Patent application number | Description | Published |
20100308683 | Brushless DC Motor and Stator Thereof - A stator for a brushless DC motor includes a cylindrical member and a positioning member. The cylindrical member is formed by a plurality of metal wires. Each metal wire includes two ends each forming a terminal. The cylindrical member includes first and second ends separated along a longitudinal axis. The positioning member includes an annular body received in the first end of the cylindrical member and separated from the second end of the cylindrical member along the longitudinal axis. The positioning member maintains a shape of the cylindrical member. The stator can be mounted in a space defined by a housing and a base engaged with the housing, forming a brushless DC motor. A bearing and a circuit board are mounted in the space. The bearing rotatably supports a shaft. A permanent magnet is mounted to the shaft and aligned with the stator. | 12-09-2010 |
20100316509 | Miniature Fan - A miniature fan includes a housing having a mounting portion with a shaft seat. A base is mounted to the mounting portion of the housing. The base includes first and second faces spaced along an axis. An outer layer is provided on the first face of the base. A bottom layer is provided on the second face of the base. The base further includes a coil unit intermediate the outer layer and the bottom layer. The coil unit is electrically connected to a drive circuit. An impeller includes a shaft and a permanent magnet. The shaft is coupled to the shaft seat of the housing and rotatable about the axis. The permanent magnet is aligned with the coil unit. The axial height of the miniature fan is reduced, and the structure of the miniature fan is simplified. | 12-16-2010 |
20110050027 | Motor Rotor - A motor rotor includes a magnetically conducting member having an inner periphery and an outer periphery spaced from the inner periphery in a radial direction. The magnetically conducting member further includes first and second ends spaced along an axis perpendicular to the radial direction. The magnetically conducting member includes a reinforcing portion extending from the first end in the radial direction. A rotatable member is formed by injection molding and embraces and engages the outer periphery of the magnetically conducting member. The rotatable member includes an opening receiving the first end of the magnetically conducting member and is rotatable about the axis. A permanent magnet is coupled to the inner periphery of the magnetically conducting member. The reinforcing portion reinforces the first end of the magnetically conducting member, which is useful during injection molding of the rotatable member. | 03-03-2011 |
20110097221 | Motor and Heating Dissipating Fan Including Motor - A motor includes a balancing member having a surface. The surface has a shaft coupling portion and a magnetically conductive portion. A stator is coupled to the balancing member. A rotor includes a hub, a shaft, and a permanent magnet. The shaft and the permanent magnet are mounted inside the hub. The shaft is rotatably coupled to the shaft coupling portion. The permanent magnet includes a magnetically attracting face aligned with the magnetically conductive portion of the balancing member. The magnetically attracting face and the magnetically conductive portion attract each other to maintain stable rotation of the rotor while providing a simplified structure. The balancing member can be interconnected to a housing, and the hub can include a plurality of blades to form a heat dissipating fan. When the rotor rotates, air currents are drawn by the blades to a heat source for heat dissipating purposes. | 04-28-2011 |
20110148226 | Miniature Motor - A miniature motor includes a substrate having a pivotal portion. A coil unit and a detection element are provided around the pivotal portion. A rotor is rotatably mounted to the pivotal portion and includes a hub and a permanent magnet mounted to the hub and aligned with the coil unit and the detection element. The permanent magnet includes a plurality of north and south poles each having a stronger magnetism section. A weaker magnetism section is formed between two adjacent stronger magnetism sections. At least one auxiliary starting member is mounted between the substrate and the rotor and aligned with the permanent magnet. When the rotor stops rotating, the at least one auxiliary starting member aligns with and magnetically attracts at least one of the stronger magnetism sections, locating the detection element in a position not aligned with the weaker magnetism sections along an axis of the hub. | 06-23-2011 |
20130200738 | Motor with Oil Storage Function - The invention discloses a motor with oil storage funciton. The motor includes a base, a bearing, a stator unit and a rotor. The base includes a shaft tube portion having a closed end and an open end. The bearing is received in the shaft tube portion of the base. The stator unit is fixed to the base and has an insulation unit. The insulation unit has a blocking portion extending towards the open end of the shaft tube portion. The rotor includes a hub having a shaft and a permanent magnet. The shaft is rotatably coupled with the bearing, and an air gap is formed between the permanent magnet and the stator unit. The blocking portion of the insulation unit, the shaft tube portion and the bearing jointly form an enlarged oil chamber at the open end of the shaft tube portion. | 08-08-2013 |
Patent application number | Description | Published |
20080295315 | Method of making a metal frame - A method of making a metal frame is a consistent operation including material-choosing, cutting, jointing, riveting and shaping, wherein the material-choosing is to take coiled banding metal plates as material and the metal plates are cut into two I-shaped and two flat U-shaped metal components. One piece or more than one pair of protrusions and indentions is correspondingly set on the ends of each metal component and each arm of the flat U-shaped metal components. Upon jointing, engage the protrusions and indentations on the I-shaped metal components with the corresponding protrusions and indentations on the edges of two arms. Upon riveting, the inner edge of each protrusion and the outer edge of each indentation are respectively punched to make stamping marks. Upon shaping, punch and fold rims of the metal frame to become roughly vertical for making a metal frame with inverted L-shaped cross-section on each side. | 12-04-2008 |
20090020279 | Jointing structure of a heat dissipating fin - A jointing structure of a heat dissipating fin, disposed on an upper level edge and a lower level edge of each fin body of the heat dissipating fin, comprises at least one hole or more on each of the level edges, at least one lock tab or more on the fin body of the heat dissipating fin corresponding to the hole, and the lock tab is formed by directly folding the fin body instead of extendingly disposed from the upper and lower level edges. More than one protrusion is disposed on each of the lock tabs. The protrusions on the lock tabs of the upper and lower level edges in a previous fin body are coupled into the corresponding holes of the upper and lower level edges in a next fin body, so as to join multiple heat dissipating fins integrally and stably. | 01-22-2009 |
