Patent application number | Description | Published |
20100300733 | Multilayer ceramic board and manufacturing method thereof - The present invention relates to a multilayer ceramic board and manufacturing method thereof. The multilayer ceramic board includes: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias; diffused reflection preventing patterns which expose the vias provided on each of the uppermost ceramic layer and the lowermost ceramic layer, and are disposed on each of a top surface and a bottom surface of the ceramic stacked structure; and contact pads which are electrically connected to the vias exposed by the diffused reflection preventing patterns. | 12-02-2010 |
20100301009 | Method for forming electrode pattern of ceramic substrate - The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns. | 12-02-2010 |
20100307801 | Multilayer ceramic substrate and manufacturing method thereof - The present invention relates to a multilayer ceramic substrate including: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias provided in respective ceramic layers, the ceramic stacked structure having surface reforming layers | 12-09-2010 |
20110011631 | Ceramic substrate and method of manufacturing the same - The present invention relates to a ceramic substrate and a method of manufacturing the same. The ceramic substrate includes: a ceramic base; an electrode pattern formed on at least one surface of the ceramic base at predetermined internal and external depths; and electrode material filled in the inside of the electrode pattern. The method of manufacturing the ceramic substrate includes: coating first electrode material on at least one surface of a ceramic base; forming a surface layer built-in electrode pattern by pressurizing the coated first electrode material; primarily firing the ceramic base on which the surface layer built-in electrode pattern is formed; coating second electrode material on the surface layer built-in electrode pattern; and secondarily firing the ceramic base on which the second electrode material is coated. | 01-20-2011 |
20110252814 | Thermal insulator for construction using thermoelectric module - The present invention provides a thermal insulator for construction including: a thermoelectric module inserted in a wall or floor of a building and including a plurality of thermoelectric elements; a power supply module for supplying power to the thermoelectric module; and a power control module for controlling size and polarity of the power supplied to the thermoelectric module from the power supply module. This thermal insulator for construction can provide much better thermal insulation performance in comparison with a conventional thermal insulator, and it is possible to reduce thickness of the wall or floor in comparison with when using the conventional thermal insulator since the thermoelectric element has very small size. Further, it is possible to implement a cooling or heating effect only by changing polarity and size of applied current. | 10-20-2011 |
20110259018 | Thermoelectric module and method for manufacturing the same - Disclosed herein are a thermoelectric module including a first substrate and a second substrate that are opposite to each other and spaced from each other; first and second electrodes that are disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric element that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes, wherein at least any one of the first and second substrates has an insulating layer disposed on one surface and a fluid flowing line for moving a fluid transferring heat therein, and a method for manufacturing the same. | 10-27-2011 |
20110290293 | Thermoelectric module and method for manufacturing the same - Disclosed herein is a thermoelectric module. The thermoelectric module includes: first and second substrates that are disposed to be separated from each other, facing each other and includes first and second grooves each formed on inner sides thereof; first and second electrodes that are received in the first and second grooves, respectively; and a thermoelectric device that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes. As a result, the present invention provide a thermoelectric module and a method for manufacturing the same capable of improving the figure of merit and reliability of the thermoelectric module. | 12-01-2011 |
20120042921 | Method for manufacturing thermoelectric module and thermoelectric module manufactured from the same - The present invention provides a method for manufacturing a thermoelectric module and a thermoelectric module manufactured from the same. The method includes the steps of: forming each of first and second green laminates; forming first and second preliminary electrodes by printing a conductive paste on each of the first and second green laminates; disposing thermoelectric elements on any one of the first and second preliminary electrodes; stacking the first and second green laminates in such a manner that the thermoelectric elements are interposed between the first and second preliminary electrodes; and firing the stacked first and second green sheet laminates, thereby forming the first and second electrodes, and first and second ceramic substrates, and simultaneously bonding the first ceramic substrate to the first electrode, the first and second electrodes to the thermoelectric elements, and the second ceramic substrate to the second electrode. | 02-23-2012 |
