Patent application number | Description | Published |
20090140148 | BOLOMETER AND METHOD OF MANUFACTURING THE SAME - A bolometer having decreased noise and increased temperature sensitivity and a method of manufacturing the same are provided. The bolometer has a resistive layer formed of single crystalline silicon (Si) or silicon germanium (Si | 06-04-2009 |
20090146058 | RESISTIVE MATERIALS FOR MICROBOLOMETER, METHOD FOR PREPARATION OF RESISTIVE MATERIALS AND MICROBOLOMETER CONTAINING THE RESISTIVE MATERIALS - Provided are resistive materials for a microbolometer, a method for preparation of resistive materials and a microbolometer containing the resistive materials. The resistive materials for the microbolometer include an alloy of silicon and antimony or an alloy of silicon, antimony and germanium, which has a high TCR and a low resistance. | 06-11-2009 |
20090152466 | MICROBOLOMETER WITH IMPROVED MECHANICAL STABILITY AND METHOD OF MANUFACTURING THE SAME - Provided are a microbolometer having a cantilever structure and a method of manufacturing the same, and more particularly, a microbolometer having a three-dimensional cantilever structure, which is improved from a conventional two-dimensional cantilever structure, and a method of manufacturing the same. The method includes providing a substrate including a read-out integrated circuit and a reflective layer for forming an absorption structure, forming a sacrificial layer on the substrate, forming a cantilever structure having an uneven cross-section in the sacrificial layer, forming a sensor part isolated from the substrate by the cantilever structure, and removing the sacrificial layer. | 06-18-2009 |
20090152467 | MULTILAYER-STRUCTURED BOLOMETER AND METHOD OF FABRICATING THE SAME - Provided are a multilayer-structured bolometer and a method of fabricating the same. In the multilayer-structured bolometer, the number of support arms supporting the body of a sensor structure is reduced to one, and two electrodes are formed on the one support arm. Thus, the sensor structure is electrically connected with a substrate through the only one support arm. According to the multilayer-structured bolometer and method of fabricating the bolometer, the thermal conductivity of the sensor structure is considerably reduced to remarkably improve sensitivity to temperature, and also the pixel size of the bolometer is reduced to obtain high-resolution thermal images. In addition, the multilayer-structured bolometer can have a high fill-factor due to a sufficiently large infrared-absorbing layer, and thus can improve infrared absorbance. | 06-18-2009 |
20100148067 | BOLOMETER STRUCTURE, INFRARED DETECTION PIXEL EMPLOYING BOLOMETER STRUCTURE, AND METHOD OF FABRICATING INFRARED DETECTION PIXEL - Provided are a bolometer structure, an infrared detection pixel employing the bolometer structure, and a method of fabricating the infrared detection pixel. | 06-17-2010 |
20100155601 | INFRARED SENSOR AND METHOD OF FABRICATING THE SAME - An infrared sensor and a method of fabricating the same are provided. The sensor includes a substrate including a reflection layer and a plurality of pad electrodes, an interdigitated sensing electrode connected to the pad electrode and formed to be spaced apart from the reflection layer by a predetermined distance and a sensing layer formed on the sensing electrode and having an opening exposing a portion in which an interdigitated region of the sensing electrode connected to one pad region is separated from the sensing electrode connected to the other pad electrode. Therefore, the sensor has an electrode in a very simple constitution, and a sensing layer divided into rectangular blocks, so that current that non-uniformly flows into the electrode can be removed. Accordingly, the sensor in which current of the sensing layer can be uniformly flown, and noise is lowered can be implemented. | 06-24-2010 |
20110042569 | INFRARED DETECTION SENSOR AND METHOD OF FABRICATING THE SAME - In an infrared detection sensor according to the present invention, all material constituting an upper portion of a sensing electrode in a supporting arm region is removed so that a supporting arm has low thermal conductivity. As a result, thermal conductivity of the infrared sensor structure is reduced, and the infrared detection sensor has excellent sensitivity. | 02-24-2011 |
20110049366 | RESISTIVE MATERIAL FOR BOLOMETER, BOLOMETER FOR INFRARED DETECTOR USING THE MATERIAL, AND METHOD OF MANUFACTURING THE BOLOMETER - A resistive material for a bolometer, a bolometer for an infrared detector using the material, and a method of manufacturing the bolometer are provided. In the resistive material, at least one element selected from the group consisting of nitrogen (N), oxygen (O) and germanium (Ge) is included in antimony (Sb). The resistive material has superior properties such as high temperature coefficient of resistance (TCR), low resistivity, a low noise constant, and is easily formed in a thin film structure by sputtering typically used in a complementary metal-oxide semiconductor (CMOS) process, so that it can be used as a resistor for the bolometer for an uncooled infrared detector, and thus provide the infrared detector with superior temperature precision. | 03-03-2011 |
