Patent application number | Description | Published |
20090140611 | QUARTZ CRYSTAL VIBRATOR, OSCILLATOR AND ELECTRONIC APPARATUS - To provide a quartz crystal vibrator, an oscillator and an electronic apparatus capable of preventing a bonding electrode from being corroded and easily maintaining soundness of the bonding electrode over a long period of time, a quartz crystal vibrator is provided with a quartz crystal vibrating plate formed by surrounding a quartz crystal vibrating piece by a frame-like portion, a hermetically closed vessel including a lid member and a base member in a plate-like shape for interposing the quartz crystal vibrating plate in a thickness direction, bonding electrodes provided between the lid member and the quartz crystal vibrating plate and between the base member and the quartz crystal vibrating plate and electrically connected to an inner electrode, and a protecting film for protecting the bonding electrode, provided with a recess portion recessed to an inner side of the hermetically closed vessel from an outer edge portion between the lid member and the quartz crystal vibrating plate and an outer edge portion between the base member and the quartz crystal vibrating plate, the protecting film is provided at the recess portion and the bonding electrode is disposed on the inner side of the recess portion. | 06-04-2009 |
20100053918 | ELECTRONIC-PARTS PACKAGE AND MANUFACTURING METHOD THEREFOR - An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member. | 03-04-2010 |
20100236038 | METHOD OF MANUFACTURING A PACKAGE, AND PACKAGE, ELECTRONIC DEVICE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO CLOCK - There is There is provided a method of manufacturing a package | 09-23-2010 |
20100237740 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - There is provided a method of manufacturing piezoelectric vibrators | 09-23-2010 |
20100290201 | ELECTRONIC COMPONENT, MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE - To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component ( | 11-18-2010 |
20100295421 | ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND BASE MEMBER MANUFACTURING METHOD - An electronic component capable of withstanding stress from a printed-circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed-circuit board. | 11-25-2010 |
20100308694 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, FIXING JIG, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH - The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through-hole running through the base substrate; and an electroconductive core member which is formed to have two flat ends and a thickness substantially equal to that of the base substrate and is inserted into the center hole of the cylindrical body; and the through-hole, the cylindrical body and the core member are integrally fixed to each other by firing. | 12-09-2010 |
20100308695 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CLOCK - There is provided a piezoelectric vibrator | 12-09-2010 |
20100308696 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - There is provided a piezoelectric vibrator | 12-09-2010 |
20100308697 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - A piezoelectric vibrator includes a base substrate, a lid substrate, a piezoelectric vibrating reed, a pair of external electrodes, a pair of through electrodes, and routing electrodes. The base substrate is made of a glass material and a bonding film is formed on the upper surface of the base substrate. The lid substrate is made of a glass material, includes a recess for a cavity, and is bonded to the base substrate with the bonding film interposed therebetween so that the recess faces the base substrate. The piezoelectric vibrating reed is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate by the recess. The pair of external electrodes is formed on the lower surface of the base substrate. The pair of through electrodes is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively. The routing electrodes are formed on the upper surface of the base substrate, and are electrically connected to the piezoelectric vibrating reed bonded to the pair of through electrodes. | 12-09-2010 |
20100308928 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH - The piezoelectric vibrator comprises a base substrate of which the two faces are polished; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member. The through-electrode is formed by hardening of a paste containing a plurality of metal fine particles. | 12-09-2010 |
20100313399 | METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO CLOCK - When a base substrate where through electrodes are formed is anodically bonded to a lid substrate that includes a bonding film formed on the entire lower surface thereof, a method of manufacturing a piezoelectric vibrator includes a superimposing process for superimposing the lid substrate on the base substrate so that a piezoelectric vibrating reed is received in a cavity, after bonding the piezoelectric vibrating reed to the upper surface of the base substrate; a setting process for placing a dummy member, which is made of a material in which ions can be transferred at a bonding temperature, on an electrode plate, and placing the superimposed substrates on the dummy member so that the base substrate faces the dummy member; and an applying process for applying a bonding voltage between the electrode plate and the bonding film after heating the dummy member and the substrates up to the bonding temperature. | 12-16-2010 |
20100320872 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED WATCH - The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads. | 12-23-2010 |
20100326721 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base. | 12-30-2010 |
