Patent application number | Description | Published |
20140252602 | STRUCTURE OF A SEMICONDUCTOR CHIP WITH SUBSTRATE VIA HOLES AND METAL BUMPS AND A FABRICATION METHOD THEREOF - A structure of a semiconductor chip with substrate via holes and metal bumps and a fabrication method thereof. The structure comprises a substrate, at least one backside metal layer, at least one first metal layer, at least one electronic device, and at least one metal bump. The substrate has at least one substrate via hole penetrating through the substrate. The at least one first metal layer and electronic device are formed on the front side of the substrate. The at least one metal bump is formed on the at least one first metal layer. The at least one backside metal layer is formed on the backside of the substrate covering the inner surface of the substrate via hole and at least part of the backside of the substrate and connected to the first metal layer on the top of the substrate via hole. | 09-11-2014 |
20150206870 | SEMICONDUCTOR INTEGRATED CIRCUIT - The present invention relates to a compound semiconductor integrated circuit chip having a front and/or back surface metal layer used for electrical connection to an external circuit. The compound semiconductor integrated circuit chip (first chip) comprises a substrate, an electronic device layer, and a dielectric layer. A first metal layer is formed on the front side of the dielectric layer, and a third metal layer is formed on the back side of the substrate. The first and third metal layer are made essentially of Cu and used for the connection to other electronic circuits. A second chip may be mounted on the first chip with electrical connection made with the first or the third metal layer that extends over the electronic device in the first chip in the three-dimensional manner to make the electrical connection between the two chips having connection nodes away from each other. | 07-23-2015 |
20150318342 | HIGH BREAKDOWN VOLTAGE METAL-INSULATOR-METAL CAPACITOR - A high breakdown voltage metal-insulator-metal capacitor for compound semiconductor integrated circuit comprises a substrate, an isolation layer, a first metal layer, a dielectric layer, an adhesion layer and a second metal layer. The dielectric layer is formed by alternately stacking plural HfO | 11-05-2015 |
20160035707 | STACKED STRUCTURE OF SEMICONDUCTOR CHIPS HAVING VIA HOLES AND METAL BUMPS - A stacked structure comprises a semiconductor chip which includes a substrate having at least one substrate via hole penetrating through the substrate; at least one backside metal layer formed on a backside of the substrate covering an inner surface of the substrate via hole and at least part of the backside of the substrate; at least one front-side metal layer formed on the front-side of the substrate and electrically connected to the at least one backside metal layer on a top of at least one of the at least one substrate via hole; at least one electronic device formed on the front-side of the substrate and electrically connected to the at least one front-side metal layer; and at least one metal bump formed on at least one of the backside metal layer and the front-side metal layer. | 02-04-2016 |
Patent application number | Description | Published |
20100035405 | Method for mounting a thinned semiconductor wafer on a carrier substrate - A method for mounting a thinned semiconductor wafer on a carrier substrate for further processing is disclosed. The method consists of a series of steps, which is based on providing a frame with a double-side tape to mount the thinned wafer on the carrier substrate. The frame is used to support the double-side tape and can be designed to fit the conventional production line for holding, picking and transferring wafers. The carrier substrate can be a sapphire substrate, a quartz substrate or other substrates that can sustain further processing, such as thermal treatments and/or chemical etchings. The method of the present invention not only prevents possible damages to the highly brittle chip after wafer thinning, but also fits the conventional production line for processing semiconductor wafers. | 02-11-2010 |
20110059610 | Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film - A method of backside metal process for semiconductor electronic devices, particularly of using an electroless plating for depositing a metal seed layer for the plated backside metal film. The backside of a semiconductor wafer, with electronic devices already fabricated on the front side, is first coated with a thin metal seed layer by electroless plating. Then, the backside metal layer, such as a gold layer or a copper layer, is coated on the metal seed layer. The metal seed layer not only increases the adhesion between the front side metal layer and the backside metal layer through backside via holes, but also prevents metal peeling after subsequent fabrication processes. This is helpful for increasing the reliability of device performances. Suitable materials for the metal seed layer includes Pd, Au, Ni, Ag, Co, Cr, Cu, Pt, or their alloys, such as NiP, NiB, AuSn, Pt—Rh and the likes. | 03-10-2011 |