20090060679 | Fastening apparatus of a heat radiator - A fastening apparatus of a heat radiator, disposed on an upper folding edge and a lower folding edge of each radiator body, comprises more than one opening on each of the folding edges, more than one arrow-headed fastener with a notch in the center thereof, and more than one inwardly slanted projection on each upper and lower folding edges respectively. The arrow-headed fasteners on the upper and lower folding edges of each previous radiator body sequentially hook to the corresponding openings on the upper and lower folding edges of each next radiator body, so that a plurality of heat radiators are joined integrally, the inwardly slanted projections are disposed on the upper and lower folding edges of each previous radiator body to hold the rear part of each next radiator body, and the fastening apparatuses are joined more stably at a constant distance, and thus are prevented from being loosened. | 03-05-2009 |
20090128443 | Fixing device of a radiator sheet - A fixing device of a radiator sheet comprises more than one pair of apertures and more than one pair of hooks; the apertures are shaped as rectangular or elongated circular holes and disposed on the upper and lower folding plates of a sheet body. The hooks are shaped as either a horizontally-tilted “U” with an upper hook or a horizontally-tilted “U” with a lower hook, and are disposed on a junction between the upper and lower folding plates and the sheet body in correspondence to each of the apertures. Moreover, at least one or more square-bracket concavities, inclined concavities, or parenthesis-inclined concavities are respectively disposed on the upper and lower folding plates. | 05-21-2009 |
Patent application number | Description | Published |
20100139905 | Combination Heat Sink Formed of a Stack of Heat Spreader Sheet Members - A combination heat sink formed of a stack of heat spreader sheet members is disclosed. Each heat spreader sheet member has a flat base panel two side flanges respectively perpendicularly extending along two opposite lateral sides of the flat base panel in a parallel manner, a plurality of narrow elongated notches respectively symmetrically formed on the two opposite lateral sides of the flat base panel, and a plurality of protruding positioning portions respectively formed of the side flanges in such a manner that when two heat spreader sheet members are attached together the protruding positioning portions of one heat spreader sheet member are inserted through the narrow elongated notches of the other heat spreader sheet member bent sideways and secured to the side flanges of the other heat spreader sheet member, and therefore the two stacked heat spreader sheet members are firmed secured together. | 06-10-2010 |
20100157536 | HEAT RADIATING MEMBER MOUNTING STRUCTURE - A heat radiating member mounting structure for enabling multiple heat radiating members to be fastened together in a stack without tools is disclosed. Each heat radiating member has convex portions and lugs formed on each of two upright side flanges at two sides of a flat base thereof such that multiple heat radiating members can be fastened together by means of engaging protruding portions of the lugs of one heat radiating member into locating grooves in the convex portions of another heat radiating member. | 06-24-2010 |
20110027605 | METAL SHEET MEMBER HAVING HIGH PLASTIC BONDING STRENGTH - A metal sheet member for insert molding with a plastic member is disclosed having a plurality of bonding portions arranged on the top wall thereof for enhancing the bonding strength of the plastic member to the metal sheet member, each bonding portion including a groove located on the top wall of the metal sheet member and a lug formed of a part of the metal sheet member and obliquely upwardly curved from one end of the groove. | 02-03-2011 |
20120121867 | METAL PLATE MEMBER FOR THE FABRICATION OF A COMPOSITE PLATE MEMBER - A metal plate member for the fabrication of a composite plate member is disclosed having a flat plate body and multiple binding structures located on one side of the flat plate body. Each binding structure includes one or a number of binding strips upwardly curvedly extended from one side of the flat plate body and a binding space defined between each binding strip and the flat plate body. After bonding of one plastic rod member to each binding structure or a second plate member to the flat plate body of the metal plate member, the binding strips of each binding structure provide a multi-directional stop effect to prohibit displacement of the plastic rod members or second plate member relative to the metal plate member. | 05-17-2012 |
20120175084 | HEAT PIPE WITH A RADIAL FLOW SHUNT DESIGN - A heat pipe includes a pipe body filled up with a working fluid and having opposing evaporation segment and condensing segment, a first wick structure having ribs axially extending through the evaporation segment and the condensing segment, a channel defined between each two adjacent ribs and grooves transversely cut through the ribs, and a second wick structure sintered and joined to a predetermined part of the first wick structure in the evaporation segment to fill in the channels and the spiral grooves and to cover the ribs. | 07-12-2012 |
20120181404 | THIN-SHEET METAL MEMBER MOUNTING STRUCTURE - A thin-sheet metal member mounting structure includes a body member having retaining grooves spaced around the periphery thereof, and a cover member made of a metal material comprising a base portion attached to the top wall of the body member, a wing portion extending from the border of the base portion at a predetermined angle and attached to the periphery of the body member and a plurality of male fastening devices protruded from and formed of a part of the inside wall of the wing portion remote from the base portion by means of a cutting technique and respectively forced into engagement with the retaining grooves of the body member. | 07-19-2012 |
20140131013 | LOW-PROFILE HEAT PIPE - A low-profile heat pipe includes a flat plate-like first pipe component shaped like a flat plat member and having a wick structure sintered to the inner surface thereof, a flat plate-like second pipe component having a wick structure sintered to the inner surface thereof, an enclosed cavity defined in between the first pipe component and the second pipe component and surrounded by the wick structures of the first and second pipe components, and a working fluid contained in the enclosed cavity. | 05-15-2014 |
20140138056 | LOW-PROFILE COMPOSITE HEAT PIPE - A low-profile composite heat pipe includes a flat plate-like first pipe component shaped like a flat plat member and having flow-guide grooves located at the inner surface between two opposite ends thereof and a wick structure sintered on the surface of the flow-guide grooves, a flat plate-like second pipe component having flow-guide grooves located at the inner surface between two opposite ends thereof and a wick structure sintered on the surface of the flow-guide grooves, an enclosed cavity defined in between the first pipe component and the second pipe component and surrounded by the wick structures of the first and second pipe components, and a working fluid contained in the enclosed cavity. | 05-22-2014 |
20140138057 | STRUCTURE OF LOW-PROFILE HEAT PIPE - A structure of low-profile heat pipe includes a flat heat-transfer pipe head and an elongated flat flow-guide pipe body formed in integrity, a heat-transfer cover plate affixed to the flat heat-transfer pipe head and the elongated flat flow-guide pipe body, a cavity defined in between the flat heat-transfer pipe head and elongated flat flow-guide pipe body and the heat-transfer cover plate and holding a working fluid and defining a condensation side at its one end remote from the flat heat-transfer pipe head and an evaporation side at its other end within the flat heat-transfer pipe head, and a wick structure surrounding and in communication with the cavity. | 05-22-2014 |