20130141206 | COMMON MODE NOISE FILTER - Disclosed herein is a common mode noise filter including: a plurality of insulation layers configuring a laminated body formed on a substrate; internal electrode coils included in the plurality of insulation layers; external electrode terminals connected to an end portion of the internal electrode coils; and a magnetic layer formed on a surface of the laminated body. According to the present invention, the common mode noise filter has the magnetic layer including the conductive metal on the uppermost layer thereof, such that the permeability of the ferrite composite may be increased and the ferrite powder may be effectively compensated for the eddy current loss of the internal electrode coil, thereby making it possible to improve the impedance characteristics of the common mode noise filter. | 06-06-2013 |
20140153147 | METHOD FOR MANUFACTURING MAGNETIC SUBSTRATE AND COMMON MODE FILTER - A common mode filter is manufactured to include a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part. The magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon. | 06-05-2014 |
20160007486 | PACKAGE SUBSTRATE - There is provided a package substrate including: a substrate on which a circuit layer and an insulating layer are stacked; a metal post provided in an outside region of at least any one of an upper surface and a lower surface of the substrate; an electronic component mounted in a cavity formed by the metal post; and a metal lid bonded to an upper portion of the metal post. | 01-07-2016 |
Patent application number | Description | Published |
20080212672 | Method and apparatus for delivery of metadata synchronized to multimedia contents - A metadata transmitter synchronized with multimedia contents comprises: a multimedia contents authoring unit for generating and editing multimedia contents; a multimedia contents format converter for compressing the multimedia contents, converting them into a transmission format, and outputting them; a metadata authoring unit for generating and editing metadata for describing the multimedia contents, the metadata including transmission types and transmission information; a metadata format converter for converting the metadata into binary codes, converting the converted metadata into a synchronization format for synchronization with the multimedia contents and a transmission format, and outputting them; and a multiplexer for multiplexing the multimedia contents format and the metadata format respectively output from the multimedia contents format converter and the metadata format converter into a stream, and outputting it. | 09-04-2008 |
20090045432 | Circuit board for light emitting device package and light emitting unit using the same - A circuit board for a light emitting device and a light emitting unit using the same, which are capable of achieving an enhancement in light emission efficiency and an enhancement in reliability, are disclosed. The disclosed circuit board includes a substrate having a first surface and a second surface, at least one pair of conductive lines formed on the first surface of the substrate, and electrically connected to a light emitting device package, and a heat transfer member formed in a region where the light emitting device package is coupled to the circuit board, such that the heat transfer member connects the first and second surfaces of the substrate. | 02-19-2009 |
20090065797 | Light emitting unit and liquid crystal display device using the same - A light emitting unit capable of widely adjusting brightness or size, and a liquid crystal display device using the same are disclosed. The light emitting unit includes a circuit board including circuit lines having a plurality of connecting members, and a plurality of unit module connected to the connecting members of the circuit board. The unit module is coupled with at least one light emitting device. | 03-12-2009 |
20090136179 | LIGHT EMITTING UNIT, APPARATUS AND METHOD FOR MANUFACTURING THE SAME, APPARATUS FOR MOLDING LENS THEREOF, AND LIGHT EMITTING DEVICE PACKAGE THEREOF - A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove. | 05-28-2009 |
20100014281 | LIGHT EMITTING DEVICE PACKAGE AND BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY DEVICE USING THE SAME - A light emitting device package and other devices using the light emitting device package are discussed. According to an embodiment, the light emitting device package includes a package body; at least one light emitting device disposed in the package body; at least one pair of leads electrically connected with the light emitting device; and a lens over the light emitting device and having at least one recess at an upper portion of the lens, the shortest distance from the light emitting device to a lowest portion of the recess being greater than approximately D | 01-21-2010 |
20100148205 | LENS, MANUFACTURING METHOD THEREOF AND LIGHT EMITTING DEVICE PACKAGE USING THE SAME - A lens and a light emitting device package formed by introducing surface mount technology (SMI) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion. | 06-17-2010 |
20100295068 | LIGHT EMITTING DEVICE PACKAGE AND LIGHTING APPARATUS USING THE SAME - In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package. | 11-25-2010 |