20110201192 | METHOD OF PROCESSING BACKSIDE COPPER LAYER FOR SEMICONDUCTOR CHIPS - A method of processing copper backside metal layer for semiconductor chips is disclosed. The backside of a semiconductor wafer, with electronic devices already fabricated on the front side, is first coated with a thin metal seed layer by either electroless plating or sputtering. Then, the copper backside metal layer is coated on the metal seed layer. The metal seed layer not only increases the adhesion between the front side metal layer and the copper backside metal layer through backside via holes, but also prevents metal peeling from semiconductor's substrate after subsequent fabrication processes, which is helpful for increasing the reliability of device performances. Suitable materials for the metal seed layer includes Pd, Au, Ni, Ag, Co, Cr, Pt, or their alloys, such as NiP, NiB, AuSn, Pt—Rh and the likes. The use of Pd as seed layer is particularly useful for the copper backside metal layer, because the Pd layer also acts as a diffusion barrier to prevent Cu atoms entering the semiconductor wafer. | 08-18-2011 |
20130034959 | ELECTROLESS PLATING APPARATUS AND METHOD - An electroless plating apparatus and method designed specifically for plating at least one semiconductor wafer are disclosed. The apparatus comprises a container, a wafer holder, an electrolyte supplying unit, and an ultrasonic-vibration unit. The container is provided with at least an inlet and used for containing electrolyte. The wafer holder is provided within the container. The electrolyte supplying unit is used to supply the electrolyte into the container via the inlet. The ultrasonic-vibration unit consisting of at least one frequency ultrasonic transducer is disposed in the container for producing a uniform flow of electrolyte in the container. Thereby, the wafers can be uniformly plated, especially for wafers with fine via-holes or trench structures. | 02-07-2013 |
20130099250 | STRUCTURE OF SEMICONDUCTOR CHIPS WITH ENHANCED DIE STRENGTH AND A FABRICATION METHOD THEREOF - An improved structure of semiconductor chips with enhanced die strength and a fabrication method thereof are disclosed. The improved structure comprises a substrate, an active layer, and a backside metal layer, in which the active layer is formed on the front side of the substrate and includes at least one integrated circuit; the backside metal layer is formed on the backside of the substrate, which fully covers the area corresponding to the area covered by the integrated circuits in the active layer. By using the specific dicing process of the present invention, the backside metal layer and the substrate can be diced tidily. Die cracking on the border between the substrate and the backside metal layer of the diced single chip can be prevented, and thereby the die strength can be significantly enhanced. | 04-25-2013 |
20130277845 | STRUCTURE OF BACKSIDE COPPER METALLIZATION FOR SEMICONDUCTOR DEVICES AND A FABRICATION METHOD THEREOF - An improved structure of backside copper metallization for semiconductor devices and a fabrication method thereof, in which the improved structure comprises sequentially from top to bottom an active layer, a substrate, a backside metal seed layer, at least one thermal expansion buffer layer, a backside metal layer, and at least one oxidation resistant layer, in which the backside metal seed layer is formed of Pd, and the thermal expansion coefficient of the thermal expansion buffer layer is in the range between the thermal expansion coefficients of the backside metal seed layer and of the backside metal layer. The semiconductor chip using the structure provided by the present invention can sustain high-temperature operations. | 10-24-2013 |
20130337634 | FABRICATION METHOD FOR PRODUCING SEMICONDUCTOR CHIPS WITH ENHANCED DIE STRENGTH - A fabrication method for producing semiconductor chips with enhanced die strength comprises following steps: forming a semiconductor wafer with enhanced die strength by comprising the substrate, the active layer on the front side of the substrate and the backside metal layer on the backside of the substrate, wherein at least one integrated circuit forms in the active layer; forming a protection layer on a front side of the semiconductor wafer; dicing the semiconductor wafer by at least one laser dicing process and removing the laser dicing residues and removing said protection layer by at least one etching process, whereby plural semiconductor chips with enhanced die strength are produced, and wherein the backside metal layer of said semiconductor chip fully covers the backside of said semiconductor chip after dicing. | 12-19-2013 |
