20090137083 | ASSEMBLING OF DOUBLED-SIDE STACKING PULRAL CHIPS - Disclosed is a method for assembling a semiconductor device, especially to dispose a plurality of chips on double sides of a chip carrier, such as a lead frame. At least a first chip is disposed on one surface of the chip carrier. Then, a protecting spacer is disposed on the active surface of the first chip. Then, the chip carrier is flipped over and placed on a hot plate where the protecting spacer keeps the active surface of the first chip away from direct contact with the hot plate. After the flipping and placing step, at least a second chip is disposed on another surface of the chip carrier and then is electrically connected to the chip carrier by a plurality of bonding wires. Therefore, any damages to the active surface of the first chip are avoided during disposition and electrical connections of the second chip. | 05-28-2009 |
20100078812 | WINDOW BGA SEMICONDUCTOR PACKAGE - A WBGA semiconductor package primarily comprises a substrate, a chip, a chip-bonding adhesive, a plurality of bonding wires electrically connecting the chip and the substrate, an encapsulant to encapsulate the chip and the bonding wires, and a plurality of external terminals disposed under the substrate. The substrate has a depression for accommodating the chip-bonding adhesive and a slot for passing through bonding wires. The chip is partially embedded in the depression to dispose on the substrate. During the chip bonding step, the chip-bonding adhesive is confined in the depression in a manner to fill the gaps between the sides of the first chip and the inwalls around the depression to generate a non-planar adhering interface by partially covering the sides of the first chip. Therefore, the total package thickness is reduced, the delamination of the passivation layer and the fractures at the sides of the chip are avoided. | 04-01-2010 |