Patent application number | Description | Published |
20120061833 | EMBEDDED BALL GRID ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad. | 03-15-2012 |
20120073747 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided. | 03-29-2012 |
20120075818 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided. | 03-29-2012 |
20120160550 | PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - Disclosed is a printed circuit board having an embedded electronic component, which includes a first insulating layer, an electronic component disposed in an opening formed in a thickness direction of the first insulating layer and having a metal bump, a polymer layer formed on one side of the first insulating layer and on which the electronic component is seated so that the metal bump of the electronic component perforates the polymer layer, a second insulating layer formed on the other side of the first insulating layer so as to embed the electronic component, a first circuit layer formed on the second insulating layer, and a second circuit layer formed on the polymer layer so as to be directly electrically connected to the metal bump that perforates the polymer layer, and in which roughness is formed on the polymer layer so that the force of adhesion of the polymer layer to a plating layer is enhanced, thus ensuring reliability of the electrical connection of a circuit layer which is subsequently formed. | 06-28-2012 |
20130320516 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a semiconductor package and a method of manufacturing the same, the semiconductor package including: a molding member having a cavity formed therein; a device mounted in the cavity; an insulating member formed inside the cavity and on and/or beneath the molding member and the device; a circuit layer formed on the insulating member, and including vias and connection pads electrically connected with the device; a solder resist layer formed on the circuit layer, and having openings exposing upper portions of the connection pads; and solder balls formed in the openings. | 12-05-2013 |
20140170815 | EMBEDDED BALL GRID ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed herein are an embedded ball grid array substrate and a manufacturing method thereof. The embedded ball grid array includes: a core layer having a cavity therein; a semiconductor device embedded in the cavity of the core layer; a first circuit layer having a circuit pattern including a wire bonding pad formed thereon; a second circuit layer having a circuit pattern including a solder ball pattern formed thereon; and a wire electrically connecting the semiconductor device to the wire bonding pad. | 06-19-2014 |
Patent application number | Description | Published |
20090294956 | Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof - Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin. | 12-03-2009 |
20090301767 | Printed circuit board and method of manufacturing the same - Disclosed is a printed circuit board including bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder. A method of manufacturing the printed circuit board is also provided. The printed circuit board includes bumps formed using the conductive paste having carbon nanotubes, and can realize good electrical connection with electronic parts mounted thereon. The bumps can be formed at a fine pitch, thus realizing a circuit layer having a high density. | 12-10-2009 |
20090308650 | Printed circuit board and method of manufacturing the same - The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved. | 12-17-2009 |
20100230146 | CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties. | 09-16-2010 |
20110308069 | Method of manufacturing cooling fin and package substrate with cooling fin - A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object. | 12-22-2011 |
20120148960 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps. | 06-14-2012 |
Patent application number | Description | Published |
20110151201 | TRANSPARENT ELECTRODE FILM AND METHOD OF MANUFACTURING THE SAME - Disclosed is a transparent electrode film for a touch screen, which includes a transparent substrate, an assistant adhesive layer formed on each of both surfaces of the transparent substrate, and a transparent conductive polymer layer formed on the assistant adhesive layer, thus obviating a need for an optically clear adhesive film and resulting in increased transmittance and superior price competitiveness. A method of manufacturing the transparent electrode film is also provided. | 06-23-2011 |
20110205166 | TOUCH PANEL - Disclosed is a touch panel, which includes a transparent conductive film, electrodes printed at both ends of the transparent conductive film, and a substrate having a wiring connected to the electrodes and formed in a multilayer therein, and surrounding the transparent conductive film at the inner peripheral surface thereof, so that the use of the substrate having the wiring in multilayer form enables a plurality of wirings necessary for multi touch to be formed even under conditions of a thin bezel size, thus satisfying the trend which is reducing the size of electronic products. | 08-25-2011 |
20110227860 | RESISTIVE TOUCH SCREEN - Disclosed herein is a resistive touch screen, including: a large-area touch screen formed by connecting two or more single touch screens, each including a first substrate and a second substrate which are respectively coated with transparent electrodes on one side thereof and face each other, on the same level; a plurality of first dot spacers formed on first connection parts at which the first substrates are connected with each other and supporting second connection parts at which the second substrates are connected with each other; and a plurality of second dot spacers formed on respective one sides of the first substrates excluding the first connection parts and having a lower height than the plurality of first dot spacers. The resistive touch screen is advantageous in that a large-area touch panel can be realized by connecting single touch panels on the same level. | 09-22-2011 |
20110254803 | METHOD FOR RECOGNIZING MULTI-TOUCH OF RESISTIVE TOUCH SCREEN - Disclosed herein is a method for recognizing a resistive touch screen. The method for recognizing the resistive touch screen includes: sensing touch generated at the resistive touch screen; calculating a difference value, a searching value by detecting voltage at two electrode wirings connected with a transparent resistive layer of the resistive touch screen; and comparing the searching value with a reference value that is a difference value between voltages detected at the two electrode wirings when the resistive touch screen is single-touched, whereby the single touch and the multi-touch can be differentiated. | 10-20-2011 |
20110261003 | DISPLAY DEVICE HAVING CAPACITIVE TOUCH SCREEN - Disclosed herein is a display device having a capacitive touch screen, including: a display unit; and a capacitive touch screen that is coupled to the display unit by an adhesive layer and includes a base substrate, a plurality of first electrode patterns that are formed on an active region of the base substrate, ground patterns that are formed on the active region of the base substrate and are separated from the first electrode pattern, a transparent insulating layer that covers the first electrode patterns and the ground patterns and is formed on the base substrate, and a plurality of second electrode patterns that are formed on an active region of the transparent insulating layer. | 10-27-2011 |