20110159669 | METHOD FOR DEPOSITING AMORPHOUS SILICON THIN FILM BY CHEMICAL VAPOR DEPOSITION - Provided is a method of depositing an amorphous silicon thin film by chemical vapor deposition (CVD) to prevent bubble defect occurring when an amorphous silicon thin film is deposited on a substrate contaminated by air exposure. The deposition method includes cleaning a surface of the contaminated substrate with a reaction gas activated by plasma and depositing an amorphous silicon thin film on the cleaned substrate. Here, a vacuum state is maintained from the substrate cleaning step to the thin film deposition step in order to prevent contamination of the surface of the cleaned substrate by re-exposure to air. | 06-30-2011 |
20120098076 | ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME - Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode. | 04-26-2012 |
20120139066 | MEMS MICROPHONE - Disclosed is a micro electro mechanical system (MEMS) microphone including: a substrate; an acoustic chamber formed by processing the substrate; a lower electrode formed on the acoustic chamber and fixed to the substrate; a diaphragm formed over the lower electrode so as to be spaced apart from the lower electrode by a predetermined interval; and a diaphragm discharge hole formed at a central portion of the diaphragm. According to an exemplary embodiment of the present disclosure, attenuation generated by an air layer between the diaphragm and the lower electrode in a MEMS microphone may be effectively reduced, thereby making it possible to obtain high sensitivity characteristics and reduce a time and a cost required for removing a sacrificial layer between the diaphragm and the lower electrode. | 06-07-2012 |
20120140597 | SECURITY MONITORING SYSTEM USING BEAMFORMING ACOUSTIC IMAGING AND METHOD USING THE SAME - Disclosed is a security monitoring method determining whether a trespasser is detected and a position of the trespasser in a set security space and monitoring sound generated at the position of the trespasser by using an acoustic image generated from acoustic signals generated by an acoustic generating device and an acoustic measuring device in an array type. An exemplary embodiment of the present disclosure provides a security monitoring system including: an acoustic generating device that generates acoustic signals; a plurality of acoustic measuring devices that receive the acoustic signals; and an acoustic image processing device that generates an acoustic image using a beamforming algorithm from the acoustic signals received in the plurality of acoustic measuring devices and determines a position of a trespasser by comparing the acoustic image after the trespasser is detected with the acoustic image before the trespasser is detected. | 06-07-2012 |
20120148073 | PIEZOELECTRIC SPEAKER - Disclosed is a piezoelectric speaker including: a piezoelectric layer that converts electrical signals into oscillation and outputs sound; an electrode that is formed on a top or a bottom of the piezoelectric layer to apply the electrical signals to the piezoelectric layer; an acoustic diaphragm that is made of a hetero material including a first acoustic diaphragm and a second acoustic diaphragm and is attached to the bottom of the piezoelectric layer on which the electrode is formed; and a frame attached in a form enclosing a side of the acoustic diaphragm. | 06-14-2012 |
20120149560 | METHOD OF MANUFACTURING POROUS METAL OXIDE - Provided is a method of manufacturing porous metal oxide, the method including: preparing a metal-organic framework (MOF) wherein an ion of a metal to be used as a catalyst is linked to an organic ligand; impregnating the MOF with a precursor solution of metal oxide to be manufactured; and thermally treating the metal oxide precursor solution-impregnated MOF to remove the organic ligand. The inventive method of manufacturing porous metal oxide involves the impregnation of a metal oxide precursor solution in a MOF wherein metal ions are uniformly linked to organic ligands and the thermal treatment (calcination) of the metal oxide precursor solution-impregnated MOF to remove the organic ligands. | 06-14-2012 |
20120198918 | MICROELECTROMECHANICAL SYSTEMS TYPE SEMICONDUCTOR GAS SENSOR USING MICROHEATER HAVING MANY HOLES AND METHOD FOR MANUFACTURING THE SAME - Disclosed are an MEMS type semiconductor gas sensor using a microheater having many holes and a method for manufacturing the same. The MEMS type semiconductor gas sensor includes: a substrate of which a central region is etched with a predetermined thickness; a second membrane formed at an upper portion of the central region of the substrate and having many holes; a heat emitting resistor formed on the second membrane and having many holes; a first membrane formed on the second membrane including the heat emitting resistor and having many holes; a sensing electrode formed on the first membrane and having many holes; and a sensing material formed on the sensing electrode. | 08-09-2012 |