20150040353 | STRUCTURE OF PLANETARY TYPE DUAL-SHAFT HINGE - A planetary type dual-shaft hinge includes a female shaft, a male shaft set including first and second male shafts respectively inserted through the female shaft, and a transmission mechanism including first and second transmission members respectively connected to the first and second male shafts and a link pivotally coupled between the first and second transmission members in such a manner that the pivoting points between the link and the first and second transmission members are disposed at two opposite sides relative to the central axes of the first and second transmission members so that when the user opens the cover member of the flip-up electronic device in which the hinge is used, the first male shaft is turned around the second male shaft to smoothen the movement of the cover member. | 02-12-2015 |
Patent application number | Description | Published |
20080306370 | Method of examining dynamic cardiac electromagnetic activity and detection of cardiac functions using results thereof - A method of examining cardiac electromagnetic activity over a heart for diagnosing the cardiac functions of the heart is disclosed. The method may include constructing a phase diagram of electromagnetic signals over a heart by collecting sets of time-dependent magnetic signals, determining the zeroth and the first derivations of each set of the magnetic signals at a given time, and categorizing the zeroth and the first derivations of the magnetic signals in either of the four phases: (+, +), (−, −), (+, −), (−, +). The method may also include monitoring a wave propagation of the magnetic signals. | 12-11-2008 |
20090030301 | Method of examining dynamic cardiac electromagnetic activity and detection of cardiac functions using results thereof - A method of examining cardiac electromagnetic activity over a heart for diagnosing the cardiac functions of the heart is disclosed. The method includes collecting a plurality of sets of spatially distributed, time-varying magnetic field signals of the heart of a subject, wherein the magnetic field signals exhibit features of at least a wave, identifying a time corresponding to a local maximum intensity of the magnetic field signals of the wave at each measurement position and plotting a temporal evolution of the local maximum intensity of the magnetic field signals during a time interval of the wave. | 01-29-2009 |
20090042198 | METHOD FOR MEASURING CONCENTRATION OF NUCLEIC ACIDS - A method for measuring a concentration of nucleic acids is described. The method includes providing bioprobe molecules that include single-stranded nucleic acids, wherein the bioprobe molecules are conjugated with magnetic beads in a solution. A sample of single-stranded target nucleic acids is added to solution, where the single-stranded target nucleic acids hybridize with the single-stranded nucleic acids of the bioprobe molecules. A reduction of the ac (alternating current) magnetic susceptibility of the solution prior and after the addition of the sample to the solution is determined. | 02-12-2009 |
20090325317 | METHOD AND SYSTEM FOR SUPPRESSING BINDINGS ON MAGNETIC PARTICLES - A method for suppressing non-specific bindings between molecules includes providing magnetic particles dispersed in a liquid, wherein each of the magnetic particles has a magnetization. The magnetic particles are coated with coating molecules. Binding molecules mixed of first-type binding molecules and second-type binding molecules are applied to the liquid, wherein the coating molecules are specifically binding with the first-type binding molecules and non-specifically binding with the second-type binding molecules. An alternating current (ac) magnetic field is applied at an axis with a frequency level, wherein the frequency level causes suppression of the second-type binding molecules in binding with the coating molecules. | 12-31-2009 |
Patent application number | Description | Published |
20130027105 | NON-OVERLAP CIRCUIT - A non-overlap circuit includes a first delay circuit configured to receive a first input signal and output a first control signal to a driver circuit, sensing circuitry configured to sense a current generated in response to the first control signal coupled through bulk semiconductor of a semiconductor substrate and produce a feedback signal response, and a second delay circuit. The second delay circuit configured to receive the feedback signal from the sensing circuitry and a second input signal and output a second control signal to the driver circuit based on the sensed feedback signal and the second input signal. | 01-31-2013 |
20130043541 | LOW POWER/HIGH SPEED TSV INTERFACE DESIGN - A TSV interface circuit for a TSV provided in an interposer substrate that forms a connection between a first die and a second die includes a driving circuit provided in the first die and a receiver circuit provided in the second die where the driving circuit is coupled to a first supply voltage and a second supply voltage that are both lower than the interposer substrate voltage that substantially reduces the parasitic capacitance of the TSV. The receiver circuit is also coupled to the first supply voltage and the second supply voltage that are both lower than the interposer substrate voltage. | 02-21-2013 |
20130147057 | THROUGH SILICON VIA (TSV) ISOLATION STRUCTURES FOR NOISE REDUCTION IN 3D INTEGRATED CIRCUIT - Through silicon via (TSV) isolation structures are provided and suppress electrical noise such as may be propagated through a semiconductor substrate when caused by a signal carrying active TSV such as used in | 06-13-2013 |
20130162331 | DIODE STRING VOLTAGE ADAPTER - A diode string voltage adapter includes diodes formed in a substrate of a first conductive type. Each diode includes a deep well region of a second conductive type formed in the substrate. A first well region of the first conductive type formed on the deep well region. A first heavily doped region of the first conductive type formed on the first well region. A second heavily doped region of the second conductive type formed on the first well region. The diodes are serially coupled to each other. A first heavily doped region of a beginning diode is coupled to a first voltage. A second heavily doped region of each diode is coupled to a first heavily doped region of a next diode. A second heavily doped region of an ending diode provides a second voltage. The deep well region is configured to be electrically floated. | 06-27-2013 |
20130307516 | BANDGAP REFERENCE CIRCUIT - A bandgap reference circuit including two sets of bipolar junction transistors (BJTs). A first set of two or more BJTs configured to electrically connect in a parallel arrangement. The first set of BJTs is configured to produce a first proportional to absolute temperature (PTAT) signal. A second set of two or more BJTs configured to electrically connect in a parallel arrangement. The second set of BJTs is configured to produce a second PTAT signal. A circuitry configured to electrically connect to the first set of BJTs and the second set of BJTs. The circuitry is configured to combine the first PTAT signal and the second PTAT signal to produce a reference voltage. | 11-21-2013 |