20110025166 | PIEZOELECTRIC VIBRATOR, MANUFACTURING METHOD OF PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A piezoelectric vibrator which can be manufactured efficiently and a manufacturing method thereof are provided. The piezoelectric vibrator includes: a tuning-fork-type piezoelectric vibrating piece which has a pair of vibration arm portions, excitation electrodes formed on base end portions of the vibration arm portions, and weight metal films formed on distal end portions of the vibration arm portions; and a package which houses the piezoelectric vibrating piece therein. A gettering film on which a laser radiation flaw is formed is formed on intermediate portions between the base end portions and the distal end portions of the vibration arm portions. A first metal film included in the excitation electrode, a second metal film included in the weight metal film and the gettering film are formed using the same material. | 02-03-2011 |
20110048633 | ANODIC BONDING METHOD AND PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD - Providing an anodic bonding method capable of suppressing uneven quality between the central and outer sides of a bonding surface being anodically bonded. There is provided an anodic bonding method of anodically bonding a base wafer | 03-03-2011 |
20110050045 | PACKAGE, METHOD FOR MANUFACTURING THE SAME, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materials | 03-03-2011 |
20110127882 | PIEZOELECTRIC VIBRATING REED, PIEZOELECTRIC VIBRATOR, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - There are provided a piezoelectric vibrating reed which can be reliably bonded ultrasonically and which can be efficiently manufactured, a piezoelectric vibrator, a method of manufacturing a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A piezoelectric vibrating reed includes: a piezoelectric plate having vibrating portions and a base portion adjacent to the vibrating portions; excitation electrodes formed in the vibrating portions; mount electrodes formed in the base portion; lead-out electrodes for making the excitation electrodes and the mount electrodes electrically connected to each other; and a passivation film which is formed of an electrically insulating material and covers the excitation electrodes and the lead-out electrodes. These electrodes disposed on one surface of the base portion are formed only in a region covered by the passivation film. | 06-02-2011 |
20110193646 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC EQUIPMENT AND RADIO-CONTROLLED TIMEPIECE, AND METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR - A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole. | 08-11-2011 |
20110215879 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A method for manufacturing a piezoelectric vibrator is provided. The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; extraction electrodes which are formed on the first substrate so as to be extracted from the inner side of the cavity to an outer edge of the first substrate; a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the extraction electrodes at an inner side of the cavity; and outer electrodes which are formed on an outer surface of the package so as to be electrically connected to the extraction electrodes at the outer side of the cavity. The method includes: a bonding film forming step of forming a bonding film on at least one of the first substrate and the second substrate using a low-melting-point glass so as to bond the two substrates; a mounting step of electrically connecting the piezoelectric vibrating reed to the extraction electrodes formed on the first substrate; and a bonding step of superimposing the first substrate and the second substrate onto each other with the bonding film disposed therebetween while heating the bonding film to a predetermined bonding temperature to thereby bond the two substrates by the bonding film. | 09-08-2011 |
20110219593 | PATTERN FORMING METHOD, PATTERN FORMING APPARATUS, PIEZOELECTRIC VIBRATOR, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIEC - Provided are a pattern forming method and apparatus capable of suppressing the occurrence of pattern blurring when forming a pattern on a substrate by a sputtering method, a piezoelectric vibrator having the electrode pattern formed by the pattern forming method and apparatus, a method of manufacturing the piezoelectric vibrator, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. | 09-15-2011 |
20110220493 | MASKING MATERIAL, PIEZOELECTRIC VIBRATOR, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO-CONTROLLED TIMEPIECE - Provided are a masking material capable of suppressing the occurrence of pattern blurring when forming a pattern on a substrate by a sputtering method, a piezoelectric vibrator using the masking material, a method of manufacturing the piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece each having the piezoelectric vibrator. A masking material which is used when forming a pattern on a substrate by a sputtering method includes openings corresponding to the pattern, and portions where the openings are not formed have a uniform thickness. | 09-15-2011 |
20110221537 | PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; outer electrodes which are formed on an outer surface of the first substrate; inner electrodes which are formed on the first substrate so as to be accommodated in the cavity; penetration electrodes which are formed so as to penetrate through the first substrate so that the outer electrodes and the inner electrodes are electrically connected; and a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the inner electrodes at the inner side of the cavity. The first substrate and the second substrate are bonded by a bonding film that is formed of a low-melting-point glass, and the bonding film is heated to a predetermined bonding temperature when the first substrate and the second substrate are bonded together, and is formed by being heated to a temperature higher than the bonding temperature before the bonding is performed. | 09-15-2011 |
