Minoru Yamada
Minoru Yamada, Fukuoka-Shi JP
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20110100812 | ELECTRODE MODULE - An electrode module includes a working electrode, a counter electrode, a reference electrode and a well (container) for retaining an electrolytic solution and is used in electrochemical measuring instruments. This electrode module is produced by integrating the well with at least one of the working electrode, the counter electrode and the reference electrode. This integrated electrode includes a chip-like electrode having a thin membrane of an electrode material formed on the surface of a chip-like base metal. This chip-like electrode is disposed on and integrated with the bottom of the well in a detachable manner. There is provided the compact, low price electrode module of high repetition use efficiency with no need of maintenance and having easy handling. | 05-05-2011 |
Minoru Yamada, Kashiwazaki-Shi JP
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20110064446 | IMAGE FORMING APPARATUS - An image forming apparatus includes: an image forming apparatus main body, a driven member removably disposed in the image forming apparatus main body, a rotary driver that rotates by current flowing, and after the blockage of the current flowing, continuously rotates due to an inertial force, a coupling part that has a driving-side member and a driven-side member, wherein when the driven-side member is mounted to the image forming apparatus main body, the driving-side member and a driven-side member are facing each other, and when the driving-side member and the driven-side member engage each other in the rotating direction, the rotary driver and the driven-side member are coupled to transmit the rotation of the rotary driver to the driven-side member, and a controller that controls so that, when the driven-side member is mounted to the image forming apparatus main body, the current flows to the rotary driver, and after the elapse of a certain period of time the current flow to the rotary driver is blocked. | 03-17-2011 |
Minoru Yamada, Tokyo JP
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20090208363 | SOLDER ALLOY FOR OXIDE BONDING - A lead-free metal solder material capable of realizing excellent bonding strength and hermetic sealing is provided. The solder alloy is a solder alloy for bonding to an oxide, and includes 2.0-15.0 mass % of Ag, more than 0.1-6.0 mass % of Al, and the remainder is composed of Sn and some inevitable impurities. The content of Al is preferably 0.3-3.0 mass %, and more preferably 0.5-3.0 mass %. The content of Ag is preferably 3.0-13.0 mass %, more preferably more than 5.0-12.0 mass %, and most preferably 6.0-10.0 mass %. A relation between Ag and Al that fits the inequality 0<[(% Ag)−(% Al)×7.8]<10 is desirable. The solder alloy for bonding to an oxide of the present invention is used for bonding between glasses, for instance, and has excellent effects. | 08-20-2009 |
20100123537 | PLANAR COIL COMPONENT - In a plane perpendicular to an axial direction of a winding drum, side legs face each other along an X-direction. A Y-direction is perpendicular to the X-direction. A planar coil component is configured so that a point along the Y-direction, where width of a central leg is maximum along the X-direction is at a plus side of the Y-direction, in relation to a center of the Y-direction, of the central leg; width of the central leg along the X-direction monotonically decreases from the point; width of the central leg along the X-direction is longer than along the X-direction; distance between facing surfaces of the side legs is constant; the terminal board is on the minus side, along the Y-direction, of a flange; and an end of the winding extends through the flange at the minus side of the Y-direction. | 05-20-2010 |
20100147926 | METHOD FOR OXIDE BONDING USING SOLDER ALLOY - A lead-free metal solder material capable of realizing excellent bonding strength and hermetic sealing is provided. The solder alloy is a solder alloy for bonding to an oxide, and includes 2.0-15.0 mass % of Ag, more than 0.1-6.0 mass % of Al, and the remainder is composed of Sn and some inevitable impurities. The content of Al is preferably 0.3-3.0 mass %, and more preferably 0.5-3.0 mass %. The content of Ag is preferably 3.0-13.0 mass %, more preferably more than 5.0-12.0 mass %, and most preferably 6.0-10.0 mass %. A relation between Ag and Al that fits the inequality 0<[(% Ag)−(% Al)×7.8]<10 is desirable. The solder alloy for bonding to an oxide of the present invention is used for bonding between glasses, for instance, and has excellent effects. | 06-17-2010 |
Minoru Yamada, Saitama JP
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20090013524 | Automotive body transfer method and transfer system - An automotive body transfer method and a transfer system are provided in which, when carrying out handing over of a body (B) between transfer means ( | 01-15-2009 |
20090251063 | DIMMER NOISE REDUCING CIRCUIT OF PIEZOELECTRIC TRANSFORMER - A dimmer noise reducing circuit wherein vibration noise accompanying the activation/deactivation of a piezoelectric transformer can be reduced, while non-uniformity of brightness of a discharge lamp can be prevented. A chopping circuit turns on/off an output from an input voltage source in a given periodic manner and a full-bridge circuit that receives an output voltage (vb | 10-08-2009 |
20090322244 | PIEZOELECTRIC TRANSFORMER LIGHT ADJUSTING NOISE REDUCTION CIRCUIT - Provided is a light adjusting noise reduction circuit in which the vibration noise accompanying turning ON/OFF of a piezoelectric transformer. A full bridge circuit is controlled by a full bridge drive circuit so as to switch an input voltage (VB | 12-31-2009 |
Minoru Yamada, Kanagawa JP
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20090218503 | Semiconductor X-Ray Detector Device - A semiconductor X-ray detector device has an i layer configured to substantially a circular cylindrical shape but not a conventional top-hat shape and a p layer provided to substantially cover the circumferential side of the i layer. Both an n+ layer and an n surface electrode are arranged smaller in the area than the bottom at the n surface electrode side of the i layer in order to expose the i layer entirely to the electric field E. Accordingly, the spectrum remains not fractured in the profile when the n+ layer and the n surface electrode are not greater in the area than 33% of the bottom at the n surface electrode side of the i layer, hence permitting the resolving power to stay high. | 09-03-2009 |