20110134629 | BACK-LIGHT UNIT - A back-light unit is disclosed. An object of the present invention is to provide a back-light unit that is able to improve structural stability and mass-production efficiency. The back-light unit includes a circuit substrate comprising a plurality of light sources arranged thereon, an optical sheet positioned on the circuit substrate, a plurality of supporting parts arranged between the circuit substrate and the optical sheet to support the optical sheet, which are installed to the circuit substrate by using surface-mount technology (SMT). | 06-09-2011 |
20140139759 | TOUCH PANEL - Disclosed is a touch panel. The touch panel includes a substrate, a sensor part on the substrate, a connection electrode to connect the sensor part on the substrate, and an anti-view part on the connection electrode. A position of the connection electrode corresponds to a position of the anti-view part. A method of fabricating the touch panel includes forming the sensor part on the substrate, forming a connection electrode layer on the substrate, and patterning the connection electrode layer. The connection electrode layer includes a conductive layer and an anti-view layer. | 05-22-2014 |
20150324047 | TOUCH PANEL INCLUDING PATTERNS OF MESH STRUCTURES - Disclosed herein is a touch panel. The touch panel can have improved electrical properties and implement a large size because it includes patterns of mesh structures. Furthermore, the visibility of a view region can be improved by increasing the density of meshes in a region in which patterns are intersected, excellent electrical properties can be implemented, and a panel fabrication process can be simplified. | 11-12-2015 |
Patent application number | Description | Published |
20080211987 | LIGHTING DEVICE, BACKLIGHT UNIT, AND PRINTED CIRCUIT BOARD THEREOF - A backlight unit including a circuit board mounted with light emitting diodes and formed with connecting pads electrically connected with the light emitting diodes, a driver installed on one surface of the circuit board and configured to drive the light emitting diodes, a connector coupled to the connecting pads of the circuit board, in which the connector has a connecting direction changed toward the driver, and a connecting line for connecting the connector to the driver. | 09-04-2008 |
20120023970 | COOLING AND HEATING WATER SYSTEM USING THERMOELECTRIC MODULE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a cooling and heating water system using a thermoelectric module and a method of manufacturing the same. The cooling and heating water system using a thermoelectric module includes first and second substrates disposed to be spaced apart from each other, while facing each other; a cooling water line formed in the first substrate so as to flow cooling water therethrough; a heating water line formed in the second substrate so as to flow heating water therethrough; first and second insulating layers disposed on the inner side surfaces of the first and second substrates, respectively; and a thermoelectric device interposed between the first and second insulating layers, whereby it is possible to variously control a temperature of drinking water without generating noise by using the thermoelectric module in cooling the drinking water. | 02-02-2012 |
20120024335 | MULTI-LAYERED THERMOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a multi-layered thermoelectric device and a method of manufacturing the same. The method for manufacturing a multi-layered thermoelectric device includes the steps of: forming a P-type semiconductor and an N-type semiconductor in a sheet type by mixing thermoelectric semiconductor materials at a preset component ratio; cutting the sheets according to a preset specification of the thermoelectric device; stacking sheets which are made by mixing the thermoelectric semiconductor materials at a preset component ratio and are cut into the same size for each of them; and forming a final thermoelectric device by compressing the stacked sheets. By using the method, scattering phenomenon due to a short wavelength of phonon occurs at a boundary of each layer, which results in active scattering of phonon. Therefore, it is possible to expect an effect of improving a thermoelectric figure of merit of a thermoelectric device. | 02-02-2012 |
20120145211 | THERMOELECTRIC DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention provides a thermoelectric device including: thermoelectric sheets made of a thermoelectric semiconductor and laminated in multi-layers; and a metal sheet interposed between the thermoelectric sheets, and a method of manufacturing the same. | 06-14-2012 |
20120279541 | THERMOELECTRIC MODULE - Disclosed herein is a thermoelectric module using a thermoelectric element capable of showing a spin Seebeck effect. The present invention provides a new thermoelectric module including: a thermoelectric element; a first outer electrode that is connected to one side of the thermoelectric element and is applied with positive voltage; a second outer electrode that is connected to the other side of the thermoelectric element and is applied with negative voltage; an upper inner electrode layer that is embedded in an upper portion of the thermoelectric element and is mutually connected to the first outer electrode; and a lower inner electrode layer that is embedded in a lower portion of the thermoelectric element and is mutually connected to the second outer electrode. | 11-08-2012 |