20110226731 | CRYSTAL SUBSTRATE ETCHING METHOD, PIEZOELECTRIC VIBRATING REED, A PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a crystal substrate etching method capable of processing with high accuracy, a piezoelectric vibrating reed of which the outer shape is formed by the method, a piezoelectric vibrator having the piezoelectric vibrating reed, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezo-electric vibrator. A crystal substrate and an auxiliary substrate are successively dry-etched from a second surface side of the crystal substrate in a state where the auxiliary substrate having approximately the same etching rate as the crystal substrate is bonded to a first surface of the crystal substrate. | 09-22-2011 |
20110227661 | GLASS SUBSTRATE BONDING METHOD, GLASS ASSEMBLY, PACKAGE MANUFACTURING METHOD, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a glass substrate bonding method capable of securely anodically bonding a bonding material and a glass substrate even when Si having a large resistance value is used as a material for the bonding material, a glass assembly obtained by the glass substrate bonding method, a package manufacturing method, a package, a piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezoelectric vibrator. A glass substrate bonding method includes an anodic bonding step of anodically bonding a bonding material fixed to an inner surface of a lid substrate wafer to a base substrate wafer. The bonding material is formed of an ITO film and a Si film which are sequentially formed on the inner surface of the lid substrate wafer. | 09-22-2011 |
20110228643 | VACUUM PACKAGE, METHOD FOR MANUFACTURING VACUUM PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a vacuum package and a method for manufacturing the vacuum package having excellent airtightness and capable of improving mounting strength, and a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. The package includes a base substrate and a lid substrate bonded to each other, a cavity formed between the base substrate and the lid substrate and configured to be capable of sealing a piezoelectric vibrating reed, and penetration electrodes penetrating through the base substrate in the thickness direction so as to make the inner side of the cavity and the outer side conductive. Portions of the base substrate and the lid substrate in the vicinity of the cavity form bonding regions in which the two substrates are bonded. A notch portion through which the bonding surface of the lid substrate is exposed as seen from the thickness direction of the base substrate is formed on the corner portions of the base substrate. | 09-22-2011 |
20110285245 | ANODIC WAFER BONDING METHOD, METHOD OF MANUFACTURING PACKAGES, METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATORS, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO CLOCK - An anodic wafer bonding method according to the present invention is an anodic wafer bonding method for bonding a first substrate formed of an insulating material or a dielectric material and a second substrate which can be anodically bonded by applying a voltage to a bonding film formed of a conductive material formed between the substrates in a state in which the first substrate and the second substrate are laminated, in which the voltage is applied to the bonding film from a plurality of points at the time of anodic wafer bonding. | 11-24-2011 |
20120044025 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD - An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base. | 02-23-2012 |
20120153779 | ELECTRONIC COMPONENT - An electronic component includes a glass substrate, a lid that is bonded to the glass substrate, an internal electrode, an external electrode, and a through electrode that is disposed in a through hole passing through the glass substrate and electrically connects the internal electrode to the external electrode. A sputtered metal layer is formed on the end face of a core member of the through electrode, which is made of a metal, by sputtering. | 06-21-2012 |
20120206999 | CRYSTAL DEVICE, METHOD OF MANUFACTURING CRYSTAL DEVICE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS, AND RADIO TIMEPIECE - A crystal device includes leading electrodes that are formed on a base substrate, and a bump for mounting a piezoelectric vibrating reed on the leading electrodes, and alignment marks for performing the positioning of the bump are formed on the base substrate separately from the leading electrodes. | 08-16-2012 |
20120224460 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO TIMEPIECE - A piezoelectric vibrator, an oscillator, an electronic device and a ratio timepiece are provided which are capable of increasing a capacitance C0 while achieving miniaturization and cost reduction. The piezoelectric vibrator includes a base substrate, a lid substrate, a piezoelectric vibrating reed on which an excitation electrode is formed, and external electrodes. An electrode pattern for capacitance adjustment, which extends along a routing electrode, is provided extending from a routing electrode. | 09-06-2012 |
20130234565 | PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - Provided are a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece capable of preventing lowering of an electrical characteristic of a routing electrode during the frequency adjustment with respect to a piezoelectric vibrator whose frequency can be adjusted by irradiating a laser beam onto a weight metal film formed on a distal end of a vibrating arm portion. In a piezoelectric vibrator, a routing electrode is arranged in an offset manner toward one side with respect to a center line of a base substrate in the lateral width direction, and a piezoelectric vibrating piece is arranged in an offset manner toward a side opposite to the routing electrode with respect to the center line of the base substrate in the lateral direction. | 09-12-2013 |