20140209926 | SEMICONDUCTOR INTEGRATED CIRCUIT - A compound semiconductor integrated circuit chip has a front and/or back surface metal layer used for electrical connection to an external circuit. The compound semiconductor integrated circuit chip (first chip) comprises a substrate, an electronic device layer, and a dielectric layer. A first metal layer is formed on the front side of the dielectric layer, and a third metal layer is formed on the back side of the substrate. The first and third metal layer are made essentially of Cu and used for the connection to other electronic circuits. A second chip may be mounted on the first chip with electrical connection made with the first or the third metal layer that extend over the electronic device in the first chip in the three-dimensional manner to make the electrical connection between the two chips having connection nodes away from each other. | 07-31-2014 |
Patent application number | Description | Published |
20130186665 | SWITCH MECHANISM FOR A PNEUMATIC TOOL - A switch mechanism for a pneumatic tool includes a rotating body and a lever. The rotating body has a surface, wherein a combining portion is disposed on the surface. The lever is slidably disposed in the combining portion, wherein the lever includes a first operating end and a second operating end, and either one of the first operating end and the second operating end protruding from the pneumatic tool or both the first operating end and the second operating end protruding from the pneumatic tool are controlled by pushing the lever along an extending direction of the combining portion. | 07-25-2013 |
20140090861 | Pneumatic Tool Having a Two-Stage Trigger Device - A two-stage trigger device includes a trigger mounted on a body. Upon application of an external force, the trigger is rotated from a first position to a second position to move a rod member along an axis by a first distance, so as to open a passage to a predetermined degree. When the trigger reaches the second position, and when application of the external force is continued, at least one portion of the trigger moves in the body to move the rod member along the axis by a second distance, such that the opening degree of the passage is increased gradually. | 04-03-2014 |
20140110142 | PNEUMATIC TOOL HAVING A TWO-STAGE FLOW CONTROL - A pneumatic tool includes a body, a switch valve, and a trigger. The body has a passage. The switch valve includes a plug sealing the passage, a plug rod connected to the plug, and a rod member extending in the body along an axis for driving the plug rod and the plug, such that movement of the rod member in the body in a direction results in a gradual increase in flow rate of the gas in the passage. The plug rod is connected to the rod member such that an angle is formed therebetween. The trigger includes a first plate and a second plate. The first plate is operable manually to covert between a first position whereat the second plate cannot be driven by the first plate, and a second position whereat the second plate can be driven by the first plate. | 04-24-2014 |
20140283932 | PNEUMATIC TOOL DRIVING ASSEMBLY - A pneumatic tool driving assembly comprises: a valve housing defining first and second chambers and a valve opening; a valve mechanism including a valve actuator that extends into the valve housing, and a valve member that is disposed for closing the valve opening and that is actuated by the valve actuator to uncover the valve opening; and a trigger mechanism pivoted to an exterior of the valve housing so as to be pressible relative to the valve housing. The trigger mechanism includes a detachable wrench that is spaced apart from the valve housing, and a pivot joint that is pivoted to the valve housing and that brings the wrench to pivot relative to the valve housing. | 09-25-2014 |
20150190917 | MULTI-STAGE TRIGGER ASSEMBLY FOR USE IN A PNEUMATIC TOOL - A trigger assembly used in a pneumatic tool that includes a valve unit blocking removably a flow channel, includes a driving member, a trigger member and a positioning unit. The driving member is movable for actuating the valve unit to gradually unblock the flow channel. The trigger member is pressable to move relative to a tool body of the pneumatic tool and the driving member to drive movement of the driving member. The positioning unit includes first and second positioning structures interengaged for providing an indication when the trigger member is pressed to move the driving member to a certain position. | 07-09-2015 |
Patent application number | Description | Published |
20130077055 | PHOSPHOR DEVICE AND ILLUMINATION SYSTEM AND PROJECTION APPARATUS WITH THE SAME - A phosphor device of an illumination system is provided. The illumination system emits a first waveband light and has an optical path. The phosphor device includes a first section and a first phosphor agent. The first phosphor agent is coated on the first section. After the first waveband light is received by the first phosphor agent, the first waveband light is converted into a third waveband light, and the third waveband light is directed to the optical path, so that the third waveband light is separated into at least two color lights along the optical path. | 03-28-2013 |