20120279544 | THERMOELECTRIC MODULE - Disclosed herein is a thermoelectric module using a thermoelectric element capable of showing a spin Seebeck effect. The present invention provides a new thermoelectric module including: an upper substrate on which a plurality of upper metal electrodes are arranged; a lower substrate on which a plurality of lower metal electrodes are arranged; p-type semiconductor devices and n-type semiconductor devices that are disposed between the upper substrate and the lower substrate and are electrically bonded alternately to each other by the plurality of upper metal electrodes and the plurality of lower metal electrodes; and ferrite elements that are disposed between the p-type semiconductor devices and the n-type semiconductor devices, top ends and bottom ends of the ferrite elements being bonded to the upper metal electrodes and the lower metal electrodes. | 11-08-2012 |
20120288736 | ENERGY STORAGE APPARATUS AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are an energy storage apparatus including a magnetic layer formed on any one of a positive electrode, a negative electrode, and a separator, or an exterior frame, and a method for manufacturing the same. With the energy storage apparatus, the magnetic layer is provided in a vicinity of the separator in order to increase ion conductivity or a magnetic material is contained on surfaces of positive electrode and negative electrode current collectors or in positive electrode and negative electrode active materials, such that conductivity and mobility of lithium ions between the positive electrode and the negative electrode are increased, thereby making it possible to improve a charging and discharging speed. In addition, a shortage due to an ion trap and a defect according to shrinkage ratio may be improved. | 11-15-2012 |
20130049917 | CONDUCTOR PATTERN AND ELECTRONIC COMPONENT HAVING THE SAME - Disclosed herein are a conductor pattern of an electronic component formed in an oval coil shape on a magnetic substrate, the conductor pattern including: a straight part; and a curved part connected to the straight part at both sides thereof, wherein a line width of the curved part is smaller than that of the straight part, and an electronic component including the same. With the conductor pattern and the electronic component including the same according to the present invention, the high precision fine line width and the high resolution conductor pattern may be implemented to improve connectivity, thereby improving characteristics and reliability of the electronic component. | 02-28-2013 |
20130057378 | MAGNETIC SUBSTRATE, COMMON MODE FILTER, METHOD FOR MANUFACTURING MAGNETIC SUBSTRATE AND METHOD FOR MANUFACTURING COMMON MODE FILTER - Disclosed herein are a magnetic substrate, a common mode filter, a method for manufacturing a magnetic substrate, and a method for manufacturing a common mode filter. The common mode filter includes: a coil part including an insulation layer and a conductor pattern formed in the insulation layer; and a magnetic substrate coupled to one surface or both surfaces of the coil part, wherein the magnetic substrate includes: an electrostatic absorbing layer made of an electrostatic absorbing material; a magnetic layer provided on one surface or both surfaces of the electrostatic absorbing layer and made of a magnetic material; and an electrode provided between the magnetic layer and the electrostatic absorbing layer and made of a conductive material. Therefore, common mode filter may maintain high efficiency characteristics while preventing an electrostatic discharge phenomenon. | 03-07-2013 |
20130082812 | COIL PARTS AND METHOD OF FABRICATING THE SAME - A coil part is provided. The coil part includes a coil layer including a core and a first coil and a second coil disposed on and under the core, a lower magnetic layer bonded under the coil layer, and an upper magnetic layer bonded on the coil layer. Accordingly, it is possible to improve process and productivity and cut fabrication costs by preventing process defects that occur during the fabrication process of a coil part using a ferrite substrate. | 04-04-2013 |
20130082813 | COIL PARTS - A coil part is provided. The coil part includes a coil layer, a lower magnetic layer, and an upper magnetic layer. The coil layer includes a primary coil pattern, a secondary coil pattern, and a dielectric including the primary coil pattern and the secondary coil pattern. The lower magnetic layer is disposed under the coil layer. The upper magnetic layer is disposed on the lower magnetic layer to fill up the center and the periphery of the coil layer and cover the coil layer. Accordingly, the coil part can improve filtering characteristics by more smoothly increasing a magnetic flux surrounding the coil pattern. Also, the coil part can cut fabrication costs by reducing the length of the coil pattern with respect to the same characteristics. | 04-04-2013 |
20130087179 | THERMOELECTRIC MODULE - Provided is a thermoelectric module applied to an energy storage device cooling system to increase the cooling efficiency. The thermoelectric module includes P-type thermoelectric elements and N-type thermoelectric elements disposed alternately, a metal electrode provided between each P-type thermoelectric element and each N-type thermoelectric element, a heat absorbing plate connected to a bottom side of the metal electrode located between the P-type thermoelectric element and the N-type thermoelectric element, and a heat emitting plate connected to a top side of the metal electrode located between the N-type thermoelectric element and the P-type thermoelectric element. | 04-11-2013 |
