Malagnino
Giovanni Malagnino, Verdun CA
Patent application number | Description | Published |
---|---|---|
20110042937 | PIPE FITTING WITH A SOLVENT CEMENT BARRIER - Various embodiments of a fitting or other fluid conduit for a piping system are provided. In at least one embodiment, a fitting comprises a body including a first portion and a second portion, and a barrier positioned between the first and second portions. In various embodiments, the first portion includes a first inner surface that defines a first opening that is sized and configured to receive a first piping system component. The first piping system component may be secured to the first portion by a securing liquid, such as a solvent cement. Further, in various embodiments, the second portion includes a second inner surface defining a second opening that is sized and configured to receive a second piping system component. In various embodiments, the barrier, such as a lip, for example, may be positioned between the first inner surface and the second inner surface, and the barrier may at least partially define a reservoir with an open side facing the first portion. Additionally, in these embodiments, the second inner surface may include threads. The fitting, in these embodiments, may be at least partially made of a plastic, such as PVC, CPVC, and/or ABS, for example. Thus, in such embodiments, when the securing liquid, such as solvent cement, is added to the first inner surface, the barrier and/or reservoir resists the liquid from reaching the second inner surface, thereby reducing the likelihood that the second inner surface and/or the surface's threads will become damaged or otherwise compromised by chemically reacting with the securing liquid. | 02-24-2011 |
Nunzia Malagnino, Torre Annunziata IT
Patent application number | Description | Published |
---|---|---|
20110027986 | LOW COST METHOD OF FABRICATION OF VERTICAL INTERCONNECTIONS COMBINED TO METAL TOP ELECTRODES - A method is for forming a vertical interconnection through a dielectric layer between upper and lower electrically conductive layers of an integrated circuit. The method includes forming an opening through the dielectric layer and placing a solidifiable electrically conductive filler into the opening via a printing technique. The solidifiable electrically conductive filler is solidified to thereby form a solidified electrically conducting filler in the opening. A metallization layer is formed over the dielectric layer and the solidified electrically conducting filler to thereby form the vertical interconnection through the dielectric layer between the upper and lower electrically conductive layers of the integrated circuit. | 02-03-2011 |
Nunzia Malagnino, Torre Annunziata (na) IT
Patent application number | Description | Published |
---|---|---|
20090136820 | PROTON EXCHANGE MEMBRANE AND MEMBRANE-ELECTRODE ASSEMBLY (MEA), METHOD FOR THEIR PRODUCTION AND FUEL CELL USING SAID MEMBRANE OR ASSEMBLY - A proton exchange membrane for electrolyte cells includes a polyelectrolyte polymer membrane comprising a sulfonated copolymer based on the following formula (I): | 05-28-2009 |
Vito Antonio Malagnino, Roma IT
Patent application number | Description | Published |
---|---|---|
20140356809 | Reamer with an improved blade for root canal preparation - The invention relates to a reamer with an improved blade for use in root canal preparation, the blade being spiral-shaped with a pitch increasing towards the tip, and with a cutting or non-cutting tip. At given points along the length of the spiral of the blade, there is a plurality of gaps, the spiral starting again beyond the gaps, wherein the portion where the spiral is interrupted has either a constant or decreasing cross section linking the two diameters before and after the gap. | 12-04-2014 |