20130328162 | HOMO-JUNCTION DIODE STRUCTURES USING FIN FIELD EFFECT TRANSISTOR PROCESSING - Diodes and bipolar junction transistors (BJTs) are formed in IC devices that include fin field-effect transistors (FinFETs) by utilizing various process steps in the FinFET formation process. The diode or BJT includes an isolated fin area and fin array area having n-wells having different depths and a p-well in a portion of the fin array area that surrounds the n-well in the isolated fin area. The n-wells and p-well for the diodes and BJTs are implanted together with the FinFET n-wells and p-wells. | 12-12-2013 |
20130328614 | DEVICE LAYOUT FOR REFERENCE AND SENSOR CIRCUITS - A band gap reference circuit includes an error-amplifier-based current mirror coupled between a first supply node and a pair of intermediate voltage nodes, and a matched diode pair for providing a proportional-to-absolute temperature (PTAT) current. The matched diode pair includes a first diode connected between a first intermediate voltage node from the pair of intermediate voltage nodes and a second supply node, and a second diode connected in series with a resistor between a second intermediate voltage node from the pair of intermediate voltage nodes and the second supply node. Each diode has a P-N diode junction that is a homojunction. | 12-12-2013 |
20140042585 | SYSTEM FOR DESIGNING A SEMICONDUCTOR DEVICE, DEVICE MADE, AND METHOD OF USING THE SYSTEM - This disclosure relates to a method of making a semiconductor device. The method includes comparing a schematic design of the semiconductor device to a layout design of the semiconductor device. The method further includes generating layout style information based on the layout design and generating array edge information based on the layout design and the schematic design. The method further includes selectively revising the layout design using smart dummy insertion using the layout style information and the array edge information. The method further includes performing a design rule check on the revised layout design using the layout style information and the array edge information. This disclosure also relates to a system for making a semiconductor device and a semiconductor device. | 02-13-2014 |
20140077230 | DEVICE LAYOUT FOR REFERENCE AND SENSOR CIRCUITS - A band gap reference circuit includes an error-amplifier-based current mirror coupled between a first supply node and a pair of intermediate voltage nodes, and a matched diode pair for providing a proportional-to-absolute temperature (PTAT) current. The matched diode pair includes a first diode connected between a first intermediate voltage node from the pair of intermediate voltage nodes and a second supply node, and a second diode connected in series with a resistor between a second intermediate voltage node from the pair of intermediate voltage nodes and the second supply node. Each diode has a P-N diode junction that is a homojunction. | 03-20-2014 |
20140077331 | DIODE STRUCTURES USING FIN FIELD EFFECT TRANSISTOR PROCESSING AND METHOD OF FORMING THE SAME - A method of forming one or more diodes in a fin field-effect transistor (FinFET) device includes forming a hardmask layer having a fin pattern, said fin pattern including an isolated fin area, a fin array area, and a FinFET area. The method further includes etching a plurality of fins into a semiconductor substrate using the fin pattern, and depositing a dielectric material over the semiconductor substrate to fill spaces between the plurality of fins. The method further includes planarizing the semiconductor substrate to expose the hardmask layer. The method further includes implanting a p-type dopant into the fin array area and portions of the FinFET area, and implanting an n-type dopant into the isolated fin area, a portion of the of fin array area surrounding the p-well and portions of the FinFET area. The method further includes annealing the semiconductor substrate. | 03-20-2014 |
20140103494 | Nearly Buffer Zone Free Layout Methodology - The present disclosure relates to a layout arrangement and method to minimize the area overhead associated with a transition between a semiconductor device array and background features. A nearly buffer zone free layout methodology is proposed, wherein an array of square unit cells with a first pattern density value is surrounded by background features with a second pattern density value. A difference between the first pattern density value and second pattern density value results in a density gradient at an edge of the array. Unit cells on the edge of the array which are impacted by a shape tolerance stress resulting from the density gradient are identified and reconfigured from a square shape aspect ratio to a rectangular shape aspect ratio with along axis of the unit cell oriented in a direction parallel to the variation induced shape tolerance stress to alleviate the variation. | 04-17-2014 |
20140215419 | ANALYTICAL MODEL FOR PREDICTING CURRENT MISMATCH IN METAL OXIDE SEMICONDUCTOR ARRAYS - A system and method for designing integrated circuits and predicting current mismatch in a metal oxide semiconductor (MOS) array. A first subset of cells in the MOS array is selected and current measured for each of these cells. Standard deviation of current for each cell in the first subset of cells is determined with respect to current of a reference cell. Standard deviation of local variation can be determined using the determined standard deviation of current for one or more cells in the first subset. Standard deviations of variation induced by, for example, poly density gradient effects, in the x and/or y direction of the array can then be determined and current mismatch for any cell in the array determined therefrom. | 07-31-2014 |
20140264772 | Shielding for Through-Silicon-Via - 3D integrated circuit devices include first and second semiconductor bodies. The first semiconductor body has an active area, a through-silicon-via outside the active area, and two or more disjoint guard rings. The first guard ring encircles the via. The second guard ring encircles the active area, but not the via. The guard rings can reduce the noise coupling coefficient between the via and the active area to −60 dB or less at 3 GHz and 20 μm spacing. | 09-18-2014 |
20140368264 | TEMPERATURE/VOLTAGE DETECTION CIRCUIT - A circuit includes a comparator unit, a capacitive device, and a switching network. The comparator unit is configured to set a control signal at a first logical value when an output voltage reaches a first voltage value from being less than the first voltage value, and to set the control signal at a second logical value when the output voltage reaches a second voltage value from being greater than the second voltage. The capacitive device provides the output voltage. The switching network is configured to charge or discharge the capacitive device based on the control signal. | 12-18-2014 |
20140369381 | THERMAL SENSOR - A circuit includes a comparator unit and a switching network. The comparator unit is configured to receive a first voltage value, a second voltage value and a third voltage value of a voltage node, and to provide a control signal. The switching network includes the voltage node and is configured to operate in a first condition or in a second condition based on the control signal. Based on the first condition, the voltage node is configured to have a voltage value increase to the first voltage value. Based on a second condition, the voltage node is configured to have a voltage decrease to the second voltage | 12-18-2014 |