20110262631 | Method For Manufacturing One-Layer Type Capacitive Touch Screen - Disclosed herein is a method for manufacturing a one-layer type capacitive touch screen. The method for manufacturing a one-layer type capacitive touch screen includes: forming a plurality of electrode wirings made of metal in an inactive region of a base substrate; forming a plurality of first electrode patterns made of a conductive polymer and including a first sensing unit and a first connection unit in an active region of the base substrate to connect the electrode wirings; forming an insulating pattern on the plurality of first connection units of the first electrode patterns; and forming a plurality of second electrode patterns including a second sensing unit and a second connection unit and made of the conductive polymer in the active region of the base substrate to connect the electrode wirings and position the second connection unit on the insulating pattern. | 10-27-2011 |
20110273382 | TOUCH SCREEN HAVING ANTENNA PATTERN - Disclosed herein is a touch screen having an antenna, including: a first substrate that includes a first electrode pattern formed in an active region and a first electrode wiring formed in an inactive region disposed outside the active region and connected to the first electrode pattern; a second substrate that includes a second electrode pattern opposite to the first electrode pattern and a second electrode wiring connected to the second electrode pattern; a spacer that is formed between the first substrate and the second substrate to space the first electrode pattern from the second electrode pattern; and an antenna pattern that is formed in the inactive region. | 11-10-2011 |
20110279401 | ONE-LAYER CAPACITIVE TOUCH SCREEN AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a one-layer capacitive touch screen and a method of manufacturing the same. The one-layer capacitive touch screen includes: a base substrate; a first electrode pattern that is formed on an upper surface of the base substrate and includes a plurality of first sensing units and first connection units connecting the adjacent first sensing units; a second electrode pattern that is formed on the upper surface of the base substrate and includes a plurality of second sensing units and second connection units connecting the adjacent second sensing units, the second connection units being formed to intersect with each other on the upper side of the first connection unit, having an air gap therebetween; and an electrode wiring that is connected to the first electrode pattern and the second electrode. | 11-17-2011 |
20110279402 | TOUCH SCREEN - Disclosed herein is a touch screen. The touch screen includes a transparent electrode that is formed on one surface of a first transparent substrate to sense change in capacitance at the time of a touch input; an electrode that is formed on a second transparent substrate formed on the other surface of the first transparent substrate to apply voltage to the transparent electrode; and a via that penetrates through the first transparent substrate to electrically connect the transparent electrode to the electrode. The transparent electrode and the electrode are formed on the transparent substrates at different layers, thereby reducing an inactive region. | 11-17-2011 |
20110285642 | Touch Screen - Disclosed herein is a touch screen that includes: a first touch screen part that is positioned on an upper part of a display to detect external contact of an input device and compute absolute coordinate information of a contact point and includes two substrates having electrodes patterns that are spaced by a spacer and face each other; and a second touch screen part that is connected with the first touch screen part to measure the change in capacitance by the external contact of the input device and compute vector coordinate information of the input device. | 11-24-2011 |
20120001863 | TOUCH PANEL - Disclosed herein is a touch panel, including: a transparent substrate including an active region and a bezel region partitioned thereon; a plurality of first transparent electrodes formed in the active region in parallel to each other along a Y-axis direction and including a plurality of first sensing units and a plurality of first connecting units connected with the plurality of first sensing units in an X-axis direction; a plurality of second transparent electrodes alternately formed with the plurality of first sensing units in the active region in parallel to each other along the Y-axis direction and including a plurality of second sensing units and a plurality of second connecting units connected with the plurality of first sensing units in the X-axis direction; and electrode wirings formed in the bezel region and connected to terminals of the first transparent electrodes and terminals of the second transparent electrodes, respectively. | 01-05-2012 |
20120007813 | TOUCH SCREEN - Disclosed herein is a touch screen, including: a base member; a plurality of electrode patterns formed on one surface of the base member, having a first directionality; electrode wirings connected to both ends of the electrode patterns; and a controller that is connected to the electrode wirings, measures the change in resistance of the electrode pattern to update reference voltage variation value, and measures charging/discharging characteristics generated from the electrode pattern when an outside touch is generated to calculate coordinate information on a touched point. | 01-12-2012 |
20120026101 | ELECTRIC PAPER ASSOCIATED WITH TOUCH PANEL - Disclosed herein is an electronic paper associated with a touch panel. The electronic paper | 02-02-2012 |
20120061017 | METHOD OF MANUFACTURING CAPACITIVE TOUCH SCREEN - Disclosed herein is a method of manufacturing a capacitive touch screen, including: forming transparent electrodes on an upper surface of a lower transparent film; forming electrode wirings on a lower surface of an upper transparent film; and bonding the transparent electrodes to the electrodes wirings to be closely adhered to each other, whereby it prevents the transparent electrodes from being damaged or deformed due to heat, thereby making it possible to improve reliability and accuracy of the manufacturing process. | 03-15-2012 |
20120062506 | CAPACITIVE TOUCH SCREEN - Disclosed herein is a capacitive touch screen. The capacitive touch screen is formed with a first type of electrode patterns formed in plural so as to prevent electrode wirings from being formed in a region through which images pass and a second type of electrode patterns having unique coordinate information so as to improve touch sensitivity of an outside region. | 03-15-2012 |
20120081331 | TOUCH SCREEN - Disclosed herein is a touch screen. The touch screen includes: a transparent substrate; and transparent electrodes formed on the transparent substrate and sensing a change in capacitance at the time of a touch input, wherein the transparent electrodes include internal transparent electrodes and external transparent electrodes, and the internal transparent electrodes include first sensing units sensing the change in capacitance, extending portions extending to edges of the transparent substrate from the first sensing units, and the extending portions of the adjacent internal transparent electrodes face each other, whereby the extending portions face each other to reduce the frequency of the coordinate errors of the touch input corrected in the controller. | 04-05-2012 |
20120162099 | TOUCH SCREEN - Disclosed herein is a touch screen | 06-28-2012 |
20120267228 | TOUCH PANEL - Disclosed herein is a capacitive type touch panel, including: a transparent substrate; and a transparent electrode formed on the transparent substrate, wherein the transparent electrode has first, second, and third patterns sequentially formed in either a short direction or a long direction of the transparent substrate. According to the present invention, the one-layer capacitive type touch panel according to the present invention can easily recognize the coordinates of touched points by the touch and accurately recognize the coordinates. Furthermore, the transparent electrode patterns according to the present invention allow realization of multi-touch and improvement in driving reliability. | 10-25-2012 |