20140293244 | LIGHTING SYSTEM AND DIGITAL CINEMA PROJECTION APPARATUS EMPLOYING SAME - A lighting system for a digital cinema projection apparatus is provided. The lighting system includes an ultra high pressure mercury lamp, a relay lens group, a digital micro display module, an optical filter module, and a projection lens. The ultra high pressure mercury lamp is used for emitting a light beam. The relay lens group is used for receiving the light beam and adjusting an optical path of the light beam. The optical filter module is arranged along the optical path of the lighting system for optically modulating an optical spectrum and/or a white balance of the light beam from the ultra high pressure mercury lamp. The projection lens is used for projecting the modulated light beam as an image beam. | 10-02-2014 |
20140375961 | PHOSPHOR DEVICE AND ILLUMINATION SYSTEM AND PROJECTION APPARATUS WITH THE SAME - A phosphor device of an illumination system is provided. The illumination system emits a first waveband light and has an optical path. The phosphor device includes a first section and a first phosphor agent. The first phosphor agent is coated on the first section. After the first waveband light is received by the first phosphor agent, the first waveband light is converted into a third waveband light, and the third waveband light is directed to the optical path, so that the third waveband light is separated into at least two color lights along the optical path. | 12-25-2014 |
20150153487 | WAVELENGTH-CONVERTING DEVICE - A wavelength-converting device includes a substrate and a reflective layer. The reflective layer is disposed on the substrate, among which when an operating temperature of the reflective layer is higher than or equal to 130° C., the reflective layer is formed of a first metallic material, and when the operating temperature of the reflective layer is lower than 130° C., the reflective layer is formed of a second metallic material. The reflectivity of the second metallic material is higher than the reflectivity of the first metallic material at room temperature. By forming the reflective layer of the first metallic material and the second metallic material at different operating temperatures, respectively, the decay of the reflectivity is effectively avoided, the reflectivity is optimized, and the converting efficiency of the wavelength-converting device is enhanced. | 06-04-2015 |
Patent application number | Description | Published |
20090284986 | LIGHT GUIDE PLATE AND BACKLIGHT MODULE - A light guide plate has a light emitting surface, a bottom surface and a first and a second light incident surfaces connected to the light emitting surface and the bottom surface. The bottom surface approaches the light emitting surface gradually along a first direction away from the first light incident surface and along a second direction away from the second light incident surface, or is away from the light emitting surface gradually along the first direction and the second direction. The light guide plate includes a plurality of first and second hollow portions disposed on the light emitting surface. The first hollow portions are arranged on a first axis. The second hollow portions are arranged on a second axis. A plurality of orthogonal projections of the second hollow portions formed on the first axis and the first hollow portions are alternately arranged. | 11-19-2009 |
20090302618 | LOCKING DEVICE - A locking device disposed on a casing and suitable for buckling up with a detachable object is provided. The locking device includes a base, an actuating element, and a driven latch. The base has a body fixed at the casing and a first slide track passing through the body. The actuating element has a first sliding block passing through the body and moves between a first position and a second position along a first axis via the first sliding block slidingly connected to the first slide track. The driven latch is slidingly disposed at the base and slides between a third position and a fourth position along a second axis. The driven latch and the actuating element are located at two opposite sides of the base. The driven latch has a second slide track and a locking portion. The first sliding block is slidingly connected to the second slide track. | 12-10-2009 |
20110006650 | SHIELDING STRUCTURE FOR HOUSING - A shielding structure for a housing includes a number of elastic conductive elements, at least one carrier, and a cover. The elastic conductive elements are distributed along a periphery of an opening portion of the housing. Each elastic conductive element includes a soft material and a conductive material wrapping the soft material. The at least one carrier fixes the elastic conductive elements to the periphery of the opening portion. The cover covers the opening portion and has a conductive layer electrically connected to each conductive material. | 01-13-2011 |
Patent application number | Description | Published |
20130094308 | NEGATIVE WORD LINE DRIVER FOR SEMICONDUCTOR MEMORIES - A semiconductor memory includes a word line driver and a negative voltage generator. The word line driver includes a first inverter configured to drive a word line at one of a first voltage supplied by a first voltage source and a second voltage supplied by a second voltage source. The negative voltage generator is configured to provide a negative voltage with respect to the second voltage to an input of the first inverter in response to a control signal for performing at least one of a read or a write operation of a memory bit cell coupled to the word line. | 04-18-2013 |