20140372959 | ANALYTICAL MODEL FOR PREDICTING CURRENT MISMATCH IN METAL OXIDE SEMICONDUCTOR ARRAYS - A system and method for designing integrated circuits and predicting current mismatch in a metal oxide semiconductor (MOS) array. A first subset of cells in the MOS array is selected and current measured for each of these cells. Standard deviation of current for each cell in the first subset of cells is determined with respect to current of a reference cell. Standard deviation of local variation can be determined using the determined standard deviation of current for one or more cells in the first subset. Standard deviations of variation induced by, for example, poly density gradient effects, in the x and/or y direction of the array can then be determined and current mismatch for any cell in the array determined therefrom. | 12-18-2014 |
20150035568 | TEMPERATURE DETECTOR AND CONTROLLING HEAT - A circuit with a temperature detector includes a first FET and a second FET. Each of the first and second FETs has a channel structure having a non-planar structure. The second FET is in close proximity to the first FET. A gate of the second FET is separated from the first FET, and a source and drain of the second FET are shorted together. A resistance of the gate of the second FET between two terminals on the gate of the second FET varies with a temperature local to the first FET. | 02-05-2015 |
20150108610 | NEARLY BUFFER ZONE FREE LAYOUT METHODOLOGY - In some embodiments, an integrated circuit includes a central array region having a first layout feature density. A background region surrounds the central array region and has a second layout feature density, which is different from the first density. A peripheral array region surrounds the central array region and separates the central array region from the background region. The peripheral array region has a third layout feature density between the first and second layout feature densities. | 04-23-2015 |
20150110158 | 3D THERMAL DETECTION CIRCUITS AND METHODS - A circuit includes sensing circuitry including at least one sensing element configured to output at least one temperature-dependent voltage. A compare circuit is configured to generate at least one intermediate voltage in response to comparing the at least one temperature-dependent voltage to a feedback voltage. A control circuit is configured to generate at least one control signal in response to the intermediate voltage. A switching circuit is configured to couple a capacitor coupled to a feedback node to one of a first voltage supply and a second voltage supply in response to the at least one control signal to generate an output signal having a pulse width that is based on a temperature sensed by the sensing circuitry. | 04-23-2015 |
20150115717 | MOS-BASED VOLTAGE REFERENCE CIRCUIT - A voltage reference circuit is provided that includes a first circuit, a second circuit and a third circuit. The first circuit has a first MOS transistor pair and the second circuit has a second MOS transistor pair. The first circuit is configured to provide a first voltage component that changes at a first rate having a first slope as a temperature to which the voltage reference circuit is subjected changes. The second circuit is configured to provide a second voltage component that changes at a second rate having a second slope as the temperature changes. The third circuit is configured to use the first voltage component and the second voltage component to generate the reference voltage component that changes at a fifth rate having a fifth slope as the temperature changes. The fifth slope is substantially equal to zero to promote insensitivity of the reference voltage component to temperature changes. | 04-30-2015 |
20150200249 | SEMICONDUCTOR DEVICE WITH SELF-HEAT REDUCING LAYERS - A semiconductor device comprises a substrate, a source region over the substrate, and a guard ring over the substrate. The guard ring is separated from the source region by a first spacing. The semiconductor device also comprises a first heat conductive layer formed over couples the source region and the guard ring. The semiconductor device further comprises a first via over a first portion of the first heat conductive layer. The semiconductor device additionally comprises a second via separate from the first via over a second portion of the first conductive layer. The semiconductor device also comprises a second heat conductive layer over and coupling the first via and the second via. In use, the semiconductor device generates heat, and the heat dissipates, at least partially, from the source region through the first heat conductive layer to the guard ring and the substrate. | 07-16-2015 |
20150370937 | INTEGRATED CIRCUIT TEMPERATURE DISTRIBUTION DETERMINATION - A method comprises constructing thermal block representations of one or more circuit components or one or more sub-components of the one or more circuit components in an integrated circuit based, at least in part, on defined component parameters. The component parameters describe the one or more sub-components of the one or more circuit components. The thermal block representations have at least one simulation node. The method also comprises supplying a current using at least one current source or voltage controlled current source in a performance simulation. The current is supplied to a thermal path between a first simulation node and a second simulation node. The method further comprises determining a temperature distribution between the first simulation node and the second simulation node based on the current, a first determined voltage at the first simulation node, and a second determined voltage at the second simulation node. | 12-24-2015 |
20160035715 | SYSTEM FOR DESIGNING A SEMICONDUCTOR DEVICE, DEVICE MADE, AND METHOD OF USING THE SYSTEM - A semiconductor device includes an edge active cell, an inner active cell and a middle active cell. The edge active cell is located near an edge of the semiconductor device. The edge active cell includes a plurality of fingers. The inner active cell is adjacent to the edge active cell toward a central portion of the semiconductor device. The inner active cell includes a plurality of fingers and at least one of the plurality of fingers of the edge active cell is electrically connected to at least one of the plurality of fingers of the inner active cell. The middle active cell is located near the central portion of the semiconductor device. The middle active cell includes a plurality of fingers and each of the fingers of the middle active cell is electrically connected to each other. | 02-04-2016 |
20160071806 | SHIELDING FOR THROUGH-SILICON-VIA NOISE COUPLING - In some embodiments, an integrated circuit device includes a semiconductor substrate. An active area is disposed in the semiconductor substrate. A first guard ring is disposed in the semiconductor substrate and entirely surrounds the active area. The first guard ring has a first conductivity type. A via penetrates through the semiconductor substrate and is spaced apart from the active area such that the via is disposed outside of the first guard ring. A second guard ring is disposed in the semiconductor substrate and entirely surrounds the via and the first guard ring. The second guard ring has the first conductivity type and is disjoint from the first guard ring. | 03-10-2016 |
Patent application number | Description | Published |