20130069775 | TIRE STATUS MONITORING APPARATUS - Disclosed herein is a tire status monitoring apparatus including: a tire status measuring module installed in the inside of a tire to measure a tire status, thereby generating information on the tire status; an antenna valve transmitting the information on the tire status measured from the tire status measuring module and ventilating air to the tire according to the transmitted information on the tire status, thereby maintaining a constant air pressure in the inside of the tire; and a leaf spring having one end connected to the tire status measuring module and the other end connected to the antenna valve. Therefore, it is possible to reduce the number of processes such as hole forming and soldering processes for connection, have a simplified configuration, and easily connect and separate to between the tire status measuring module and the antenna valve. | 03-21-2013 |
20130074592 | TIRE PRESSURE MONITORING SYSTEM MODULE - Disclosed herein is a tire pressure monitoring system module including: a circuit board having electronic components and electrical elements mounted thereon to transceive electrical signals; a battery mounted on a lower portion of the circuit board to thereby form a double layer structure together with the circuit board; a valve antenna provided at a side portion of the circuit board; and a connection pin connecting the circuit board and the valve antenna to each other. | 03-28-2013 |
20130342193 | SENSOR FOR DIGITIZER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a sensor for a digitizer and a method of manufacturing the same. The sensor includes a magnetic layer having insulation; a first coil embedded in the magnetic layer; a second coil formed on one surface of the magnetic layer; and an insulating layer formed on one surface of the magnetic layer to cover the second coil. Thus, since the first coil and the second coil are formed on the magnetic layer formed of a magnetic material, a magnetic field is stably formed between coils and stability of signals transmitted and received between a coil and an input device is increased. | 12-26-2013 |
20130342477 | SENSOR FOR DIGITIZER AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a sensor for a digitizer including a first magnetic layer, a first coil formed on one surface of the first magnetic layer, an insulating layer formed on one surface of the first magnetic layer, a second coil formed on one surface the insulating layer, and a second magnetic layer formed on one surface of the insulating layer, and a method for manufacturing the same. | 12-26-2013 |
20140035838 | DIGITIZER - Disclosed herein is a digitizer including: an input unit having a magnetic field shielding part embedded therein; a driving coil supplied with current to induce a magnetic line of force; a sensing coil to which voltage is induced by the magnetic line of force; and a control unit supplying current to the driving coil and measuring voltage induced to the sensing coil, wherein the control unit senses variation of voltage induced to the sensing coil to calculate coordinates of the input unit when the voltage induced to the sensing coil is changed by the magnetic field shielding part. | 02-06-2014 |
20140055404 | DIGITIZER - Disclosed herein is a digitizer including: a driving coil supplied with current to induce a magnetic line of force; a sensing coil disposed so as to intersect the driving coil to flow induced current in one direction by the magnetic line of force; and a control unit sensing variation of voltage induced to the sensing coil to calculate coordinates of the input unit when the voltage is changed due to an approach of an input unit. | 02-27-2014 |
Patent application number | Description | Published |
20110008712 | Fuel Cell Having Single Body Support - Disclosed is a fuel cell having a single body support, which includes a single body support including a plurality of unit supports and a connector for connecting the plurality of unit supports in parallel, an air electrode layer formed on an outer surface of the single body support, an electrolyte layer formed on an outer surface of the air electrode layer, and a fuel electrode layer formed on an outer surface of the electrolyte layer, so that the fuel cell is stably supported thus increasing durability and reliability. | 01-13-2011 |
20110008716 | FUEL CELL INCLUDING SUPPORT HAVING MESH STRUCTURE - Disclosed is a solid oxide fuel cell, which includes a support having a mesh structure, an anode layer formed on an outer surface of the support, an electrolyte layer formed on an outer surface of the anode layer, and a cathode layer formed on an outer surface of the electrolyte layer and also which is lightweight and enables current collection. | 01-13-2011 |
20110053032 | MANIFOLD FOR SERIES CONNECTION ON FUEL CELL - Disclosed is a manifold of a fuel cell, including a conductive support having an upper support member and a lower support member between which two or more anode-supported tubular unit fuel cells each comprising an anode layer, an electrolyte layer and a cathode layer formed in sequential order are disposed and which include an inner connector and an outer connector formed to be tightly fitted into an inner surface and around an outer surface of the unit fuel cells so as to electrically conduct the unit fuel cells, such that the unit fuel cells are alternately connected with the inner connector and the outer connector at an upper end and a lower end thereof thus forming an electrical series circuit. The manifold which is essentially manufactured to supply fuel to a solid oxide fuel cell is used to simply collect current from the fuel cell even without an additional current collector being used, and is configured such that unit fuel cells disposed in the manifold are connected in series. | 03-03-2011 |
20110053045 | SOLID OXIDE FUEL CELL AND METHOD OF MANUFACTURING THE SAME - Disclosed is a solid oxide fuel cell, including a polygonal tubular support an outer surface of which has a plurality of planes, a plurality of unit cells respectively formed on the plurality of planes of the tubular support, inner connectors for connecting the plurality of unit cells in series, and a pair of outer connectors for connecting the plurality of unit cells connected in series to a current collector, so that respective unit cells are connected in series on the planes of the tubular support, thus exhibiting excellent cell performance and high power density per unit volume, and maintaining high voltage upon collection of current to thereby reduce power loss due to electrical resistance. A method of manufacturing the solid oxide fuel cell is also provided. | 03-03-2011 |
20110059388 | SOLID OXIDE FUEL CELL AND SOLID OXIDE FUEL CELL BUNDLE - Disclosed is a solid oxide fuel cell bundle, including a plurality of fuel cells each having a polygonal tubular support an outer surface of which has a plurality of planes, an outer connector formed on one plane among the plurality of planes of the tubular support, a plurality of unit cells respectively formed on two or more remaining planes of the tubular support except for the one plane, and inner connectors for connecting the unit cells and the outer connector in series, wherein the fuel cells is connected in series in such a manner that the outer connector of a fuel cell is bonded to the unit cell of an additional fuel cell, and the unit cells are connected in series, thus exhibiting excellent cell performance and high power density per unit volume, and maintaining high voltage upon collection of current to thereby reduce power loss due to electrical resistance. | 03-10-2011 |
20110275007 | SOLID OXIDE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a solid oxide fuel cell and a method for manufacturing the same. The solid oxide fuel cell includes an anode layer; a cathode layer; an electrolyte layer interposed between the anode layer and the cathode layer; wherein the anode layer includes an Si-based compound selected from a group consisting of SiC, Si | 11-10-2011 |
