exposure beam from an exposure portion of a lithography system. The metrology stage has a sensor system thereon that is configured to detected parameters of the exposure system or the exposure beam. In one example, the system is within a lithography system, which further comprises an illumination system, a patterning device, and a projection system. The patterning device patterns a beam of radiation from the illumination system. The projection system, which is located within the exposure portion, projects that pattered beam onto the substrate or the sensor system. | 06-17-2010 |
20100157271 | LITHOGRAPHIC APPARATUS AND METHOD OF IRRADIATING AT LEAST TWO TARGET PORTIONS - A lithographic apparatus is disclosed that includes a table, at least two target portions on the table or on an object on the table, and a surface material between the at least two target portions. The apparatus further includes an optical system configured to project a beam of radiation, along an optical path towards the table, with a cross-section to irradiate the at least two target portions at the same time. The apparatus further includes a shield moveable into the optical path to restrict the cross-section of the beam of radiation to restrict illumination between the at least two target portions, wherein the surface material between the at least two target portions would degrade when irradiated with radiation from the optical system. | 06-24-2010 |
20100182582 | Passive reticle tool, a lithographic apparatus and a method of patterning a device in a lithography tool - A lithographic apparatus includes an illumination system configured to condition a radiation beam; a polarization sensor configured at least in part to couple to a reticle stage, wherein components of the reticle polarization sensor can be loaded and unloaded in the lithographic apparatus in the manner used for conventional reticles. In one configuration an active reticle tool includes a rotatable retarder configured to vary the retardation applied to polarized light received from a field point in the illumination system. In another configuration, a passive reticle tool is configured as an array of polarization sensor modules, where the amount of retardation applied to received light by fixed retarders varies according to position of the polarization sensor module. Accordingly, a plurality of retardation conditions for light received at a given field point can be measured, wherein a complete determination of a polarization state of the light at the given field point can be determined. In another configuration, the polarization sensor is configured to measure the effect of a projection lens on a polarization state of light passing through the projection lens. | 07-22-2010 |
20110007285 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid. | 01-13-2011 |
20110026032 | Method of Assessing a Model of a Substrate, an Inspection Apparatus and a Lithographic Apparatus - A method of assessing a model of a substrate is presented. A scatterometry measurement is taken using radiation at a first wavelength. The wavelength of the radiation is then changed and a further scatterometry measurement taken. If the scatterometry measurements are consistent across a range of wavelengths then the model is sufficiently accurate. However, if the scatterometry measurements change as the wavelength changes then the model of the substrate is not sufficiently accurate. | 02-03-2011 |
20110043775 | LITHOGRAPHIC APPARATUS, DISTORTION DETERMINING METHOD, AND PATTERNING DEVICE - The invention relates to a lithographic apparatus arranged to transfer a pattern from a patterning device onto a substrate, wherein said apparatus is operable to measure higher-order distortions and/or image plane deviations of the patterning device, said apparatus comprising: a device for transmission image detection; and a processor configured and arranged to model higher-order distortions of the patterning device using signals received from the device for transmission image detection; wherein said patterning device has a main imaging field, and a perimeter and said apparatus is operable to model said higher-order distortions using signals resultant from alignment structures comprised in said perimeter and/or in the imaging field. | 02-24-2011 |
20110043780 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - Disclosed is a method of determining higher order distortions of a patterning device of a lithographic apparatus, and associated apparatus. The higher order distortions are measured using the transmission imaging device. In a main embodiment, enhanced reticles are used which may have additional alignment gratings in the perimeter, in the scribe lanes of the image field or in the image field itself. | 02-24-2011 |
20110090476 | LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD, AND METHOD OF APPLYING A PATTERN TO A SUBSTRATE - A lithographic apparatus includes at least one image alignment sensor for receiving radiation projected from an alignment mark on a reticle. Processor processes signals from the sensor(s) to resolve spatial information in the projected alignment mark to establish a reference for measuring positional relationships between a substrate support and the patterning location. Examples of the sensor include line arrays of photodetectors. A single array can resolve spatial information in a plane of the sensor (X, Y direction) and in a perpendicular (Z) direction. At least a final step in establishing the reference position is performed while holding the substrate support stationary. Errors and delays induced by mechanical scanning of prior art sensors are avoided. Alternatively (not illustrated) the sensor is moved for mechanical scanning relative to the substrate support, independently of the main positioning systems. | 04-21-2011 |