20110221581 | METHOD FOR CONTROLLING APPLIANCES BY SWING MOTION - A method for controlling appliances includes a wearing step, a swinging step and a controlling step. The control device is attached to a movable part of a user's body and the user swings the movable part to generate and send a control signal to the appliance so as to activate and control the appliance. The method is also helpful for rehabilitation to disable people. | 09-15-2011 |
20120026594 | MOLECULAR FILM FOR COATING OPTICAL LENSES AND A MANUFACTURE METHOD THEREOF - A molecular film for coating optical lenses comprises Octadecyltrichlorosilane; and a germicide, wherein the weight ratio between the germicide and the Octadecyltrichlorosilane is 3 to 13. Furthermore, a manufacture method of a molecular film for coating optical lenses comprises a step of “preparation,” by preparing a substrate, Octadecyltrichlorosilane solution and a germicide; a step of “cleaning,” by removing olein and contamination from surfaces of the substrate and washing the substrate; and a step of “soaking,” by soaking the substrate in a mixture of the germicide and Octadecyltrichlorosilane solution to generating a molecular film on the surfaces of the substrate. | 02-02-2012 |
20120029888 | TOPOGRAPHY SHAPING APPARATUS FOR FORMING SURFACES OF LOW FRICTION COEFFICIENT - The topography shaping apparatus for forming surfaces of low friction coefficient includes a data-input element, a computing element, and a shaping element. The data-input element is adapted to receive an action length, a fractal dimension value, and a fractal roughness parameter of a desired surface. The computing element connects with the data-input element to obtain a surface topography function from the data received by the data-input element. The shaping element connects with the computing element for processing a target surface to have a sectional outline matching the surface topography function to become the desired surface. | 02-02-2012 |
20130109036 | PROTEIN SUBSTRATE AND ITS MANUFACTURING METHOD | 05-02-2013 |
20130145877 | NUT FOR BALL SCREW - A nut for a ball screw mainly includes a nut, multiple dual-narrowed paths, multiple micro fans, a control portion, and multiple temperature sensing portions. The nut has a threaded path and the dual-narrowed paths are defined through the central axis of the nut and substantially parallel to the threaded path. Each of the dual-narrowed paths has a high-speed area and the diameter of each of the dual-narrowed paths is gradually reduced from two ends toward the high-speed area. The nut has micro fans which drive the air flows and reduce the temperature to increase the life of use and the precision of positioning. | 06-13-2013 |
Patent application number | Description | Published |
20090181513 | VERTICAL ORGANIC TRANSISTOR - A vertical organic transistor and a method for fabricating the same are provided, wherein an emitter, a grid with openings and a collector are sequentially arranged above a substrate. Two organic semiconductor layers are interposed respectively between the emitter and the grid with openings and between the grid with openings and the collector. The channel length is simply decided by the thickness of the organic semiconductor layers. The collector current depends on the space-charge-limited current contributed by the potential difference between the emitter and the openings of the grid. And the grid voltage can thus effectively control the collector current. Further, the fabrication process of the vertical organic transistor of the present invention is simple and exempt from using the photolithographic process. | 07-16-2009 |
20100021622 | Apparatus and method for forming multilayer polymer thin film - Apparatus and method for forming multilayer polymer thin film. The method uses a solution container with a gap to prevent the huge amount of solution from directly falling on the first layer. Then the wet film is formed by moving the container with the thin film thickness is decided by the distance between the gap and the substrate. The wet film is dried in a very short time by the heater therefore there is no time for the second solvent to dissolve the first layer. The method can effectively achieve the large-area and multilayer structure in organic devices through solution processing. | 01-28-2010 |
20100140594 | ORGANIC OPTOELECTRONIC COMPONENT - An organic optoelectronic component is provided, which includes a first electrode, an active layer formed on the first electrode, a second intermediate layer formed on the active layer, and a second electrode formed on the second intermediate layer, wherein the second intermediate layer is formed with a second mixture containing a second polymer and at least a second organic molecule. The second organic molecule is one for forming hole transferring material, electron transferring material, electron blocking material or hole blocking material. The organic optoelectronic component of the present invention is prepared by a solution process, thereby simplifying the process, improving film-formation property, and enhancing component efficiency. | 06-10-2010 |
20110108936 | PRESSURE DETECTOR AND PRESSURE DETECTOR ARRAY - A pressure detector is disclosed having an organic transistor, a pressure-detecting layer and a first electrode. The organic transistor includes an emitter, an organic layer, a grid formed with holes, and a collector, the organic layer being sandwiched between the emitter and the collector. The pressure-detecting layer is formed on the organic transistor such that the collector is sandwiched between the organic layer and the pressure-detecting layer. The first electrode is formed on the pressure-detecting layer such that the pressure-detecting layer is sandwiched between the collector and the first electrode. The area of the active region of the pressure detector is determined by the overlapped area of the electrodes, thereby reducing the pitch of the electrodes and thus the size of the pressure detector. | 05-12-2011 |
20110159171 | Method for preparing organic light emitting diode and device thereof - A method for fabricating an organic light emitting diode and a device thereof are provided. The method includes: providing a substrate; dispensing to the substrate a second organic molecule solution resulting from dissolving a second organic molecule in a solvent; applying the second organic molecule solution to a surface of the substrate so as to form a wet film layer; and heating the wet film layer by a heating unit to remove the solvent therefrom and thereby form a second organic molecule film. The method is effective in fabricating a uniform multilayer structure for use in fabrication of large-area photoelectric components. | 06-30-2011 |
20110163300 | ORGANIC LIGHT-EMITTING MATERIAL, ORGANIC LIGHT-EMITTING ELEMENT USING THE SAME AND METHOD OF FORMING THE SAME - The present invention provides compound of formula (I) | 07-07-2011 |
20110237019 | Method for Improving the Efficiency of Flexible Organic Solar Cells - The present invention discloses a method for improving the efficiency of flexible organic solar cells. The steps of the method comprise: a conductive film-coated flexible substrate is provided; and a hole blocking layer is formed on the flexible substrate by atomic layer deposition, or an active layer is formed first then a hole blocking layer is formed on the active layer by atomic layer deposition. Atomic layer deposition can control the thickness of the hole blocking layer precisely and form uniformly surface in a large area, so that the power conversion efficiency of the flexible organic solar cell is increasing effectively. | 09-29-2011 |