20120021339 | SOLID OXIDE FUEL CELL AND MANUFACTURING METHOD THEREOF - Disclosed herein are a solid oxide fuel cell and a manufacturing method thereof. The solid oxide fuel cell includes: an anode layer, a cathode layer, and an electrolyte layer interposed between the anode layer and the cathode layer, wherein the anode layer includes: a conductive material; yttria stabilized zirconia (YSZ); and an oxide compound for forming a solid solution with the yttria stabilized zirconia. | 01-26-2012 |
20120058410 | SOLID OXIDE FUEL CELL - Disclosed herein is a solid oxide fuel cell. The solid oxide fuel cell includes: a tubular first electrode support layer formed with a plurality of first passages; an inner electrolyte layer formed in the first electrode support layer; an inner second electrode layer formed on the inner surface of the first electrolyte layer and forming an inner second passage; an outer electrolyte layer formed on the outer surface of the first electrode support layer; and an outer second electrode layer formed on the outer surface of the second electrolyte layer and adjacent to the outer second passage. | 03-08-2012 |
20130075270 | METHOD FOR COATING METALLIC INTERCONNECT OF SOLID FUEL CELL - Disclosed herein is a method for coating a metallic interconnect of a solid oxide fuel cell. The method for coating a metallic interconnect of a solid oxide fuel cell includes generating a cobalt compound solution using lithium cobalt oxide (LiCoO | 03-28-2013 |
20130171535 | SYSTEM FOR MEASURING PERFORMANCE OF SOLID OXIDE FUEL CELL - Disclosed herein is a system for measuring performance of a solid oxide fuel cell, including: a heating furnace wrapping the solid oxide fuel cell, the heating furnace having a first opening part through which one lateral surface in a length direction of the solid oxide fuel cell outwardly protrudes and a fuel supply hole formed in one surface thereof; a first fuel storage unit; a second fuel storage unit; a first fuel supply control unit; a second fuel supply control unit; an electronic load measuring current or voltage outputted from the solid oxide fuel cell; and a control unit controlling the supply of fuel by using the first fuel supply control unit and the second fuel supply control unit, and controlling the measurement of current or voltage by using the electronic load. | 07-04-2013 |
20130171539 | TUBULAR SOLID OXIDE FUEL CELL MODULE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a tubular solid oxide fuel cell module including an anode layer, an electrolyte layer, a cathode layer divided into two parts or more, a conductive mesh structure and a conductive wire, and a method of manufacturing the same. The tubular solid oxide fuel cell is advantageous in that the cathode is divided into two parts or more, so that the moving distance of electric charges is decreased, with the result that resistance loss can be minimized, thereby increasing the efficiency of collecting electric charges. | 07-04-2013 |
Patent application number | Description | Published |
20120017828 | APPARATUS FOR MANUFACTURING TRANSPARENT CONDUCTIVE LAYER - Disclosed herein is an apparatus for manufacturing a transparent conductive layer. The apparatus includes a transparent substrate, a longitudinal direction of which is arranged in an X axis direction. Jetting means jets a conductive polymer solution, containing ions, onto a first surface of the transparent substrate in a Y axis direction. A wire is spaced apart from a second surface of the transparent substrate by a predetermined distance and arranged in a Z axis direction. Voltage application means generates electric attractive force between the wire and the conductive polymer solution by applying a potential having polarity opposite to that of the ions to the wire. The apparatus adds ions to the conductive polymer solution, and employs a wire to which a potential having polarity opposite to that of the ions is applied, thus obtaining the advantage that the target substrate can be uniformly coated with the conductive polymer solution. | 01-26-2012 |
20120018200 | TRANSPARENT CONDUCTIVE FILM FOR TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a transparent conductive film for a touch panel and a method for manufacturing the same. A transparent conductive film | 01-26-2012 |
20120105359 | RESISTIVE TOUCH SCREEN - Disclosed herein is a resistive touch screen, including: a lower substrate formed with a lower electrode pattern unit made of a conductive polymer and a lower electrode wiring unit connected to the lower electrode pattern unit; an upper substrate disposed on the upper side of the lower substrate and formed with an upper electrode pattern unit made of a conductive polymer and an upper electrode wiring unit connected to the upper electrode pattern unit, formed on an opposite surface thereto; a spacer disposed between the lower substrate and the upper substrate and provided with an opening formed therein; and a surface modifying layer covering at least any one of the lower electrode pattern unit and the upper electrode pattern unit and made of a material having a work function smaller than the conductive polymer. | 05-03-2012 |
20120162097 | MICROCAPSULE HAVING HEAT-RESISTANCE, TOUCH PANEL CONTAINING THE SAME AND METHOD FOR MANUFACTURING TOUCH PANEL - Disclosed herein is a microcapsule having heat-resistance in a core-shell structure, including: a conductive polymer core; and a shell made of polyimide and partially enclosing the conductive polymer core. The core-shell structure in which a partial polyimide shell is formed on the conductive polymer core is formed, thereby making it possible to improve the heat-resistance of the conductive polymer. In addition, a transparent electrode having improved heat-resistance is used to minimize a change rate in sheet resistance due to a high temperature, such that electrical reliability of a touch panel is improved, thereby making it possible to improve accuracy of an operation. | 06-28-2012 |
20120168682 | PEDOT/PSS COMPOSITION AND PEDOT/PSS FILM USING THE SAME - Disclosed herein is a PEDOT/PSS composition, including PEDOT/PSS, a solvent, a compatibilizer and a water-soluble conductive polymer, and a transparent electrode. Since a transparent electrode is formed by adding a compatibilizer and a water-soluble conductive polymer to PEDOT/PSS, the transparent electrode has excellent flexibility, can be easily coated and has a low surface resistance of 240˜300 Ω/□, so that this transparent electrode can be used as a transparent electrode for displays. | 07-05-2012 |
20120175564 | CONDUCTIVE POLYMER COMPOSITION AND CONDUCTIVE FILM PREPARED FROM THE COMPOSITION - Disclosed is a conductive polymer composition including a conductive polymer, a dopant, a solvent, and a thixotropic agent. The conductive polymer composition includes the thixotropic agent in lieu of a binder, so that the viscosity of the conductive polymer composition is high and the electrical conductivity thereof is superior. The thixotropic agent can reversibly change the viscosity by expansion and shrinkage, thus adjusting the viscosity of the conductive polymer composition depending on the end uses. | 07-12-2012 |
20120327569 | TOUCH PANEL - Disclosed herein is a touch panel, including: a base member; a transparent electrode formed on the base member in a mesh shape including a plurality of openings surrounded by a line patterned with metal; and electrode wirings integrally formed on one end or both ends of the transparent. The preferred embodiment of the present invention integrally forms the electrode wirings with the transparent electrode made of metal, thereby simplifying the process and reducing the manufacturing process time. In addition, the preferred embodiment of the present invention forms the transparent electrode in the mesh shape to increase an aperture ratio, thereby increasing transmittance of the touch panel and electric conductivity of the transparent electrode. | 12-27-2012 |