20110102753 | Apparatus and Method of Measuring a Property of a Substrate - The present invention makes the use of measurement of a diffraction spectrum in or near an image plane in order to determine a property of an exposed substrate. In particular, the positive and negative first diffraction orders are separated or diverged, detected and their intensity measured to determine overlay (or other properties) of exposed layers on the substrate. | 05-05-2011 |
20110109888 | Method and Apparatus for Measuring Line End Shortening, Substrate and Patterning Device - End of line effect can occur during manufacture of components using a lithographic apparatus. These end of line effects can result in line end shortening of the features being manufactured. Such line end shortening may have an adverse impact on the component being manufactured. It is therefore desirable to predict and/or monitor the line end shortening. A test pattern is provided that has two separate areas such that, as designed, when the two areas are illuminated with radiation (for example from an angle-resolved scatterometer) they result in diffused radiation with asymmetry that is equal in sign to each other, but opposite in magnitude. When the test pattern is actually manufactured, line end shortening occurs, and so the asymmetry of the two areas are not equal and opposite. From the measured asymmetry of the manufactured test pattern, the amount of line end shortening that has occurred can be estimated. | 05-12-2011 |
20110116060 | LITHOGRAPHIC APPARATUS, REMOVABLE MEMBER AND DEVICE MANUFACTURING METHOD - A member is provided to prevent immersion liquid ingress to a gap between components or to adhere to at least one component to provide a surface to a feature of an immersion system. The member has a plastic sealing portion that is adhered to the component(s). The plastic sealing portion is opaque to DUV radiation. It may be resistant to degradation through exposure to DUV radiation. It may have a liquid phobic coating or property. | 05-19-2011 |
20110141444 | Inspection Apparatus for Lithography - A scatterometer configured to measure a property of a substrate, includes a radiation source configured to provide a radiation beam; and a detector configured to detect a spectrum of the radiation beam reflected from a target ( | 06-16-2011 |
20110164228 | Inspection Apparatus for Lithography - The invention relates to detecting targets located within patterns. The invention operates in the pupil plane by filtering the fourier transform from the surrounding pattern. In particular the method includes performing a fourier transform on reflected radiation data to form fourier transform data; removing portions of the fourier transform data which correspond to the target to form reduced fourier transform data; interpolating the portions of the reduced fourier transform data which were removed, to form product fourier transform data; and subtracting the product fourier transform data from the fourier transform data. | 07-07-2011 |
20110164229 | LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD, AND METHOD OF APPLYING A PATTERN TO A SUBSTRATE - A lithographic apparatus includes a patterning subsystem for transferring a pattern from a patterning device onto a substrate controlled in accordance with recorded measurements of level variations across a surface of the substrate. A level sensor is provided for projecting a level sensing beam of radiation to reflect from a location on the substrate surface and for detecting the reflected sensing beam to record the surface level at said location. The level sensor incorporates at least one moving optical element to scan the substrate surface by optical movement in at least one dimension to obtain measurements of surface level at different locations without mechanical movement between the level sensor and the substrate. Optical path length equalization measures may be employed, using shaped reflectors and/or additional moving mirrors, to avoid focus variation during the scan. | 07-07-2011 |
20110199592 | LITHOGRAPHIC APPARATUS, REMOVABLE MEMBER AND DEVICE MANUFACTURING METHOD - A sealing member is provided to prevent immersion liquid ingress to a gap between components. The sealing member has a plastic or polymer sealing portion that is adhered to the components forming the gap being sealed. The sealing member is constructed so as to reduce the force-coupling, in particular the time-related force-coupling, between the components being sealed. | 08-18-2011 |
20110204484 | Sub-Wavelength Segmentation in Measurement Targets on Substrates - Measurement targets for use on substrates, and overlay targets are presented. The targets include an array of first regions alternating with second regions, wherein the first regions include structures oriented in a first direction and the second regions include structures oriented in a direction different from the first direction. The effective refractive index of the two sets of regions are thereby different when experienced by a polarized beam, which will act as a TM-polarized beam when reflected from the first set of regions, but as a TE-polarized beam when reflected from the second set of regions. | 08-25-2011 |
20110205518 | Substrate, a Method of Measuring a Property, an Inspection Apparatus and a Lithographic Apparatus - Scatterometry for measuring overlay. A second set of superimposed gratings are superposed over a first set of superimposed gratings. The second set of gratings have a different periodicity from the first set of gratings or a different orientation. Consequently the first order diffraction pattern from the second set of superimposed gratings can be distinguished from the first order diffraction pattern from the first set of superimposed gratings. | 08-25-2011 |
