Patent application number | Description | Published |
20100024723 | SUBSTRATE ALIGNMENT APPARATUS AND SUBSTRATE PROCESSING APPARATUS - A substrate alignment apparatus for aligning a substrate with a reference point, comprises a plurality of columns configured to rotate about rotation axes parallel to respective axial directions thereof, a driving mechanism configured to synchronously rotate the plurality of columns through an identical angle in an identical direction, a detector configured to detect an amount of positional deviation of the substrate from the reference point, and support pins which are located on upper surfaces of the plurality of columns while being spaced apart from respective rotation axes of the plurality of columns, and are configured to support the substrate, wherein the substrate is aligned by synchronously rotating the plurality of columns through the identical angle in the identical direction by the driving mechanism based on the amount of positional deviation detected by the detector. | 02-04-2010 |
20140014269 | PROCESSING APPARATUS - A processing apparatus includes a substrate supporting unit that supports a substrate in a processing space in which the substrate is processed, a first partitioning member that includes a ceiling portion having an opening and partitions the processing space from an outer space, and a second partitioning member that is attached to the first partitioning member so as to close the opening and partition the processing space from the outer space together with the first partitioning member. The second partitioning member is attached to the first partitioning member so that the second partitioning member is removable from the first partitioning member by moving the second partitioning member toward a space which a lower surface of the ceiling portion faces. | 01-16-2014 |
20140020833 | SUBSTRATE PROCESSING APPARATUS - A substrate processing apparatus for processing a substrate with plasma including: a container including a first container member that forms a processing space in which the substrate is processed, and a second container member that forms a plasma generation space in which plasma is generated a gas introduction unit for introducing gas into the container; a plasma generation unit including an antenna that is provided in an external space of the container and configured to excite the gas in the plasma generation space with an electric field that is generated by a high-frequency voltage fed from a power supply; and a substrate holding unit that is capable of holding the substrate. A coating film that contains a semiconductor material is formed on a surface of the second container member that is arranged close to the antenna. | 01-23-2014 |
Patent application number | Description | Published |
20140034369 | WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR PRODUCING SAME - Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface. | 02-06-2014 |
20140034372 | CERAMIC WIRING BOARD, MULTI-PIECE CERAMIC WIRING BOARD, AND METHOD FOR PRODUCING SAME - Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view. | 02-06-2014 |
20140037912 | WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE ARRAY, AND MANUFACTURING METHOD THEREFOR - Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view. | 02-06-2014 |
20140174803 | WIRING SUBSTRATE AND MULTI-PIECE WIRING SUBSTRATE - A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface. | 06-26-2014 |