20130057424 | ANALOG-DIGITAL CONVERTER AND CONVERTING METHOD USING CLOCK DELAY - The present inventive concept relates to an analog-digital converter. The analog-digital converter includes a clock generating unit generating a clock signal; a clock delay adjusting unit outputting one of a first clock signal to a Kth clock signal according to a control signal; a capacitive digital-analog converting unit outputting a difference between the analog signal and a reference signal; a comparison unit judging whether an output of the capacitive digital-analog converting unit is 0, a positive number, or a negative number, in response to an output of the clock delay adjusting unit; and an SAR logic unit transferring an output of the comparison unit to the capacitive digital-analog converting unit in response to an output of the clock delay adjusting unit and performing a successive approximation operation to output the N-bit digital signal. | 03-07-2013 |
20130075255 | MEMS ELECTROCHEMICAL GAS SENSOR - Disclosed is an electrochemical gas sensor using micro electro mechanical systems (MEMS). The MEMS electrochemical gas sensor includes: a substrate a lower central region of which is etched by a predetermined thickness; a first insulation film formed on the substrate; a heat emitting resistance body formed on the first insulation film; a second insulation film formed on the heat emitting resistance body; a reference electrode formed in an upper central region of the second insulation film; a solid electrolyte formed on the reference electrode; and a detection electrode formed on the solid electrolyte. | 03-28-2013 |
20130091929 | GAS SENSOR AND METHOD OF MANUFACTURING THE SAME - Disclosed are a gas sensor, and a method of manufacturing and using the same. The method includes: forming a detection material on a heater; coating an encapsulant on the detection material; and heating the heater to remove the encapsulant from the detection material when the gas sensor is operated. | 04-18-2013 |
20130094675 | MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME - Disclosed are a MEMS microphone and a method of manufacturing the same. The MEMS microphone includes: a substrate; a rear acoustic chamber formed inside a front surface of the substrate; a vibrating plate formed on the substrate and having an exhaust hole; a fixed electrode formed on the vibrating plate; and a fixed electrode support supported by a bottom of the rear acoustic chamber and connected to the fixed electrode through the exhaust hole. | 04-18-2013 |
20130099868 | SOUND DETECTING CIRCUIT AND AMPLIFIER CIRCUIT THEREOF - Disclosed is a sound detecting circuit which includes a sensing unit configured to generate an AC signal in response to a sound pressure level of a sound signal; an amplification unit configured to amplify the AC signal; and a bias voltage generating unit configured to generate a bias voltage to be provided to the amplification unit. The bias voltage generating unit comprises a current source configured to provide a power current; and a current-voltage converting circuit configured to convert the power current into the bias voltage and to reduce a noise due to the power current. | 04-25-2013 |
20130100779 | ACOUSTIC SENSOR AND FABRICATION METHOD THEREOF - A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer. | 04-25-2013 |
20130148456 | VOLTAGE REGULATOR WITH IMPROVED LOAD REGULATION AND VOLTAGE REGULATING METHOD - Provided is a voltage supply circuit using a charge pump. The voltage supply circuit enhances charge pump output voltage fluctuation characteristics depending on load variation of a charge pump voltage generator (load regulation characteristics) when receiving an operation power supply voltage of the charge pump through a regulator. The voltage supply circuit is configured to feed back fluctuation of a charge pump output voltage to a charge pump voltage regulator. The fluctuation of the charge pump output voltage is compensated through fluctuation of an output voltage of the charge pump to active enhance the load regulation characteristics. | 06-13-2013 |
20130156069 | PROCESS INDEPENDENT TEMPERATURE SENSOR BASED ON OSCILLATOR - The inventive concept discloses a new temperature sensor structure based on oscillator which is insensitive to a process change and improves an error rate of temperature output. The temperature sensor based on oscillator compares an oscillator circuit structure insensitive to a temperature change with an oscillator circuit structure having a frequency change in proportion to a temperature change to output a relative difference between the two oscillator circuit structures and thereby it is compensated itself. In the temperature sensor based on oscillator, a problem of performance reduction due to an external environment and a process deviation of temperature sensor is improved and an output distortion and temperature nonlinearity are effectively improved. Thus, since the temperature sensor based on oscillator has a structure of high performance, low power and low cost, it can be variously used in a detection equipment of temperature environment. | 06-20-2013 |