20130000959 | TOUCH PANEL - Disclosed herein is a touch panel including: a base member including a body part and a connection part extended and protruded from the body part; a mesh shaped first transparent electrode formed on one surface of the base member and made of a metal, a mesh shaped second transparent electrode formed on the other surface of the base member and made of a metal; a first electrode wiring formed on one surface of the base member so that one end thereof is connected integrally to the first transparent electrode and the other end thereof is extended up to the connection part; and a second electrode wiring formed on the other surface of the base member so that one end thereof is connected integrally to the second transparent electrode and the other end thereof is extended up to the connection part. | 01-03-2013 |
20130055558 | METHOD FOR MANUFACTURING TOUCH PANEL - Disclosed herein is a method for manufacturing a touch panel including: (A) applying a spinning solution including metal, a metal oxide, a conductive polymer, carbon nanotubes (CNTs), graphene, or any combination thereof to one surface of a transparent substrate through an electro spinning process to form an electrode layer; and (B) patterning the electrode layer by a laser to form a sensing electrode. Since sensing electrodes are formed through an electro spinning process without using high-priced equipment, the overall manufacturing costs of the touch panel can be reduced. | 03-07-2013 |
Patent application number | Description | Published |
20110133991 | DIELECTRIC RESONATOR ANTENNA EMBEDDED IN MULTILAYER SUBSTRATE - Disclosed is a dielectric resonator antenna embedded in a multilayer substrate, which includes a multilayer substrate, a first conductor plate having an opening, a second conductor plate formed on the bottom of a lowermost insulating layer resulting from stacking at least two insulating layers downward from the first conductor plate, a plurality of metal via holes passing through around the opening at a predetermined interval, and a feeder for transmitting a frequency signal to the dielectric resonator embedded by the metal boundaries defined by the first conductor plate, the second conductor plate and the plurality of metal via holes, thus exhibiting low sensitivity to fabrication error and the external environment. | 06-09-2011 |
20110193415 | WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed is a wireless energy transmission structure which includes a disc part including a first conductor plate and a second conductor plate which are spaced to face each other and a dielectric material inserted between the first conductor plate and the second conductor plate, and generating an electric field between the first conductor plate and the second conductor plate; and a ring-shaped wire part one end of which is connected to the first conductor plate and the other end of which is connected to the second conductor plate, and having a meta structure in which a plurality of meta cells is repetitively arranged so as to induce a magnetic field using the electric field, so that the wireless energy transmission structure is reduced in size and is improved in transmission distance and transmission efficiency. | 08-11-2011 |
20110248890 | DIELECTRIC RESONATOR ANTENNA EMBEDDED IN MULTILAYER SUBSTRATE FOR ENHANCING BANDWIDTH - Disclosed herein is a dielectric resonator antenna embedded in a multilayer substrate for enhancing bandwidth. The dielectric resonator antenna includes a multilayer substrate, a first conductive plate, a second conductive plate, a plurality of first metal via holes, a feeding part configured to feed a dielectric resonator, and a conductive pattern part inserted into the dielectric resonator so that a vertical metal interface is formed in the dielectric resonator. Accordingly, the dielectric resonator antenna has low sensitivity to fabrication errors and an external environment, and can enhance the radiation characteristics of the antenna when multiple resonances occur. | 10-13-2011 |
20110248891 | DIELECTRIC RESONANT ANTENNA USING A MATCHING SUBSTRATE - Disclosed herein is a dielectric resonator antenna using a matching substrate in order to improve a bandwidth. The dielectric resonator antenna includes: a dielectric resonator body part that is embedded in a multi-layer substrate and has an opening part on the upper portion thereof; and at least one matching substrate that is stacked on the opening part and includes an an insulating layer having a dielectric constant smaller than that of the multi-layer substrate but larger than that of air, thereby making it possible to improve the bandwidth without adjusting the size of the dielectric resonator body part and to prevent loss and change in the radiation pattern due to the substrate mode. | 10-13-2011 |
20110267152 | WIDEBAND TRANSMISSION LINE - WAVEGUIDE TRANSITION APPARATUS - Disclosed herein is a wideband transmission line—waveguide transition apparatus. The wideband transmission line—waveguide transition apparatus includes: a waveguide constituted by a single dielectric substrate; a transmission line applying a signal to the waveguide; and a cavity matching unit in which a cavity of which an inner surface is formed by a metallic surface is formed at a portion of the waveguide to contact with the transmission line and impedance is adjusted through a change of the dielectric constant in the cavity caused by changing the size and shape of the cavity to perform impedance matching between the waveguide and the transmission line, and the position of the cavity is changed to perform phase matching between the waveguide and the transmission line. | 11-03-2011 |
20120206311 | DIELECTRIC WAVEGUIDE ANTENNA - Disclosed herein is a dielectric waveguide antenna including: a dielectric waveguide transmitting a signal applied from a power feeder; a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture; and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna. | 08-16-2012 |
20130113421 | DISPLAY DEVICE AND DISPLAY SYSTEM INCORPORATING WIRED AND WIRELESS CHARGING APPARATUSES - Disclosed herein is a display system incorporating wired and wireless charging apparatuses, including: a switching processing unit supplying and processing a power of a power supply unit according to a mode selected through a switch; a wireless charging unit connected to the switching processing unit and including a pad for wireless charging; a wired charging unit connected to the switching processing unit and a terminal for wired charging; a display unit connected to the switching processing unit; and a control unit connected to the switching processing unit to control operations according to the mode. | 05-09-2013 |
20140168024 | DIELECTRIC WAVEGUIDE ANTENNA - Embodiments of the invention provide a dielectric waveguide antenna including a dielectric waveguide transmitting a signal applied from a power feeder, a dielectric waveguide radiator radiating the signal transmitted from the dielectric waveguide to the air through a first aperture, and a matching unit formed in a portion of the dielectric waveguide and controlling a serial reactance and a parallel reactance to thereby perform impedance matching between the dielectric waveguide radiator and the air, in order to reduce reflection generated in the first aperture during the radiation of the signal through the first aperture. Reflection in the aperture is reduced through the matching unit having various structures, thereby making it possible to improve characteristics of the dielectric waveguide antenna. | 06-19-2014 |
Patent application number | Description | Published |