20110229830 | Inspection Method For Lithography - The present invention relates to an inspection apparatus and method which include projecting a measurement radiation beam onto a target on a substrate in order to measure the radiation reflected from the target and obtain information related to properties of the substrate. In the present embodiments, the measurement spot, which is the focused beam on the substrate, is larger than the target. Information regarding the radiation reflected from the target is kept and information regarding the radiation reflected from the surface around the target is eliminated. This is done either by having no reflecting (or no specularly reflecting) surfaces around the target or by having known structures around the target, the information from which may be recognized and removed from the total reflected beam. The reflected beam is measured in the pupil plane of the projector such that the information obtained is related to diffraction orders of the reflected beam and profile, critical dimension or overlay of structures on the substrate may be determined. | 09-22-2011 |
20110249244 | Lithographic Focus and Dose Measurement Using A 2-D Target - In order to determine whether an exposure apparatus is outputting the correct dose of radiation and its projection system is focusing the radiation correctly, a test pattern is used on a mask for printing a specific marker onto a substrate. This marker is then measured by an inspection apparatus, such as a scatterometer, to determine whether there are errors in focus and dose and other related properties. The test pattern is configured such that changes in focus and dose may be easily determined by measuring the properties of a pattern that is exposed using the mask. The test pattern may be a 2D pattern where physical or geometric properties, e.g., pitch, are different in each of the two dimensions. The test pattern may also be a one-dimensional pattern made up of an array of structures in one dimension, the structures being made up of at least one substructure, the substructures reacting differently to focus and dose and giving rise to an exposed pattern from which focus and dose may be determined. | 10-13-2011 |
20110279800 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid. | 11-17-2011 |
20110285977 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid. | 11-24-2011 |
20110317143 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic apparatus is provided that has a sensor at substrate level, the sensor including a radiation receiver, a transmissive plate supporting the radiation receiver, and a radiation detector, wherein the sensor is arranged to avoid loss of radiation between the radiation receiver and a final element of the radiation detector. | 12-29-2011 |
20120008113 | LITHOGRAPHIC APPARATUS, CONTROL SYSTEM AND DEVICE MANUFACTURING METHOD - An immersion lithographic apparatus is disclosed that has a measurement system or a prediction system for measuring and/or predicting, respectively, an effect associated with a temperature fluctuation of the immersion liquid, and a control system for controlling the or another effect associated with the temperature of the immersion liquid, on the basis of the measurement and/or prediction obtained by the measurement system and/or prediction system, respectively. An associated control system and device manufacturing method is also disclosed. | 01-12-2012 |
20120019795 | LITHOGRAPHIC APPARATUS, COMPUTER PROGRAM PRODUCT AND DEVICE MANUFACTURING METHOD - Disclosed is a device manufacturing method and associated apparatus, the method comprising transferring a pattern from a patterning device onto a substrate. The method relates to the alignment of said patterning device and said substrate, and comprises imparting a radiation beam onto an alignment structure on said patterning device so as to obtain a resultant aerial image; scanning an image sensor in accordance with a scanning scheme, through a target volume containing said resultant aerial image, the relative positions of said image sensor and said substrate being known or subsequently determined; and measuring features of said image and thereby determining of the location of the alignment structure relative to the image sensor; wherein an alternative scanning scheme is used in which, for example two or more scans through the whole target volume are performed, having a total duration the same as a conventional single continuous scan. | 01-26-2012 |
20120033223 | Inspection Method and Apparatus, Lithographic Apparatus, Lithographic Processing Cell and Device Manufacturing Method for Determining a Property of a Substrate - In a method for determining one or more properties of a substrate, scatterometry spectra can be measured from one or more targets on the substrate. Reconstructions of each of said spectra can be performed to derive one or more values for the property of the substrate, by comparing representations of each of the measured spectra with one or more modeled representations of spectra calculated using variable parameter values. At least one parameter in the reconstruction for each spectrum can be linked to the value of the parameter used in the reconstruction for a different spectrum. | 02-09-2012 |
20120092636 | Metrology Apparatus, Lithography Apparatus and Method of Measuring a Property of a Substrate - A metrology apparatus is configured to measure a property of a substrate. The metrology apparatus includes an illumination system configured to condition a radiation beam, an objective lens configured to project radiation onto the substrate, a detector configured to detect radiation reflected from a surface of the substrate, and an image field selecting device in the path of the reflected radiation constructed and arranged to select an area of an image field associated with the substrate. The selected area corresponds with a predetermined portion of the substrate. This arrangement may enable selection of different shapes and sizes of targets on the substrate and may enable in-die measurement of selected parameters. | 04-19-2012 |
20120274911 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic projection apparatus is disclosed in which a space between the projection system and a sensor is filled with a liquid. | 11-01-2012 |