Minoru Yamada, Kanazawa-Shi JP
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20090147809 | Semiconductor laser drive system and semiconductor laser driving method - A semiconductor laser drive system and a semiconductor laser driving method where both internal noise and optical feedback noise can be simultaneously reduced are provided at low cost and low power consumption. | 06-11-2009 |
Minoru Yamada, Kiyosu-Shi JP
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20090137713 | Ink for Marking - In each of an organic solvent, an oil-soluble dye and an oil-soluble resin to be contained in an ink for marking, and a resin adopted in an article to be marked with the ink for marking, it is necessary that absolute values of differences between mutual solubility parameters are not more than constant values, respectively. | 05-28-2009 |
Minoru Yamada, Koganei JP
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20090104071 | SOLDER ALLOY FOR BONDING OXIDE MATERIAL, AND SOLDER JOINT USING THE SAME - The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided. | 04-23-2009 |
Minoru Yamada, Koganei-Shi JP
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20080241552 | SOLDER ALLOY AND GLASS BONDED BODY USING THE SAME - The invention provides a solder alloy containing, by mass, 2.0 to 15.0% of Ag, 0.1 to 6.0% of Al, 0.01 to 0.50% of Y, the balance being Sn and unavoidable impurities. The solder alloy preferably contains 0.01 to 0.50% of Ge by mass. The solder alloy of the invention is suited to bonding oxides together and the oxides preferably comprise glass. | 10-02-2008 |
20130115460 | BONDING MATERIAL - Provided is a bonding material which can bond base materials or substrates having different linear thermal expansion coefficients, and can have heat resistance against temperatures of 300° C. or higher, vacuum airtightness and bonding strength, further which has excellent handleability and workability. The bonding material is produced by mixing, in a content ratio of 0.01 to 60 mass % (to the whole), a metal Ga, and/or at least one metal or alloy powder selected from the group consisting of a metal powder mixture of a combination of Bi and Sn or an alloy powder thereof, and a metal powder mixture of a combination of Bi, Sn and Mg or an alloy powder thereof with a Bi | 05-09-2013 |
Minoru Yamada, Nagano JP
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20120295076 | ULTRAVIOLET RAY CURABLE INK JET COMPOSITION AND PRINTED OBJECT - An ultraviolet ray curable ink jet composition of the present invention is characterized by being adapted to be ejected using an ink jet method and containing: | 11-22-2012 |
20120295082 | METAL POWDER, ULTRAVIOLET RAY CURABLE INK JET COMPOSITION AND RECORDED OBJECT - The invention provides metal powder constituted from metal particles. Each of the metal particles comprises a base particle having a surface and a metal material constituting at least the surface of the base particle. The base particle is subjected to a surface treatment with a fluorine type phosphoric acid ester. Further, the invention also provides an ultraviolet ray curable ink jet composition to be ejected by using an ink jet method. The ultraviolet ray curable ink jet composition comprises a polymerizable compound and metal powder constituted from metal particles. The metal particles of the metal powder are subjected to a surface treatment with a fluorine type phosphoric acid ester. | 11-22-2012 |
20150044435 | ULTRAVIOLET RAY CURABLE INK JET COMPOSITION AND PRINTED OBJECT - An ultraviolet ray curable ink jet composition of the present invention is characterized by being adapted to be ejected using an ink jet method and containing: | 02-12-2015 |
Minoru Yamada, Suwa JP
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20130196125 | RECORDING MATERIAL - A recording material produced by using an ultraviolet-curable composition for inkjet that includes a polymerized compound and a glittering powder includes a recording medium and a print layer formed on the recording medium. The thickness of the print layer is T (μm). When an area that is thickness 0.5T (μm) from an outer surface in the print layer is a first area and an area that is thickness 0.5T (μm) from a contact surface contacting the recording medium in the print layer is a second area, a ratio of the glittering powder included in the first area of the print layer is more than 70 percent by volume and less than 95 percent by volume, and a ratio of the glittering powder included in the second area of the print layer is more than 5 percent by volume and less than 30 percent by volume. | 08-01-2013 |
20130196126 | ULTRAVIOLET-CURABLE COMPOSITION FOR INKJET AND RECORDING MATERIAL - An ultraviolet-curable composition for inkjet, which is discharged by an inkjet method, includes a polymerized compound, a metal powder, and a dispersant. The metal powder is treated by a surface preparation with a fluorinated silane compound and/or a fluorinated phosphate ester as a surface preparation agent. The dispersant has a polymeric structure in a basic. | 08-01-2013 |
20130196127 | COMPOSITION FOR INKJET AND RECORDING MATERIAL - A composition for inkjet adapted to be discharged by an inkjet method includes a metal powder, an organic solvent, and a binder resin. The metal powder is treated by a surface preparation with a fluorinated silane compound and/or a fluorinated phosphate ester as a surface preparation agent. | 08-01-2013 |
20140302291 | RECORDING MATERIAL - A recording material includes an ultraviolet-curable composition for inkjet that includes a polymerized compound and a glittering powder to produce the recording material, a recording medium, and a print layer formed on the recording medium. The content rate of the glittering powder in the print layer is more than 0.1 percent by volume and less than 5.0 percent by volume. | 10-09-2014 |