20110320145 | METHOD FOR PARAMETERS EXTRACTION OF SOLAR CELLS - The present invention discloses a method for extracting of solar cell parameters. After illuminating the solar cell by different simulated solar luminosity with different illumination intensity, measured current and measured voltages of the solar cell are acquired and the series resistance of the solar cell is extracted based on the measured current and measured voltages. The root mean square error (RMSE) is used to determine the series resistance of the solar cell. Therefore, the parameters of the solar cell are extracted without presuming current-voltage functional form. | 12-29-2011 |
20120325318 | SOLAR CELL AND FABRICATION METHOD THEREOF - A solar cell is provided that an extremely thin light absorber is formed between a n-type semiconductor layer and a p-type semiconductor layer such that the light absorber is used to absorb solar energy, while the p-type semiconductor layer may not absorb light. After separation of electrons and holes, the carriers will not recombine during the conduction, in order to avoid energy loss. | 12-27-2012 |
20130025666 | Novel Thin Film Solar Cell Structure - The present invention provides a kind of structure of a thin film solar cell, including: a transparent conductive layer, a first electrode, a second electrode, a conductive layer of metal, and a photoelectric conversion layer, wherein changing the structures of said first electrode and said second electrode can improve the efficiency of the cell. Because the distribution of electric potential is not uniform in the transparent conductive layer, it will reduce the efficiency of the cell. We can solve this problem by changing the electrode structures of the cell, and improve the efficiency of the cell. | 01-31-2013 |
20130025667 | Electrode Structure for Improving Efficiency of Solar Cells - The present invention provides an improved electrode structure for improving efficiency of solar cells, and the structure of the solar cells includes a back electrode, a transparent conducting glass layer, a photoelectric conversion layer, and a grid electrode. The transparent conducting glass layer includes a light-penetrated surface for accepting light. The photoelectric conversion layer is disposed between the back electrode and the transparent conducting glass layer to convert light energy into electric energy. The grid electrode is embedded in the transparent conducting glass layer to solve the problems of uneven electric potential for decreasing uneven voltage on the light-penetrated surface and further increasing efficiency of the solar cells. | 01-31-2013 |
20130137206 | ORGANIC LIGHT-EMITTING MATERIAL, ORGANIC LIGHT-EMITTING ELEMENT USING THE SAME AND METHOD OF FORMING THE SAME - The present invention provides compound of formula (I) | 05-30-2013 |
Patent application number | Description | Published |
20130300520 | STACKED LC RESONATOR AND BAND PASS FILTER USING THE SAME - Provided are a stacked LC resonator and a band pass filter using the same. The stacked LC resonator includes a flat metal base layer; a plurality of spiral inductors disposed layer by layer, corresponding to the flat metal base layer; and a plurality of dielectric layers, formed between the spiral inductors, and between the flat metal base layer and the spiral inductor corresponding to the flat metal base layer. The band pass filter includes two resonators with symmetrical structures, wherein the spiral inductors of the two resonators are disposed corresponding to each other. | 11-14-2013 |
20130321234 | MIMO ANTENNA DEVICE, ANTENNA AND ANTENNA PACKAGE - A multi-input and multi-output antenna device is disclosed. The MIMO antenna device comprises two antennas symmetrically disposed on a substrate. Each antenna comprises a T-shaped feeding unit, a radiation unit and a ground unit. The T-shaped feeding unit and the radiation unit are disposed on a first surface of the substrate. The T-shaped feeding unit forms a strip portion and a top portion. The radiation unit has first and second ends. The radiation unit extends from the first end to the second end to form a rectangular region and a spacing. The first end extends parallel to the top portion. The ground unit is disposed along two sides of the strip portion and electrically coupled to the second end. The two strip portions of the two T-shaped feeding units are parallel to and aligned with each other. The two ground units are electrically connected to each other. | 12-05-2013 |
20130338515 | WIRELESS DETECTION DEVICES AND WIRELESS DETECTION METHODS - A wireless detection device is provided, comprising a voltage control oscillation unit, a transceiving unit, demodulation unit and processing unit. The voltage control oscillation unit generates different oscillation signals according to analog control voltages and corresponding injection signals. The transceiving unit outputs first wireless signals to a predetermined area according to the oscillation signals and receives second wireless signals generated by reflection of the first wireless signals to generate the injection signal. The demodulation unit demodulates the oscillation signals into first voltage signals. The processing unit subtracts the corresponding analog control voltages from the first voltage signals to generate second voltage signals, and when the variation of the second voltage signals exceeds a predetermined value on a target frequency in frequency domain, the processing unit calculates a real distance between an object and the transceiving unit. | 12-19-2013 |
20140140443 | INJECTION-LOCKED RF RECEIVER HAVING TRIFILAR TRANSFORMER SPLITTER - The present invention relates to an injection-locked RF receiver having trifilar transformer splitter. The injection-locked RF receiver includes a trifilar transformer splitter, an injection-locked oscillator and a phase detector. The trifilar transformer splitter includes a primary winding, a secondary winding and a tertiary winding. RF input signal is input to the primary winding. The secondary winding outputs a first differential signal to the injection-locked oscillator. The tertiary winding outputs a second differential signal to the phase detector. Using the trifilar transformer splitter of the invention, the frequency-shift keying demodulation with high sensitivity is achieved, and the number of amplifier can be reduced so as to lower the power consumption of the injection-locked RF receiver and reduce the complexity of the involved system. | 05-22-2014 |
Patent application number | Description | Published |
20100265009 | STACKED LC RESONATOR AND BANDPASS FILTER OF USING THE SAME - A stacked LC resonator includes a parallel-plate capacitor, a dielectric layer and a spiral inductor. The parallel-plate capacitor has a first metal layer, a second metal layer opposed to the first metal layer and a middle dielectric layer formed between the first and second metal layers. The dielectric layer is formed on the second metal layer of the parallel-plate capacitor. The spiral inductor is formed on the dielectric layer and electrically connected with the first and second metal layers of the parallel-plate capacitor. | 10-21-2010 |
20100283513 | RF SENSING CIRCUIT WITH A VOLTAGE-CONTROLLED OSCILLATOR - An RF sensing circuit with a voltage-controlled oscillator comprises a low noise amplifier (LNA), a voltage-controlled oscillator (VCO), a frequency demodulating unit, a bandpass filter (BPF) and a digital signal processing unit. The VCO has an injection signal input port and a voltage input port, wherein the injection signal input port is electrically connected with an output of the LNA. The frequency demodulating unit is electrically connected with an output of the VCO and the BPF is electrically connected with an output of the frequency demodulating unit. The digital signal processing unit is electrically connected with an output of the BPF and the voltage input port of the VCO. | 11-11-2010 |