20110156539 | PIEZOELECTRIC ACTUATOR FOR ACTUATING HAPTIC DEVICE - Disclosed herein is a piezoelectric actuator for actuating a haptic device, which includes a piezoelectric element having a plurality of piezoelectric layers which are stacked and have the same polling direction, and an electrode pattern formed on the piezoelectric element, in which the length of each of the plurality of piezoelectric layers is greater than or equal to four times the width of each of the plurality of piezoelectric layers, and the width of each of the plurality of piezoelectric layers is greater than or equal to ten times the thickness of each of the plurality of piezoelectric layers, so that the piezoelectric actuator can greatly vibrate in the direction of length with reduced power consumption. | 06-30-2011 |
20110157035 | ACTUATOR MODULE - Disclosed herein is an actuator module that improves vibration of a touch screen pad. More specifically, the actuator module is configured to include a plate that is positioned at the lower part of a touch display module in which an image display unit is coupled to the lower part of a touch screen panel, a vibration generator that is positioned at the lower part of the plate and is mechanically deformed by compression or contraction when voltage is applied, and an adhesive layer that bonds the touch display module to the plate and the plate to the vibration generator and generates bending moment by the mechanical deformation of the vibration generator, thereby making it possible to transfer the vibration by the vibration generator directly to the touch screen panel and be designed in an ultra-thin type. | 06-30-2011 |
20110163634 | PIEZOELECTRIC ACTUATOR MODULE - Disclosed herein is a piezoelectric actuator module. The piezoelectric actuator module includes a flat plate, two or more elastic members, and a piezoelectric element. The elastic members are provided on each of opposite ends of the plate in a longitudinal direction thereof and protrude perpendicularly from the plate in such a way that a first end of each of the elastic members is coupled to an electronic device. The piezoelectric element is provided on a first surface of the plate and transmits vibrating force to the electronic device. The piezoelectric actuator module includes a plate having on opposite ends thereof two or more elastic members, thus being capable of controlling vibrating force by changing the length of the plate and the number of the elastic members, in addition to reliably supporting piezoelectric elements provided on the plate. | 07-07-2011 |
20110163635 | PIEZOELECTRIC ACTUATOR MODULE - Disclosed herein is a piezoelectric actuator module. The piezoelectric actuator module includes a flat plate. An elastic member is provided on each of opposite ends of the plate in a longitudinal direction thereof, and protrudes perpendicularly from the plate in such a way that a first end of the elastic member is coupled to an electronic device. A plate-shaped elastic body is provided on a first surface of the plate. A piezoelectric element is provided on a first surface of the elastic body. The plate-shaped elastic body is provided between the plate and the piezoelectric element, so that the overall spring constant of the piezoelectric actuator module is lowered and thus the vibrating force of the piezoelectric actuator module is increased. | 07-07-2011 |
20110273405 | TOUCH SCREEN DEVICE - Disclosed herein is a touch screen device, including: a case that partitions an internal space, a touch panel module that is received in the case to recognize external pressure, a first actuator that is mounted at the lower part of the touch panel module to generate vibration, a second actuator that is mounted at the case to generate vibration, and
| 11-10-2011 |
20120153775 | PIEZOELECTRIC ACTUATOR - Disclosed herein is a piezoelectric actuator. The piezoelectric actuator includes a piezoelectric element generating vibrations by repetitively expanding and restoring according to power applied from the outside to be linearly driven; a support member contacts the piezoelectric element in order to support the piezoelectric element; and vibration control members attached to one surface of and the support member and the piezoelectric element. | 06-21-2012 |
Patent application number | Description | Published |
20110193415 | WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed is a wireless energy transmission structure which includes a disc part including a first conductor plate and a second conductor plate which are spaced to face each other and a dielectric material inserted between the first conductor plate and the second conductor plate, and generating an electric field between the first conductor plate and the second conductor plate; and a ring-shaped wire part one end of which is connected to the first conductor plate and the other end of which is connected to the second conductor plate, and having a meta structure in which a plurality of meta cells is repetitively arranged so as to induce a magnetic field using the electric field, so that the wireless energy transmission structure is reduced in size and is improved in transmission distance and transmission efficiency. | 08-11-2011 |
20110241609 | WIRELESS ENERGY TRANSMISSION STRUCTURE - Disclosed herein is a wireless energy transmission structure, which includes a printed circuit board, a disk section, and a wire section. The printed circuit board is formed in a ring type, the disk section is constituted by a first conductive plate and a second conductive plate formed on portions of the printed circuit board corresponding to each other to be spaced by a predetermined gap and a dielectric material inserted between the first conductive plate and the second conductive plate, and the wire section is constituted by a plurality of meta cells having a meta material structure, which are repetitively formed to surround the exterior and interior of the printed circuit board and a transmission line connected to each of the first conductive plate and the second conductive plate and surround the plurality of meta cells. | 10-06-2011 |
20110266879 | APPARATUS FOR TRANSMITTING AND RECEIVING WIRELESS ENERGY USING META-MATERIAL STRUCTURES HAVING ZERO REFRACTIVE INDEX - Disclosed herein is an apparatus for transmitting and receiving wireless energy using meta-material structures having a zero refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. When external power is applied thereto, the wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially when the generated wireless energy is transmitted, using a magnetic resonance method while concentrating the wireless energy in one direction. | 11-03-2011 |
20110267247 | APPARATUS FOR TRANSMITTING AND RECEIVING WIRELESS ENERGY USING META-MATERIAL STRUCTURES HAVING NEGATIVE REFRACTIVE INDEX - Disclosed herein is there is provided an apparatus for transmitting and receiving wireless energy using meta-material structures having a negative refractive index. The apparatus includes a wireless energy transmission unit and a wireless energy reception unit. The wireless energy transmission unit generates wireless energy to be wirelessly transmitted, and then wirelessly transmits wireless energy, which is normally propagated radially, using a magnetic resonance method while concentrating the wireless energy at a single point. The wireless energy reception unit wirelessly receives the wireless energy using the magnetic resonance method while concentrating the wireless energy at a single point. | 11-03-2011 |