20140092695 | HEADER CIRCUIT FOR CONTROLLING SUPPLY VOLTAGE OF A CELL - One or more techniques or systems for controlling a supply voltage of a cell are provided herein. Additionally, one or more techniques or systems for mitigating leakage of the cell are provided. In some embodiments, a header circuit is provided, including a first pull-up p-type metal-oxide-semiconductor (PMOS) transistor including a first gate, a first source, and a first drain. Additionally, the header circuit includes a second pull-down PMOS transistor including a second gate, a second source, and a second drain. In some embodiments, the first drain of the first pull-up PMOS transistor is connected to the second source of the second pull-down PMOS transistor and a supply voltage line for one or more cells. In this manner, a pull-down PMOS is configured to control the supply voltage of the cell, thus facilitating voltage control for a write assist, for example. | 04-03-2014 |
20140269115 | Integrated Write Mux and Driver Systems and Methods - An integrated driver system is disclosed. The driver system includes decoding logic and a driver portion. The decoding logic is configured to receive select signals and data signals. The driver portion is configured to generate driver signals according to the decoded signals. | 09-18-2014 |
Patent application number | Description | Published |
20130171275 | USE OF BAMBOO VINEGAR FOR TREATING INFLAMMATION - The preset invention relates to a method for treating inflammation comprising administering a subject in need thereof with a therapeutically effective amount of a composition comprising bamboo vinegar or the phenolic fraction thereof. The method for preparing the phenolic fraction is also provided. | 07-04-2013 |
20140343167 | USE OF CITRAL FOR TREATING FOCAL SEGMENTAL GLOMERULOSCLEROSIS - The present invention relates to a new use of citral for manufacturing a medicament for treating focal segmental glomerulosclerosis (FSGS). Particularly, the present invention discloses that citral is effective in alleviating symptoms of FSGS, including reducing glomerular epithelial hyperplasia lesions (EPHLs), peri-glomerular inflammation or glomerular hyalinosis or sclerosis, and also reducing proteinuria or hematuria or lowering serum urea nitrogen level or serum creatinine level in the subject. | 11-20-2014 |
20150284355 | USE OF POLYENYLPYRROLE DERIVATIVES FOR TREATING INFLAMMATION - The preset invention relates to a method for treating inflammation comprising administering a subject in need thereof with a therapeutically effective amount of polyenylpyrrole derivatives of formula (I) or a pharmaceutically acceptable salt thereof. | 10-08-2015 |
20150297560 | USE OF OSTHOLE FOR TREATING FOCAL SEGMENTAL GLOMERULOSCLEROSIS - The present invention relates to use of osthole for manufacturing a composition for treating focal segmental glomerulosclerosis (FSGS). Particularly, the present invention discloses that osthole is effective in treating focal segmental glomerulosclerosis (FSGS), which can alleviate various symptoms and signs of FSGS, including proteinuria, renal fibrosis, glomerular epithelial hyperplasia lesion (EPHL), and macrophage/lymphocyte infiltration in the kidney, etc. | 10-22-2015 |
20150299242 | USE OF HYDROXYCINNAMALDEHYDE GLYCOSIDE DERIVATIVES FOR TREATING GLOMERULONEPHRITIS - The present invention relates to a new use of a cinnamaldehyde derivative of formula (I) for treating glomerulonephritis (GN). Particularly, the present invention discloses that the cinnamaldehyde derivative of formula (I) is effective in treating glomerulonephritis (GN), which can alleviate various symptoms and signs of GN, including reducing proteinuria, serum blood urea nitrogen (BUN), glomerular cell proliferation, and renal macrophage/lymphocyte infiltration, etc. | 10-22-2015 |
Patent application number | Description | Published |
20080205082 | Super-thin light-guiding module with a side light-projecting type function - A super-thin light-guiding module with a side light-projecting function includes: a transparent elastic element, at least one light-emitting element, a displaying layer, and an elastic filling layer. The transparent elastic element has a plurality of light-guiding microstructures formed on a bottom thereof. The light-emitting element is disposed beside one side of the transparent elastic element. The displaying layer is disposed on a top side of the transparent elastic element, and the displaying layer has a plurality of transparent portions. The elastic filling layer is disposed between the transparent elastic element and the displaying layer. Therefore, when the light-emitting element projects a light to the transparent elastic element, the light is guided upward via the light-guiding microstructures of the transparent elastic element for making the light pass through the elastic filling layer and the transparent portions of the displaying layer. | 08-28-2008 |