20130112651 | METHOD FOR MANUFACTURING COIL PARTS - The present invention discloses a method for manufacturing coil parts including a ferrite substrate, a conductor line formed on the ferrite substrate, and an external electrode for external electrical connection of the conductor line, including: coating a magnetic layer to cover the external electrode; planarizing a surface of the magnetic layer by mechanical polishing so that a portion of the magnetic layer remains on the external electrode; and exposing the external electrode by removing the remaining magnetic layer by chemical polishing. | 05-09-2013 |
20130113594 | STAMP FOR MANUFACTURING CONDUCTOR LINE AND VIA AND METHOD FOR MANUFACTURING COIL PARTS - The present invention discloses a stamp for manufacturing a conductor line and a via including: an imprint body portion having a plate shape; a line imprint portion continuing in a spiral shape from an outer side to a center side of the imprint body portion while projecting from one surface of the imprint body portion; and a via imprint portion projecting from an end portion of the line imprint portion positioned on the center side of the imprint body portion while projecting from one surface of the imprint body portion, and a method for manufacturing coil parts using the same. | 05-09-2013 |
20130135074 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer. | 05-30-2013 |
20130141205 | CONDUCTOR PATTERN AND COIL PARTS HAVING THE SAME - A conductor pattern of a coil part formed in a spiral shape on a magnetic substrate, which includes: a primary conductor pattern; and a secondary conductor pattern formed on the primary conductor pattern. The primary conductor pattern is formed to have a longitudinal section including a first horizontal portion and a first vertical portion electrically connected to an end portion of one surface of the first horizontal portion. The secondary conductor pattern is formed to have a longitudinal section including a second horizontal portion corresponding to the first horizontal portion and a second vertical portion electrically connected to an end portion of one surface of the second horizontal portion. | 06-06-2013 |
20130147592 | COIL PARTS AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a coil part including: a lower magnetic body; primary and secondary lower patterns formed on the lower magnetic body in a spiral shape in parallel to each other; a lower insulating layer covering the primary and secondary lower patterns; primary and secondary upper patterns electrically connected to the primary and secondary lower patterns, respectively, and formed on the lower insulating layer in a spiral shape in parallel to each other to correspond to the primary and secondary lower patterns; and an upper magnetic body formed on the primary and secondary upper patterns, wherein the primary and secondary upper patterns have portions which cross the primary and secondary lower patterns on the plane, and a method of manufacturing the same. | 06-13-2013 |
20130147595 | COIL PARTS - Disclosed herein are coil parts including: a lower magnetic substance; a primary coil pattern disposed on the lower magnetic substance; a first complex layer for covering the primary coil pattern; a secondary coil pattern correspondingly disposed on an upper side of the primary coil pattern; a second complex layer for covering the secondary coil pattern; and an insulation layer disposed between the primary coil pattern and the secondary coil pattern and blocking an electrical connection between the primary coil pattern and the secondary coil pattern. The coil parts according to the present invention can have a simple structure and processing capable of increasing magnetic permeability and accordingly improving an impedance characteristic of the coil parts, thereby implementing excellent performance and characteristic. | 06-13-2013 |
20130152379 | METHOD OF MANUFACTURING NOISE REMOVING FILTER - Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals. | 06-20-2013 |
20130154767 | FILTER FOR REMOVING NOISE - The present invention discloses a filter for removing noise, which includes: a lower magnetic substrate; a coil layer disposed on the lower magnetic substrate and including at least one conductor pattern and an insulating layer covering the conductor pattern; an upper magnetic substrate disposed on the coil layer; and a magnetic permeability enhancing layer disposed on the magnetic substrate with lower magnetic permeability of the lower magnetic substrate and the upper magnetic substrate. | 06-20-2013 |
20130154770 | FILTER FOR REMOVING NOISE AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer disposed on the lower magnetic body and including at least one conductor pattern; input and output stud terminals electrically connected to the conductor pattern for electrical input and output of the conductor pattern; and an upper magnetic body consisting of an inner upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer upper magnetic body including ferrite powder with a size corresponding to the interval between the input and output stud terminals and an outer surface of the lower magnetic body. | 06-20-2013 |
