Patent application number | Description | Published |
20090121339 | SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS - In a semiconductor module including multiple semiconductor devices, a signal that flows through a bonding wire connected to one semiconductor device is prevented from acting as noise which affects another semiconductor device, thereby improving the operation reliability of the semiconductor module. A second semiconductor device provided alongside a first semiconductor device includes a current output electrode via which large current is output. The current output electrode is electrically connected to a substrate electrode provided to a first wiring layer via a bonding wire such as a gold wire. The bonding wire is provided across the side E2 of the second semiconductor device. The bonding wire connected to the first semiconductor device is provided across a side of the first semiconductor device that corresponds to the side El of the second semiconductor device, i.e., the side F2, F3, or F4 of the first semiconductor device. | 05-14-2009 |
20090127693 | SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS - In a semiconductor module including multiple semiconductor devices, a signal that flows through a bonding wire connected to one semiconductor device is prevented from acting as noise which affects another semiconductor device, thereby improving the operation reliability of the semiconductor module. A second semiconductor device provided alongside a first semiconductor device includes a current output electrode via which large current is output. The current output electrode is electrically connected to a substrate electrode provided to a first wiring layer via a bonding wire such as a gold wire or the like. The bonding wire is provided across the side E | 05-21-2009 |
20090128229 | MULTI-CHIP PACKAGE SEMICONDUCTOR DEVICE - An efficient logic chip operating power supply having digital circuits in a multi-chip package is provided. A multi-chip package semiconductor device fabricated in common with a driver chip having analog circuits and a logic chip having digital circuits, a logic chip power supply circuit is provided in which a driver chip creates a logic chip power supply dedicated for the logic chip. The logic chip has internal logic circuitry operating by receiving a power supply from the logic chip power supply circuit via power input terminals. | 05-21-2009 |
20090141133 | SEMICONDUCTOR DEVICE WITH ANTI-SHAKE CONTROL FUNCTION - A semiconductor device with an anti-shake function includes a logic chip having a digital circuit which obtains a value for vibration of an apparatus based on a vibration detection signal supplied from a vibration detection element to generate a correction signal. The logic chip includes a correction signal processing unit which generates the correction signal, and a control signal output unit which outputs a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component in accordance with vibration. The correction signal processing unit includes a vibration computing unit which is capable of executing a plurality of stages of signal processing operations, by dedicated circuits, respectively, and which generates the correction signal from the vibration detection signal, and a central processing unit capable of executing desired computation processing to be performed by the vibration computing unit, and a signal obtained by executing all or a part of the computation processing to be performed by the dedicated circuits by the central processing unit is supplied as the correction signal to the control signal output unit. | 06-04-2009 |
20090141137 | SEMICONDUCTOR DEVICE AND IMAGING CAPTURING APPARATUS - A MCP semiconductor device with an “anti-shake” function includes a driver chip and a logic chip. The logic chip includes a correction signal processing unit which obtains a value for vibration of apparatus based on a vibration detection signal to generate a correction signal and a control signal output unit having a plurality of types of signal output sections which output a vibration control signal in accordance with the correction signal to a vibration correction control unit which executes vibration correction control for an optical component. The logic chip further includes a driver output terminal which outputs the vibration control signal to the driver chip, an external output terminal which outputs the control signal to an external circuit other than the driver chip, and also an output switch unit which connects one of the plurality of signal output sections with the driver output terminal or the external output terminal. | 06-04-2009 |
20090160950 | IMAGE STABILIZATION CONTROL CIRCUIT FOR CORRECTING VIBRATION-CAUSED DISPLACEMENT OF OPTICAL AXIS, AND IMAGE PICKUP APPARATUS PROVIDED WITH THE SAME - A first equalizer generates a vibration-component signal indicating the amount of movement of an image pickup apparatus according to an output signal of a vibration detecting element for detecting the vibration of the image pickup apparatus. The second equalizer generates a drive signal used to control a driver element to correct the position of lens and image pickup devices, based on the output signal of a position detecting element for detecting the position of the lens to be driven or the image pickup devices to be driven and the vibration-component signal. A verifying-signal input circuit inputs a signal used for verification, to the first equalizer. A control unit verifies the operations of the driver element, the position detecting element and the first equalizer. | 06-25-2009 |