20090065335 | Multi-functional keypad module for a mobile phone - A multi-functional keypad module for a mobile phone includes a circuit board, a light-emitting element, a soft light-guiding rubber layer, an optical touch layer, and a key layer. The soft light-guiding rubber layer is provided on the circuit board and has a plurality of protrusions each corresponding to the circuit board; thereby a feedback feeling from a pressing action and a light-guiding effect can be obtained. The optical touch layer is provided on the soft light-guiding rubber layer, in order to continue the optically enhanced touch-control and the feedback feeling. The key layer is provided on the optical touch layer, with a plurality of keys respectively corresponding to one of the protrusion, thereby completes and achieves the optically enhanced touch-control effect and feedback feeling. Via the above arrangement, the keypad module of a mobile phone has multiple functions of light guiding, touch-control, and feedback feeling from a pressing action. | 03-12-2009 |
Patent application number | Description | Published |
20120031774 | ELECTRODE FOR AN ELECTROCHEMICAL DEVICE AND METHOD FOR DETECTING HYDROGEN PEROXIDE USING THE ELECTRODE - An electrode for an electrochemical device includes a conductor, and an active layer formed on the conductor and including a polybenzimidazole polymer that contains at least one of the functional group of the following formula: | 02-09-2012 |
20120035333 | CARBOXYLIC POLYBENZIMIDAZOLE - A carboxylic polybenzimidazole includes at least one of the following functional group of formula (I): | 02-09-2012 |
20120035334 | METHOD FOR PREPARING CARBOXYLIC POLYBENZIMIDAZOLE - A method for preparing a carboxylic polybenzimidazole includes reacting a polybenzimidazole polymer with a cyclic acid anhydride to form the carboxylic polybenzimidazole. | 02-09-2012 |
20120095325 | TREATMENT OF BRAIN DISEASES VIA ULTRASOUND/MAGNETIC TARGETING DELIVERY AND TRACING OF THERAPEUTIC AGENTS - Disclosed herein is a method for treating a brain disease in which focused ultrasound and magnetic targeting are applied to a subject in need of such treatment, so that therapeutic agent-magnetic nanoparticle composites are directed across the blood-brain barrier to a designated locus inside the brain of the subject. Each of the composites includes a magnetic nanoparticle that is formed of an iron-based core and a shell encapsulating the iron-based core, and a therapeutic agent that is bound to the shell of the magnetic nanoparticle. The magnetic nanoparticle has a size ranging from 5 to 200 nm. The iron-based core has a crystalline structure that imparts the composites with a sufficiently high magnetization, thereby enhancing magnetic targeting of the composites to the designated locus inside the brain of the subject. The magnetic targeting treatment is conducted via a magnet providing a magnetic flux density not less than 0.18 T. | 04-19-2012 |
20130270112 | POLYAMIC ACID AND ELECTRODE FOR DETECTING HYDROGEN PEROXIDE - This invention is directed to a polyamic acid represented by the following formula (I), and an electrode having an active layer made from the polyamic acid of formula (I). | 10-17-2013 |
Patent application number | Description | Published |
20110101282 | WATER-SOLUBLE SELF-ACID-DOPED POLYANILINE BLENDS - The present invention provides a water-soluble self-acid-doped polyaniline blends, comprising a 70-90% weight percentage polyaniline derivative and 10-30% weight percentage at least a water-soluble polymer. The blend can be used to produce a conductive polymer film and/or a conductive-polymer composite film. In the present invention, a water-soluble self-acid-doped polyaniline derivative is blended with a water-soluble polymer to enhance the mechanical properties and the coating-to-substrate adhesion of the electric conductive polymer film or the electric conductive-polymer composite film, and increase the conductivity of the blender. In addition, the blend containing a water-soluble self-acid-doped polyaniline of the present invention is biotoxicity-free and has free radical-capture capability. Thus it can be used as a biocompatible and conductive biomedical material. | 05-05-2011 |
20110104294 | Magnetic nanocomposite for inhibiting/treating cancer and method for fabricating the same - The present invention discloses a magnetic nanocomposite for inhibiting/treating cancer and a method for fabricating the same. The magnetic nanocomposite comprises a core formed of a plurality of magnetic nanoparticles made of ferric ferrous oxide (Fe | 05-05-2011 |
20120328705 | MAGNETIC NANOMEDICINE FOR TUMOR SUPPRESSION AND THERAPY - A magnetic nanomedicine for tumor suppression and therapy, comprising: a core, made of magnetic nanoparticles; a shell, encapsulating said core and is made of carboxylated polyaniline (SPAnH); and a tumor suppression medicine Epirubicin (EPI) or Doxorubicin (DOX) covalently bonded onto said shell. Said magnetic nanomedicine is capable of improving its thermal stability, and it can be dissolved uniformly in water, plus its superparamagnetic property, thus it can be guided by an outside magnetic field to concentrate to the site of tumor distribution to increase the local medicine concentration and enhance therapy effect. | 12-27-2012 |
