Patent application number | Description | Published |
20090139662 | SEPARATING DEVICE - A separating device according to the present invention separates a support plate ( | 06-04-2009 |
20090197070 | Support plate - The present invention provides a support plate ( | 08-06-2009 |
20100331477 | ADHESIVE COMPOSITION AND FILM ADHESIVE - The adhesive composition according to the present invention includes a resin containing a polymer having an alkoxystyrene structure as a repeating unit, and an acid generator. In accordance with the present invention, it is possible to provide a novel adhesive composition which is excellent in heat resistance and which is easily stripped. | 12-30-2010 |
20110297190 | METHOD FOR PROCESSING PROCESS-TARGET OBJECT - Provided is a method including the steps of: carrying out a storage process by causing a processing jig, which has a supply opening for supplying a first processing liquid, to be positioned such that a storage space section into which the supply opening is open is sandwiched by the processing jig and the process-target surface, and by storing the first processing liquid in the storage space section; and carrying out a rotation process by supplying the first processing liquid onto the process-target surface from the supply opening, while supplying a second processing liquid onto the outer peripheral part, in a state where the process-target object is being rotated, in the step for carrying out the rotation process, the processing jig being moved along a direction which is not a direction along which the process-target object is being rotated. | 12-08-2011 |
20120031443 | CLEANING DEVICE, CLEANING METHOD, AND COMPOSITION - A cleaning device for cleaning a substrate adhering to a support film, including a protective film forming measure for forming a protective film on an exposed surface of the support film, wherein the exposed surface is a portion of a surface of the support film to which a first surface of the substrate adheres, but the substrate does not adheres to the exposed surface; and a cleaning measure for cleaning the substrate by use of a cleaning liquid, the substrate adhering to the support film covered with the protective film. The cleaning device can effectively clean a wafer supported by a dicing tape. | 02-09-2012 |
20140109941 | RETENTION DEVICE AND RETENTION METHOD - A holding device including a first sucking section for sucking a wafer (substrate) from a side on which a dicing tape (supporting film) is adhered; a structure that supports a dicing frame (frame part) and covers a first region which (i) is on a surface of the dicing tape to which surface the wafer is not adhered and (ii) is between the wafer and the dicing frame; and a second sucking section for sealing a boundary between the structure and at least one of the dicing frame and the first region. | 04-24-2014 |
20140151328 | METHOD FOR FORMING LAMINATE - A release layer is adequately protected by a protective layer when a laminate is subjected to a desired treatment. A method for forming a laminate | 06-05-2014 |
20140374017 | BONDING METHOD AND BONDING APPARATUS - A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate. | 12-25-2014 |
Patent application number | Description | Published |
20090137760 | ADHESIVE COMPOSITION AND ADHESIVE FILM - An adhesive composition which is reduced in gas generation upon heating (has low hygroscopicity), has high alkali resistance, has heat resistance of 200° C. or higher, and can be easily removed with a stripping liquid; and an adhesive film made with the adhesive composition. The adhesive composition is prepared using, at least as a major ingredient, an acrylic polymer produced from (a) styrene, (b) a (meth)acrylic ester monomer containing a cyclic skeleton, and (c) an alkyl (meth)acrylate monomer. The adhesive film has an adhesive composition layer formed from this adhesive composition. | 05-28-2009 |
20090305617 | Support plate, carrier device, releasing device, and releasing method - A support plate for supporting a wafer includes a plurality of through holes piercing the support plate in the thickness direction, and a belt-shaped or island-like flat portion on which the plurality of through holes are not formed. | 12-10-2009 |
20090325467 | Method of Thinning Wafer and Support plate - A wafer can be thinned without occurrences of dimples. A support plate | 12-31-2009 |
20100069593 | ADHESIVE COMPOSITION AND ADHESIVE FILM - An adhesive composition of the present invention includes, as a main component, a polymer produced by copolymerization of a monomer composition including: styrene; a (meth)acrylic acid alkyl ester having a chain structure; a (meth)acrylic acid ester having an aliphatic ring; and a (meth)acrylic acid ester having an aromatic ring, wherein: the styrene is contained in a range of 40 to 69 parts by mass; the (meth)acrylic acid alkyl ester having the chain structure is contained in a range of 20 to 30 parts by mass; the (meth)acrylic acid ester having the aliphatic ring is contained in a range of 10 to 25 parts by mass; and the (meth)acrylic acid ester having the aromatic ring is contained in a range of 1 to 5 parts by mass, where the total amount of the above components is 100 parts by mass. This allows for provision of an adhesive composition having high adhesive strength under high-temperature environment, as well as high heat resistance, high alkali resistance, and easiness in stripping from semiconductor wafers and the like even after high-temperature processing. | 03-18-2010 |
20100075141 | ADHESIVE COMPOSITION AND FILM ADHESIVE - Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature. | 03-25-2010 |
20100178497 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION - Disclosed is an adhesive composition which is mainly composed of a polymer obtained by copolymerizing a monomer composition containing styrene, (meth)acrylic acid ester having a cyclic structure and alkyl (meth)acrylate having a chain structure. The monomer composition may additionally contain a bifunctional monomer, thereby improving heat resistance, adhesive strength under high temperature conditions, and alkali resistance, and easiness in stripping of an adhesive composition that has been processed at a high temperature. Consequently, there can be obtained an adhesive composition which has high heat resistance, adhesion strength under high temperature conditions, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature. | 07-15-2010 |
20100227996 | ADHESIVE COMPOSITION, FILM ADHESIVE, AND PROCESS FOR PRODUCTION OF THE COMPOSITION - An adhesive composition according to the present invention is an adhesive composition whose main component is a polymer obtained by copolymerization of a monomer composition, which monomer composition contains styrene, (meth)acrylic ester having a cyclic structure, and alkyl (meth)acrylate having a chain structure. The polymer thus having a styrene block segment allows improvement of thermal resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping following a high temperature process of the adhesive composition. As such, an adhesive composition is provided, which has high thermal resistance, adhesive strength in the high temperature environment, and alkaline resistance, and further which can easily carry out stripping of the adhesive composition after a high temperature process has been carried out to the adhesive composition. | 09-09-2010 |
20110146899 | SUPPORTING PLATE, APPARATUS AND METHOD FOR STRIPPING SUPPORTING PLATE - A method for stripping a supporting plate from a circuit-formed surface of a substrate to which it is bonded with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction, a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate. The method involves supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate; distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate; dissolving the adhesive with the solvent; and draining the solvent from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate and the second penetrating hole formed in the plate. | 06-23-2011 |
20120132359 | ATTACHING DEVICE AND ATTACHING APPARATUS FOR SUPPORTING PLATE, AND ATTACHING METHOD FOR SUPPORTING PLATE - An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled. | 05-31-2012 |
20130333833 | PERFORATED SUPPORT PLATE - To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention. | 12-19-2013 |