Nawafune
Hidemi Nawafune, Kobe-Shi JP
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20100270057 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a mold | 10-28-2010 |
Hidemi Nawafune, Osaka JP
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20100215979 | Method of forming metal film and metal wiring pattern, undercoat composition for forming metal film and metal wiring pattern, and metal film - A method of forming a metal film and a metal wiring pattern is described a step of forming an organic film by applying and polymerizing an undercoat composition for forming a metal film containing an addition-polymerizable monomer having an acidic group and a polymerization initiator on a substrate or film, a step of converting the acidic group into a metal (M1) salt by treating the organic film with an aqueous solution containing a metal (M1) ion, a step of converting the metal (M1) salt into a metal (M2) salt by treating the organic film with an aqueous solution containing a metal (M2) ion having an ionization tendency lower than the metal (M1) ion, and a step of forming a metal film on the organic film surface by reducing the metal (M2) ion. | 08-26-2010 |
Hidemi Nawafune, Takatsuki JP
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20090321269 | SILVER AND SILVER ALLOY PLATING BATH - To develop stable, non-cyanide silver and silver alloy plating baths. The present invention is a silver and silver alloy plating bath, comprises: (A) a soluble salt, comprising a silver salt or a mixture of a silver salt and a salt of a metal selected from the group consisting of tin, bismuth, cobalt, antimony, iridium, indium, lead, copper, iron, zinc, nickel, palladium, platinum, and gold; and (B) at least one aliphatic sulfide compound comprising a functionality selected from the group consisting of an ether oxygen atom, a 3-hydroxypropyl group, and a hydroxypropylene group, with the proviso that the aliphatic sulfide compound does not comprise a basic nitrogen atom. | 12-31-2009 |
Hidemi Nawafune, Hyogo JP
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20090134364 | Polyamide acid containing ultrafine metal particle - The present invention provides a method for producing a polyamic acid containing ultrafine metal particles, which contains the steps of contacting an aqueous solution containing a water-soluble metal compound with fine polyamic acid particles to adsorb metal ions to the fine polyamic acid particles, and then performing a reduction treatment; and a conductive adhesive which contains as an active ingredient the polyamic acid containing ultrafine metal particles. The conductive adhesive of the present invention has excellent performance which enables the adhesive to be used as an alternative to high-temperature lead solders. | 05-28-2009 |