20130137894 | CHEMICALLY-MODIFIED GRAPHENE AND METHOD FOR PRODUCING THE SAME - A chemically-modified graphene includes a graphene layer and a plurality of functional groups that are grafted to the graphene layer and each of which is represented by —CO—R—COOH, wherein R is an optionally substituted C | 05-30-2013 |
Patent application number | Description | Published |
20110104077 | Magnetic nanocomposite with multi-biofunctional groups and method for fabricating the same - The present invention proposes a magnetic nanocomposite with multi-biofunctional groups, which comprises a core and a shell wrapping the core, wherein the core contains magnetic nanoparticles, and wherein the shell is made of a conductive polymer with multi-biofunctional groups where a medicine, an antibody or a fluorescent label can be attached. | 05-05-2011 |
20120261273 | ELECTRODE FOR ELECTROCHEMICAL DEVICE AND METHOD FOR DETECTING HYDROGEN PEROXIDE - An electrode for an electrochemical device includes a conductor and an active layer. The active layer is formed on the conductor and includes a polymer with a functional group represented by the following formula (A) or (B), and a carboxylated material containing a carboxylic acid group. | 10-18-2012 |
20130011485 | MAGNETIC NANOMEDICINE FOR INHIBITING/TREATING HUMAN PROSTATE CANCER - The present invention discloses a magnetic nanomedicine for inhibiting/treating human prostate cancer, which comprises a core containing a magnetic particle having a diameter of less than 10 nm; a shell made of a carboxylated polyaniline and encapsulating the core; and a medicine covalently linked to the shell and able to inhibit/treat prostate cancer. The magnetic nanomedicine of the present invention not only has superior thermal stability and but also has water solubility higher than that of the conventional anti-prostate cancer medicine. Further, the magnetic nanomedicine of the present invention can be magnetically conducted to the cancer area to increase the local concentration of medicine and enhance the therapeutic effect. | 01-10-2013 |
20130251814 | MAGNETIC NANODRUG FOR TREATING THROMBOSIS - The present invention discloses a magnetic nanodrug for treating thrombosis, which comprises a core formed of magnetic nanoparticles, a shell enveloping the core and made of carboxyl-functionalized polyaniline, and a thrombosis-treatment drug covalently bonded to the shell. The magnetic nanodrug of the present invention is non-toxic to vascular endothelial cells, has superior stability, features superparamagnetism, and can be uniformly dissolved in water. Therefore, the magnetic nanodrug for treating thrombosis can be guided by an external magnetic field to concentrate on a specified region and increase the effect of thrombosis treatment. | 09-26-2013 |
Patent application number | Description | Published |
20080225533 | LIGHT MODULES - Light modules are provided. A light module includes a circuit board, a lighting element electrically connected to the circuit board, and a first thermal plate. The circuit board has a through hole communicating a first side and a second side thereof. The lighting element is disposed on the first side of the circuit board and located corresponding to the through hole. The first thermal plate is disposed on the second side of the circuit board, opposite to the first side, and comprises a first protrusion extending through the through hole and connecting the lighting element. | 09-18-2008 |
20100073940 | CONVERGING ELEMENT FOR LED - A converging element for an LED is described, which is used for converging light rays emitted from a light-emitting chip to enable the light rays to form approximately parallel light rays after passing through the converging element. The converging element for LED includes a cylinder and a first lens. The cylinder is disposed on the light-emitting chip. The first lens is disposed on the other end of the cylinder opposite to the light-emitting chip. The first lens has a first plane and a first curved surface opposite to each other. The first plane of the first lens is attached to the cylinder. | 03-25-2010 |
20130135854 | ILLUMINATION DEVICE - An illumination device includes a base, a flexible circuit board disposed on the base, and a plurality of illumination units. The flexible circuit board has a plurality of first branches and at least one second branch which are connected together. Each of the first branches has a radius of curvature, and the radii of curvature of the first branches are different from or identical to one another, so that the first branches are assembled to form a curved surface. The second branch extends from one of the first branches. After the first branches are assembled, the second branch is overlapped with another first branch. The illumination units are packaged onto the first branches of the flexible circuit board. Here, the illumination units located on one of the first branches is electrically connected to the illumination units located on another of the first branches through the second branch. | 05-30-2013 |