20130162371 | FILTER FOR REMOVING NOISE AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a filter for removing noise, which includes: a lower magnetic body; an insulating layer provided on the lower magnetic body and including at least one conductor pattern; and an upper magnetic body including a primary ferrite composite provided on the insulating layer and a secondary ferrite composite provided on the primary ferrite composite to cover a pore formed on a surface of the primary ferrite composite, and a method of manufacturing the same. | 06-27-2013 |
20130162385 | COIL PARTS AND METHOD OF MANUFACTURING THE SAME - The present invention discloses a coil part including: a first coil body including a first magnetic substrate, a first coil pattern provided on the first magnetic substrate, and a first insulating layer covering the first coil pattern; a second coil body including a second magnetic substrate corresponding to the first magnetic substrate, a second coil pattern provided on the second magnetic substrate to correspond to the first coil pattern, and a second insulating layer covering the second coil pattern; and a ferrite composite interposed between the first insulating layer and the second insulating layer to couple the first coil body and the second coil body and having a spacer ball inside. | 06-27-2013 |
20130169381 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same. | 07-04-2013 |
20130263440 | METHOD FOR MANUFACTURING INDUCTOR - Disclosed herein is a method for manufacturing an inductor, including: forming a coil laminate by inserting spiral coils into a guide shaft disposed at a center of a magnetic substrate; providing a molding part so as to surround the coil laminate; removing the guide shaft; and providing a ferrite composite so as to surround the molding part. | 10-10-2013 |
20130316291 | INDUCTOR AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a stacked chip inductor. According to one aspect of the present invention, provided is an inductor including: a stacked structure; and an external electrode structure formed outside of the stacked structure, wherein the stacked structure: an insulating layer; and a polymer layer is stacked on the insulating layer. | 11-28-2013 |
20140152402 | COMMON MODE NOISE CHIP FILTER AND METHOD FOR PREPARING THEREOF - Disclosed herein are a common mode noise chip filter and a method for preparing thereof, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer composite layer on the substrate provided with the coil patterns, wherein the ferrite-polymer composite layer includes spherical ferrite particles and flake shaped ferrite particles. | 06-05-2014 |
20150346874 | TOUCH SENSOR - Embodiments of the invention provide a touch sensor, including a window substrate, a low reflective layer formed on the window substrate, a first electrode pattern formed on the low reflective layer, an insulating layer formed on the first electrode pattern, and a second electrode pattern formed on the insulating layer and configured to intersect with the first electrode pattern. According to at least one embodiment, the low reflective layer is formed to correspond to a pattern in which the first electrode pattern and the second electrode pattern are overlapped with each other. | 12-03-2015 |
Patent application number | Description | Published |
20130300527 | METHOD OF MANUFACTURING COIL ELEMENT AND COIL ELEMENT - The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern. | 11-14-2013 |
20140002231 | COMMON MODE NOISE FILTER | 01-02-2014 |
20140028430 | MULTILAYER INDUCTOR AND PROTECTING LAYER COMPOSITION FOR MULTILAYER INDUCTOR - Disclosed herein are a multilayer inductor including a protecting layer including an inorganic filler having different stretching ratios in traverse and mechanical directions or an inorganic filler coated with a color former, and a protecting layer composition of a multilayer inductor, including 10 to 30 parts by weight of an inorganic filler having different stretching ratios in traverse and mechanical directions, and 10 to 30 parts by weight of a dispersant, based on 100 parts by weight of an epoxy resin, so that thermal deformation of an inductor chip can be reduced by including the inorganic filler having different stretching ratios in traverse and machine directions in the outermost insulating layer of the multilayer inductor, thereby reducing change in external appearance due to heat, thereby providing a multilayer inductor securing reliability. | 01-30-2014 |
20140035714 | FERRITE POWDER, METHOD FOR PREPARING THE SAME, AND COMMON MODE NOISE FILTER INCLUDING THE SAME AS MATERIAL FOR MAGNETIC LAYER - Disclosed herein are a ferrite powder not including pores in a surface thereof, a method for preparing the same, and a common mode noise filter including the same as a material for a magnetic layer. The spherical ferrite powder in which the pores in the surface thereof are removed as a magnetic layer of the common mode noise filter has high density, such that dispersibility is improved, thereby making it possible to improve adhesive strength with a polymer binder to be mixed. In addition, the adhesive strength between the polymer binder and the ferrite powder is improved, such that at the time of manufacturing or mounting of a chip, a defect such as a crack generated by a thermal impact due to a lack of adhesive strength between the ferrite powder and the polymer binder may be suppressed, thereby securing the reliability with respect to the thermal impact. | 02-06-2014 |