20120038220 | WIRELESS POWER TRANSMISSION APPARATUS AND TRANSMISSION METHOD THEREOF - Disclosed herein are a wireless power transmission apparatus and a transmission method thereof. The wireless power transmission apparatus is configured to include a wireless power transmitter generating a wireless power signal to be wireless transmitted, wirelessly transmitting the generated wireless power signal by a magnetic resonance manner, receiving a reflection wireless power signal to determine whether or not a load apparatus is presented, and supplying power to the load apparatus; and a wireless power receiver connected to the load apparatus and receiving the transmitted wireless power signal by the magnetic resonance manner and supplying it to the connected load apparatus and reflecting the remaining wireless power signal to the wireless power transmitter, whereby a transmission apparatus can recognize a receiving environment and resonance characteristics are improved, without a separate communication device or a system. | 02-16-2012 |
20120146425 | WIRELESS POWER TRANSMISSION/RECEPTION APPARATUS AND METHOD - Disclosed herein is a wireless power transmission/reception apparatus. The wireless power transmission/reception apparatus includes a wireless power transmission unit configured to generate a wireless power signal to be transmitted, transmit the wireless power signal using magnetic resonance, receive a reflected wireless power signal from a wireless power reception unit, determine whether a load device is present, and transmit a wireless power signal if it is determined that the load device is present in such a way that impedance and output power depending on variation in a distance to the load device are automatically tracked, and wireless power is supplied to the load device in an optimized state. A wireless to power reception unit is connected to the load device, and configured to receive the wireless power signal, provide the wireless power signal to the load device, and reflect a reflected wireless power signal towards the wireless power transmission unit. | 06-14-2012 |
20120217926 | WIRELESS POWER TRANSFER - Disclosed herein is a wireless power transfer system. The wireless power transfer system includes a wireless power transmitter receiving power input from the outside to generate a wireless power signal to be transmitted in wireless and transmitting the generated wireless power signal in wireless by a magnetic resonance manner using an LC serial-parallel resonance circuit; a wireless power receiver installed in a charging device to receive the wireless power signal transmitted from the wireless power transmitter by the magnetic resonance manner using the LC serial-parallel resonance circuit and output the received wireless power signal; and a charging circuit installed in the charging device to allow the power output from the wireless power receiver to charge an embedded battery, thereby making it possible to efficiently provide power in wireless. | 08-30-2012 |
20120280648 | APPARATUS AND METHOD FOR CHARGING WIRELINE AND WIRELESS POWERS - Disclosed herein are an apparatus and a method for charging wireline and wireless powers. The apparatus for charging wireline and wireless powers includes: a main battery; an auxiliary battery; a wireline charging module providing wireline power to the main and auxiliary batteries; and a wireless charging module connected to the wireline charging module to thereby provide wireless power to the main and auxiliary batteries. Therefore, wireline charging and the wireless charging may be simultaneously performed, thereby making it possible to save a time required to charge power and to improve the convenience for users according to various charging scenarios using the wireline charging and the wireless charging. | 11-08-2012 |
20130057202 | CHARGING APPARATUS USING PAD TYPE ELECTRODE CONTACT POINT - Disclosed herein is a charging apparatus using a pad type electrode contact point, the charging apparatus including: a charging plate having a plate shape; and an attaching plate installed on a portable terminal to provide the power to a charging circuit of the portable terminal. | 03-07-2013 |
20130099729 | COIL STRUCTURE FOR WIRELESS CHARGING AND WIRELESS CHARGING APPARATUS HAVING THE SAME - The wireless charging apparatus according to the preferred embodiment of the present invention includes a control unit performing a general control of a wireless charging process; a driving unit connected to the control unit to generate a wireless power signal to be transmitted according to the control of the control unit; a transmission coil unit connected to the driving unit as a coil structure in a dumbbel form and transmitting wireless power according to the wireless power signal, the turn loop having a major-axis side of which one side is longer than the other side and at least one area is formed in a form depressed inwardly; and a sensing unit connected between the transmission coil unit and the control unit to detect whether the wireless charging receiver is positioned corresponding to the transmission coil unit and transfer the detected state to the control unit. | 04-25-2013 |
20130113421 | DISPLAY DEVICE AND DISPLAY SYSTEM INCORPORATING WIRED AND WIRELESS CHARGING APPARATUSES - Disclosed herein is a display system incorporating wired and wireless charging apparatuses, including: a switching processing unit supplying and processing a power of a power supply unit according to a mode selected through a switch; a wireless charging unit connected to the switching processing unit and including a pad for wireless charging; a wired charging unit connected to the switching processing unit and a terminal for wired charging; a display unit connected to the switching processing unit; and a control unit connected to the switching processing unit to control operations according to the mode. | 05-09-2013 |
Patent application number | Description | Published |
20100084726 | Wafer level packaging image sensor module having lens actuator and method of manfacturing the same - Disclosed herein is a wafer level packaging image sensor module, including a wafer including an image sensor, a circuit portion and a lower electrode on one side thereof, a lens actuator disposed on the lower electrode and made of electroactive polymer, an upper electrode disposed on the lens actuator, and a lens unit disposed on the upper electrode to allow light to be transmitted to the image sensor therethrough. The wafer level packaging image sensor module includes the lens actuator made of electroactive polymer, and thus it enables realization of the autofocusing of the wafer level packaging image sensor module. | 04-08-2010 |
20100187002 | METHOD OF ATTACHING DIE USING SELF-ASSEMBLING MONOLAYER AND PACKAGE SUBSTRATE INCLUDING DIE ATTACHED THERETO USING SELF-ASSEMBLING MONOLAYER - Disclosed herein are a method of attaching a die using a self-assembling monolayer and a package substrate including a die attached thereto using a self-assembling monolayer. A first self-assembling monolayer formed on a die and a second self-assembling monolayer formed on a substrate are provided with the same hydrophilic or hydrophobic functional group, so that the die is attached to the substrate using an attractive force acting between the first and second self-assembling monolayers. An accuracy of alignment between the die and the substrate can be improved by the simple solution. | 07-29-2010 |
20110037145 | WAFER LEVEL PACKAGE HAVING CYLINDRICAL CAPACITOR AND METHOD OF FABRICATING THE SAME - Disclosed is a wafer level package having a cylindrical capacitor, which is capable of increasing electrostatic capacity thanks to the use of a cylindrical capacitor structure and which includes a wafer chip having a bonding pad formed thereon and an insulating layer formed thereon and exposing the bonding pad, a redistribution layer connected to the bonding pad and extending to one side of the insulating layer, a cylindrical outer electrode connected to the redistribution layer and having a center opening therein, a cylindrical inner electrode formed in the center opening of the outer electrode so as to be separated from the outer electrode, a dielectric layer formed between the outer electrode and the inner electrode, and a resin sealing portion formed on the insulating layer to cover the redistribution layer, the inner electrode, the outer electrode and the dielectric layer and having a first recess for exposing an upper surface of the inner electrode. A method of fabricating the wafer level package having a cylindrical capacitor is also provided. | 02-17-2011 |