20090160952 | SHAKE CORRECTION CONTROL CIRCUIT AND IMAGE PICKUP APPARATUS PROVIDED WITH THE SAME - An optical shake correction unit corrects an optical axis in response to an output signal of an vibration detecting element. An electronic shake correction unit adaptively varies an effective region in image signals of an image pickup region formed by image pickup devices. A control unit performs control such that either the optical shake correction unit or the electronic shake correction unit is enabled by switching between a first image pickup mode and a second image pickup mode. | 06-25-2009 |
20090160959 | IMAGE STABILIZATION CONTROL CIRCUIT FOR CORRECTING VIBRATION-CAUSED DISPLACEMENT OF OPTICAL AXIS, AND IMAGE PICKUP APPARATUS PROVIDED WITH THE SAME - A first equalizer generates a vibration-component signal indicating the amount of movement of an image pickup apparatus according to an output signal of a vibration detecting element for detecting the vibration of the image pickup apparatus. The second equalizer generates a drive signal used to control a driver element to correct the position of a lens or image pickup devices, based on the output signal of a position detecting element for detecting the position of the lens to be driven or the image pickup devices to be driven and the vibration-component signal. A control unit verifies the operations of the driver element, the position detecting element, the vibration detecting element and the first equalizer, based on the output signal of the position detecting element and the vibration-component signal. | 06-25-2009 |
20090160960 | IMAGE STABILIZATION CONTROL CIRCUIT FOR IMAGING APPARATUS - A vibration control equalizer for generating a vibration signal for determining a driving amount for an optical component on the basis of an output signal of a vibration detector for detecting vibration of an imaging apparatus, a position control equalizer for calculating a position signal for determining a driving amount for the optical component on the basis of an output signal of a position detector for detecting position of the optical component, and an internal CPU for controlling the vibration control equalizer and the position control equalizer are provided, and compensation for the output signal of the position detector is performed by the internal CPU. | 06-25-2009 |
20100289444 | DRIVER CIRCUIT - A stepping motor includes two coils and has supply currents to the two coils with different phases so that a rotor is rotated by the two coils. During a period where one coil is in a high impedance state, an induced voltage generated at that coil is detected. An output control circuit controls the magnitude of motor drive current supplied to the two coils in accordance with the detected induced voltage state. Then, prior to entering the high impedance state from the drive state, a short-circuit period is provided for short circuiting both terminals of the coil. | 11-18-2010 |
20100315519 | VIBRATION CORRECTION CONTROL CIRCUIT FOR CORRECTING DISPLACEMENT OF OPTICAL AXIS CAUSED BY VIBRATION, AND IMAGE PICKUP APPARATUS PROVIDED WITH SAID VIBRATION CORRECTION CONTROL CIRCUIT - In a vibration correction control circuit mounted on an image pickup apparatus including an image pickup unit, provided with lenses, image pickup devices and vibration detecting element, and a driver element for adjusting the position of the image pickup unit, the equalizer generates a drive signal used to move the image pickup unit in a direction along which to reduce the vibration applied to the image pickup unit, based on the output signal of the vibration detecting element. A verifying-signal input circuit supplies a dummy vibration-component signal to the equalizer. | 12-16-2010 |
20110043646 | IMAGE STABILIZATION CONTROL CIRCUIT - The accuracy of servo control of a corrective lens in an image stabilization control circuit is prevented from decreasing due to non-linear characteristics of a position-detecting element. A signal representing a component of vibration of an image pickup apparatus is generated based on an angular velocity signal from a vibration-detecting element. A microcomputer corrects the vibration component signal according to a predetermined correction function and generates a target position signal representing a target position of the lens. A position-detection signal based on an output from the position-detecting element is compared with the target position signal, and the position of the lens is servo-controlled. The correction function is set so that the characteristics of variation of the target position signal relative to the target position will be the same as the characteristics of variation of the position-detection signal relative to the actual position of the lens. | 02-24-2011 |