20140062637 | Common Mode Filter With ESD Protection Pattern Built Therein - Disclosed herein is a common mode filter with an ESD protection pattern built therein. The common mode filter includes a base substrate that is made of an insulating material, a first insulating layer that is formed on the base substrate, a coil-shaped internal electrode that is formed on the first insulating layer, a second insulating layer that is formed on the internal electrode, a first external electrode terminal that is formed on the second insulating layer, a first ferrite resin layer that is formed on the second insulating layer and receives the first external electrode terminal, an ESD protection pattern that is formed on the first external electrode terminal, a second external electrode terminal that is formed on the ESD protection pattern, and a second ferrite resin layer that is formed on the first ferrite resin layer and receives the second external electrode terminal. | 03-06-2014 |
20140132366 | FILTER CHIP ELEMENT AND METHOD OF PREPARING THE SAME - Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components. | 05-15-2014 |
20140133107 | THIN FILM TYPE CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other. | 05-15-2014 |
20140145797 | COMMON MODE NOISE CHIP FILTER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a common mode noise chip filter and a method for manufacturing the same, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer complex layer formed on the result substrate having the coil patterns formed therein, wherein the ferrite-polymer complex layer has a multilayer structure, so that the ferrite-polymer complex layer filling an inner space of the substrate having inner coil patterns is formed to have the multilayer structure but not a single-layer structure, thereby lowering internal stress, and thus improving reliability of the common mode noise chip filter as a product. | 05-29-2014 |
20140145814 | THIN FILM TYPE CHIP DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a thin film type chip device including a coil pattern formed on the substrate; a cavity defining pattern defining a cavity through which a part of the coil pattern is exposed; a filling layer filled in the cavity; and a magnetic layer including a surface layer covering a surface of the filling layer. | 05-29-2014 |
20140146439 | ELECTRODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME, AND ENERGY STORAGE DEVICE INCLUDING THE ELECTRODE STRUCTURE - Disclosed herein is an electrode structure for an energy storage device, the electrode structure including a current collector and an active material layer formed on the current collector, the active material layer including a carbon material and metal particles formed on the carbon material. | 05-29-2014 |
20140159565 | ELECTROSTATIC DISCHARGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electrostatic discharging structure including single-wall carbon nano tubes disposed between electrodes at a predetermined interval to precisely control discharge starting voltage generating a discharge phenomenon between electrodes, and a method of manufacturing an electrostatic discharging structure. | 06-12-2014 |
20140159849 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electronic component and a method of manufacturing the same. In the electronic component having a hexahedral shape and including an insulating portion formed on an upper part of a base substrate, a coil pattern portion formed in the insulating portion and wound with a conductive wire, and a plurality of external electrodes separated from each other and electrically connected with the coil pattern portion, each external electrode covers a part of an upper surface of the insulating portion and extending to an upper surface of the electronic component and a region between the external electrodes is provided with a ferrite block covering an exposed surface of the insulating portion, thereby improving magnetic permeability as compared with the electronic component of the related art. | 06-12-2014 |
20140184377 | INDUCTOR - Disclosed herein is an inductor including: a substrate; an insulating part provided on the substrate; and a conductive pattern part provided in the insulating part, wherein the insulating part includes first and second insulating parts that are provided at regions physically separated from each other, the first and second insulating parts being made of materials of which at least one of dielectric constant and heat resistance are different. In the inductor according to the present invention, high Q and L values may be implemented, and deformation by heat treatment may also be decreased, thereby making it possible to improve reliability. | 07-03-2014 |
20150187485 | THIN FILM-TYPE COIL COMPONENT AND METHOD OF FABRICATING THE SAME - There is provided a thin film-type coil component having a size equal to or less than 0806 and including a ceramic main body, external electrodes including a plurality of first external electrodes formed on one surface of the ceramic main body and a plurality of second external electrodes formed on the other surface facing one surface of the ceramic main body, and a coil unit including a plurality of coil layers stacked in the ceramic main body, thereby obtaining low direct current (DC) resistance. | 07-02-2015 |
20150294785 | COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same. | 10-15-2015 |