20130185928 | ACOUSTIC SENSOR AND METHOD OF MANUFACTURING THE SAME - Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode. | 07-25-2013 |
20130271088 | ULTRASONIC WIRELESS POWER TRANSMITTER AND RECEIVER APPARATUSES, AND METHOD FOR WIRELESS CHARGING THEREOF - Disclosed are ultrasonic wireless power transmitter and receiver apparatuses, and a method for wireless charging thereof. A method for wireless charging according to the present disclosure includes: transmitting, by an ultrasonic wireless power transmitter apparatus, an wakeup signal to an ultrasonic wireless power receiver apparatus; calculating, by the ultrasonic wireless power transmitter apparatus, a charging time according to a charging status information received from the ultrasonic wireless power receiver apparatus; generating, by the ultrasonic wireless power transmitter apparatus, an ultrasonic signal, amplifying the generated ultrasonic signal to predetermined voltage and thereafter; charging, by the ultrasonic wireless power transmitter apparatus, the ultrasonic wireless power receiver apparatus for the calculated time and thereafter; and determining, by the ultrasonic wireless power transmitter apparatus, whether secondary charging is to be performed according to a charged status information received from the ultrasonic wireless power receiver apparatus. | 10-17-2013 |
20130301856 | PIEZOELECTRIC SPEAKER HAVING WEIGHT AND METHOD OF PRODUCING THE SAME - The present disclosure relates to a piezoelectric speaker having a weight that enables a frequency response characteristic of the piezoelectric speaker to be uniform by disposing a weight of a flexible material on an acoustic diaphragm or on and below an acoustic diaphragm of the piezoelectric speaker, thereby enhancing flatness of sound. The piezoelectric speaker having the weight includes a piezoelectric device having a piezoelectric layer and an electrode formed on or on and below the piezoelectric layer to apply an electrical signal to the piezoelectric layer; an acoustic diaphragm having a wider area than the piezoelectric device and bonded on one surface of the piezoelectric device; a frame disposed in a form that surrounds a side surface of the acoustic diaphragm; and a weight disposed above the acoustic diaphragm or above and below the acoustic diaphragm on which the piezoelectric device is disposed to thereby control a vibration. | 11-14-2013 |
20140061825 | MICRO ELECTRO MECHANICAL SYSTEM(MEMS) ACOUSTIC SENSOR AND FABRICATION METHOD THEREOF - Provided are a micro electro mechanical system (MEMS) acoustic sensor for removing a nonlinear component that occurs due to a vertical motion of a lower electrode when external sound pressure is received by fixing the lower electrode to a substrate using a fixing pin, and a fabrication method thereof. The MEMS acoustic sensor removes an undesired vertical motion of a fixed electrode when sound pressure is received by forming a fixing groove on a portion of the substrate and then forming a fixing pin on the fixing groove, and fixing the fixed electrode to the substrate using the fixing pin, and thereby improves a frequency response characteristic and also improves a yield of a process by inhibiting thermal deformation of the fixed electrode that may occur during the process. | 03-06-2014 |
20140079254 | MEMS MICROPHONE USING NOISE FILTER - An MEMS microphone is provided which includes a reference voltage/current generator configured to generate a DC reference voltage and a reference current; a first noise filter configured to remove a noise of the DC reference voltage; a voltage booster configured to generate a sensor bias voltage using the DC reference voltage the noise of which is removed; a microphone sensor configured to receive the sensor bias voltage and to generate an output value based on a variation in a sound pressure; a bias circuit configured to receive the reference current to generate a bias voltage; and a signal amplification unit configured to receive the bias voltage and the output value of the microphone sensor to amplify the output value. The first noise filter comprises an impedance circuit; a capacitor circuit connected to a output node of the impedance circuit; and a switch connected to both ends of the impedance circuit. | 03-20-2014 |
20140208838 | MICRO ELECTRO MECHANICAL SYSTEM CATALYTIC COMBUSTIBLE GAS SENSOR USING POROUS MEMBRANE EMBEDDED MICRO-HEATER - Provided is a catalytic combustible gas sensor using a porous membrane embedded micro-heater and a micro electro mechanical system (MEMS) technology. The present disclosure provides a gas sensor that is structurally, mechanically, and electrically stable, and has a simple device fabrication process in a MEMS catalytic combustible gas sensor that is miniaturized and also consumes a significantly small amount of power by puncturing a plurality of holes in membranes, a heating resistor, and a sensing electrode, by etching and thereby thermally isolating a substrate by a predetermined thickness through the plurality of holes, and by including a sensing structure formed using a sensing material and a compensation structure formed using a compensation material. | 07-31-2014 |