20110109339 | APPARATUS AND METHOD FOR INSPECTING CIRCUIT OF SUBSTRATE - Disclosed herein is an apparatus and method for inspecting a circuit of a substrate. The apparatus includes a pin probe coming into contact with a first end of an electrode formed on a first side of a substrate, a voltage source for applying a voltage to the pin probe, a film disposed at a second end of the electrode formed on a second side of the substrate, a dielectric fluid sealed in the film, and an electronic ink dispersed in the dielectric fluid, and charged with electricity to flow when the electrode is electrified. The present invention is advantageous in that whether an electrode has been electrified is measured using charged electronic ink, so that the use of a pin probe is limited to one side of a substrate, thus reducing cost required for the entire inspection. | 05-12-2011 |
20110115516 | APPARATUS AND METHOD FOR INSPECTING DEFECTS IN CIRCUIT PATTERN OF SUBSTRATE - Disclosed herein is an apparatus and method for inspecting defects in the circuit pattern of a substrate. The apparatus for inspecting defects in a circuit pattern of a substrate includes a pin probe configured to input a voltage while coming into contact with an inspection target circuit pattern of a substrate. A capacitor sensor is provided with a membrane electrode which is opposite a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner, and is configured to detect both capacitance and capacitance variation, generated due to displacement of the membrane electrode attributable to electrostatic attractive force acting from the connection circuit pattern on the membrane electrode. A capacitance measurement unit is connected to the capacitor sensor and is configured to measure capacitance attributable to the displacement of the membrane electrode, which is input from the capacitor sensor. | 05-19-2011 |
20110116084 | METHOD OF INSPECTING DEFECTS IN CIRCUIT PATTERN OF SUBSTRATE - Disclosed herein is a method of inspecting defects in a circuit pattern of a substrate. At least one laser beam radiation unit for radiating a laser beam onto an inspection target circuit pattern of a substrate in a non-contact manner is prepared. A probe beam radiation unit for radiating a probe beam onto a connection circuit pattern to be electrically connected to the inspection target circuit pattern in a non-contact manner is prepared. The laser beam is radiated onto the inspection target circuit pattern using the laser beam radiation unit. The probe beam is radiated onto the connection circuit pattern using the probe beam radiation unit, thus measuring information about whether the probe beam is diffracted, and a diffraction angle. Accordingly, the method can solve problems such as erroneous measurements caused by contact pressure and can reduce the time required for measurements. | 05-19-2011 |
20110128011 | APPARATUS AND METHOD FOR INSPECTING DEFECTS IN CIRCUIT PATTERN - Disclosed herein is an apparatus and method for inspecting defects in a circuit pattern. In the inspection apparatus and method, a laser beam is radiated by a laser unit onto a first end of a circuit pattern, and variation in impedance of a capacitor sensor disposed at a second end of the circuit pattern is measured, thus measuring the open/short circuits of the circuit pattern. | 06-02-2011 |
20130147014 | Wafer Level Package Having Cylindrical Capacitor and Method Of Fabrication The Same - Disclosed is a wafer level package having a cylindrical capacitor, which is capable of increasing electrostatic capacity thanks to the use of a cylindrical capacitor structure and which includes a wafer chip having a bonding pad formed thereon and an insulating layer formed thereon and exposing the bonding pad, a redistribution layer connected to the bonding pad and extending to one side of the insulating layer, a cylindrical outer electrode connected to the redistribution layer and having a center opening therein, a cylindrical inner electrode formed in the center opening of the outer electrode so as to be separated from the outer electrode, a dielectric layer formed between the outer electrode and the inner electrode, and a resin sealing portion formed on the insulating layer to cover the redistribution layer, the inner electrode, the outer electrode and the dielectric layer and having a first recess for exposing an upper surface of the inner electrode. A method of fabricating the wafer level package having a cylindrical capacitor is also provided. | 06-13-2013 |
Patent application number | Description | Published |
20090255722 | Printed circuit board having landless via hole and method of manufacturing the same - This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of a second metal and a plating layer made of a third metal, which is different from the second metal, and to a method of manufacturing the same. In the printed circuit board, the via has no upper land, thus making it possible to finely form the circuit pattern which is connected to the via, thereby realizing a high-density circuit pattern. | 10-15-2009 |
20090260868 | Printed circuit board and method of manufacturing the same - The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a cylindrical shape, and thus exhibits good interlayer electrical connection and high reliability of physical contact upon thermal stress caused by the variance in physical properties of material depending on changes in temperature. The via has no upper land, and thus a fine circuit pattern of the circuit layer can be formed on the via. | 10-22-2009 |
20090288872 | Printed circuit board including outmost fine circuit pattern and method of manufacturing the same - Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so that the outmost circuit layer of the substrate, which needs to have a relatively high density in order to mount chips, compared to other circuit layers, can be more finely formed. | 11-26-2009 |
20120011716 | Method of manufacturing printed circuit board including outmost fine circuit pattern - A method of manufacturing a printed circuit board including: preparing a first double-sided substrate including a first insulating layer, a first lower copper layer, a second circuit layer including a first lower land, and a first via; preparing a second double-sided substrate including a second insulating layer, a third lower copper layer, a fourth circuit layer including a second lower land, and a second via; disposing a third insulating layer between the second circuit layer and the fourth circuit layer such that the first lower land and the second lower land are electrically connected to each other though a conductive bump; and forming a first circuit layer including a first circuit pattern connected to the first via on the first lower copper layer and forming a third circuit layer including a third circuit pattern connected to the second via on the third lower copper layer. | 01-19-2012 |
20120060369 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING LANDLESS VIA HOLE - Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer. | 03-15-2012 |
20120152753 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board that simultaneously forms a via and an embedding land and thus improves the matching value of the via and the embedding land to secure interlayer conduction reliability, and further simultaneously forms the via and the embedding land to reduce manufacturing costs. In addition, the embedding land is formed to be embedded in the second insulating layer to implement high-density/high-integration of the printed circuit board and a via is formed in less time as compared to a method of forming a via hole using laser to reduce a process time. | 06-21-2012 |