20120274912 | LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD - A lithographic apparatus includes a projection system configured to project a patterned radiation beam onto a target portion of a substrate. The projection system has a final element. The apparatus also includes a barrier member surrounding a space between the projection system and, in use, the substrate, to define in part with the final element a reservoir for liquid. The barrier member is spaced from the final element to define a gap therebetween. The apparatus further includes a deformable seal between a radially outer surface of the final element and a radially outer surface of the barrier member. The deformable seal is configured to substantially prevent a gas from flowing past the seal towards or away from the reservoir of liquid. | 11-01-2012 |
20130141723 | Alignment Mark Deformation Estimating Method, Substrate Position Predicting Method, Alignment System and Lithographic Apparatus - A method is used to estimate a value representative for a level of alignment mark deformation on a processed substrate using an alignment system. The alignment sensor system is able to emit light at different measuring frequencies to reflect from an alignment mark on the substrate and to detect a diffraction pattern in the reflected light in order to measure an alignment position of the alignment mark. The two or more measuring frequencies are used to measure an alignment position deviation per alignment mark associated with each of the two or more measuring frequencies relative to an expected predetermined alignment position of the alignment mark. A value is determined representative for the spread in the determined alignment position deviations per alignment mark in order to estimate the level of alignment mark deformation. | 06-06-2013 |
20130176547 | Lithographic Apparatus and a Method for Determining a Polarization Property - A lithographic apparatus includes an illumination system, a support, a patterning device, a substrate table, a projection system, and a detector. The apparatus further includes a polarization changing element, such as a quarter-wave plate, that is adjustable and a polarization analyzer, such as a linear polarizer. The polarization changing element and the polarization analyzer are arranged in order in the radiation beam path at the level at which a patterning device would be held by the support. By taking intensity measurements for different rotational orientations of the polarization changing element, information on the state of polarization of the radiation at the level of the patterning device can be obtained. Because the polarization analyzer is located before the projection system, the measurements are not affected by the fact that the detector is located after the projection system, such as at the level of the substrate. | 07-11-2013 |
20140247434 | Lithographic Focus and Dose Measurement Using A 2-D Target - In order to determine whether an exposure apparatus is outputting the correct dose of radiation and its projection system is focusing the radiation correctly, a test pattern is used on a mask for printing a specific marker onto a substrate. This marker is then measured by an inspection apparatus, such as a scatterometer, to determine whether there are errors in focus and dose and other related properties. The test pattern is configured such that changes in focus and dose may be easily determined by measuring the properties of a pattern that is exposed using the mask. The test pattern may be a 2D pattern where physical or geometric properties, e.g., pitch, are different in each of the two dimensions. The test pattern may also be a one-dimensional pattern made up of an array of structures in one dimension, the structures being made up of at least one substructure, the substructures reacting differently to focus and dose and giving rise to an exposed pattern from which focus and dose may be determined. | 09-04-2014 |
20140313500 | LITHOGRAPHIC APPARATUS, DEVICE MANUFACTURING METHOD, AND METHOD OF APPLYING A PATTERN TO A SUBSTRATE - A lithographic apparatus includes at least one image alignment sensor for receiving radiation projected from an alignment mark on a reticle. Processor processes signals from the sensor(s) to resolve spatial information in the projected alignment mark to establish a reference for measuring positional relationships between a substrate support and the patterning location. Examples of the sensor include line arrays of photodetectors. A single array can resolve spatial information in a plane of the sensor (X, Y direction) and in a perpendicular (Z) direction. At least a final step in establishing the reference position is performed while holding the substrate support stationary. Errors and delays induced by mechanical scanning of prior art sensors are avoided. Alternatively (not illustrated) the sensor is moved for mechanical scanning relative to the substrate support, independently of the main positioning systems. | 10-23-2014 |
20140327908 | Inspection Method and Apparatus, Lithographic Apparatus, Lithographic Processing Cell and Device Manufacturing Method - The present invention makes the use of measurement of a diffraction spectrum in or near an image plane in order to determine a property of an exposed substrate. In particular, the positive and negative first diffraction orders are separated or diverged, detected and their intensity measured to determine overlay (or other properties) of exposed layers on the substrate. | 11-06-2014 |
20140333922 | Inspection Method and Apparatus, Lithographic Apparatus, Lithographic Processing Cell and Device Manufacturing Method - The present invention makes the use of measurement of a diffraction spectrum in or near an image plane in order to determine a property of an exposed substrate. In particular, the positive and negative first diffraction orders are separated or diverged, detected and their intensity measured to determine overlay (or other properties) of exposed layers on the substrate. | 11-13-2014 |