20110279275 | WIRELESS DETECTION APPARATUS AND METHOD - A wireless detection apparatus includes an antenna, a voltage control oscillator, and a processing unit. The antenna receives a first wireless signal and generates an electrical signal according to the first wireless signal. The first wireless signal is generated by reflecting a second wireless signal from an object under test. The voltage control oscillator is coupled to the antenna to generate an oscillating signal under an interference of the electrical signal. The oscillating signal varies with variation of the electrical signal. The processing unit is coupled to the voltage control oscillator to evaluate a parameter of the object under test according to the variation of the oscillating signal. | 11-17-2011 |
20120209087 | Non-Contact Vital Sign Sensing System and Sensing Method Using the Same - A non-contact vital sign sensing system including a vital sign sensing module and at least one body movement interference cancellation module is provided. The vital sign sensing module and the at least one body movement interference cancellation module are under a self-injection locking (SIL) mode. The vital sign sensing module senses an isotropic vital sign of a body. A mutual injection locking (MIL) mode is achieved between the vital sign sensing module and the at least one body movement interference cancellation module to sense the anisotropic body movement signal and to cancel the body movement interference. | 08-16-2012 |
20130143509 | POLAR RECEIVER USING INJECTION-LOCKING TECHNIQUE - A polar receiver using injection-locking technique includes an antenna, a first filter, a first voltage-controlled oscillator, a first mixer, a frequency discriminator, a second filter, a third filter, a first analog-digital converter, a second analog-digital converter and a digital signal processing unit. Mentioned polar receiver enables to separate an envelope signal and a frequency-modulated signal from a radio frequency signal received from the antenna via the injection locking technique of the first voltage-controlled oscillator and the frequency discriminator. The envelope component and the frequency-modulated component can be digitally processed by the digital signal processing unit to accomplish polar demodulation. | 06-06-2013 |
20140123763 | MOTION/VIBRATION DETECTION SYSTEM AND METHOD - A motion/vibration detection system and method therefore are provided. The system includes a transmitter and a receiver. The transmitter includes a transmit/receive antenna unit and a first oscillator. The receiver includes a receiving unit and a demodulation unit. The transmit/receive antenna unit receives an output signal from the first oscillator and transmits a detection signal. The detection signal is reflected from at least one object under detection into a reflected detection signal, which is received by the transmit/receive antenna unit. The transmit/receive antenna unit injects the reflected detection signal into the first oscillator and accordingly the first oscillator is under a self-injection locking mode. The receiving unit receives the detection signal. The demodulation unit demodulates the detection signal received by the receiving unit into a baseband output signal, to extract at least one motion/vibration information of the objection under detection. | 05-08-2014 |
20140128748 | MOTION/VIBRATION SENSOR - A motion/vibration sensor includes a transmit/receive antenna unit, an oscillation unit and a frequency-mixing unit. The transmit/receive antenna unit receives an output signal from the oscillation unit and transmits a detection signal toward at least one object. The detection signal is reflected by the object as a reflected detection signal and received by the transmit/receive antenna unit. The oscillation unit receives the reflected detection signal from the transmit/receive antenna unit for self-injection locking; and the frequency-mixing unit receives the reflected detection signal from the transmit/receive antenna unit for frequency demodulation. The frequency-mixing unit mixes and demodulates the reflected detection signal from the transmit/receive antenna unit with the output signal from the oscillation unit into a baseband output signal which represents a motion/vibration information. | 05-08-2014 |
20140327478 | WIDEBAND FREQUENCY SYNTHESIZER AND FREQUENCY SYNTHESIZING METHOD THEREOF - A wideband frequency synthesizer and a frequency synthesizing method thereof are provided. The wideband frequency synthesizer includes a phase-locked loop unit, a first voltage-controlled oscillating unit and a first frequency mixer unit. The phase-locked loop unit receives a reference signal and a feedback signal and generates a first oscillating signal according to the reference signal and the feedback signal. The first voltage-controlled oscillating unit generates a second oscillating signal. The first frequency mixer is coupled to the phase-locked loop unit and the first voltage-controlled oscillating unit, receives the first oscillating signal and the second oscillating signal for mixing frequencies of the first oscillating signal and the second oscillating signal to generate an output signal and taking the output signal as the feedback signal for outputting to the phase-locked loop unit. | 11-06-2014 |
20140379286 | METHOD FOR ESTIMATING PCB RADIATED EMISSIONS - A method for estimating PCB radiated emissions includes providing a BCI probe and a vector network analyzer; performing a calibration step; performing a measurement step; and performing an estimation step. A transfer impedance of the BCI probe is measured via a clamping device in the procedure of performing a calibration step. A measurement-input transfer function of an object and an output-input transfer function of the object are measured via the BCI probe in the procedure of performing a measurement step. Eventually, radiated emissions of the object can be estimated according to the measurement-input transfer function, the output-input transfer function and the transfer impedance in the procedure of performing an estimation step. The present invention accurately estimates radiated emissions of the object with low cost and high speed. | 12-25-2014 |
20150207499 | FREQUENCY SHIFT-KEYING READER CIRCUIT - A frequency shift-keying reader circuit includes a band-pass filter, a low noise amplifier, a first balun, an injection-lock divide-by-2 frequency divider, a sub-harmonic mixer and a low-pass filter. The band-pass filter performs a filtering procedure to a radio frequency signal, wherein the filtered radio-frequency signal is received by the low noise amplifier to provide an injection signal, and the injection signal is received by the first balun to generate a first differential signal and a second differential signal. The injection signal is received by the injection-lock divide-by-2 frequency divider to provide a first oscillation signal and a second oscillation signal, wherein the first differential signal, the second differential signal, the first oscillation signal and the second oscillation signal are received by the sub-harmonic mixer for performing a mixing procedure and thereafter generating an output signal, the low-pass filter performs a filtering procedure to the output signal. | 07-23-2015 |
20150214900 | DUAL FEEDBACK LOW NOISE AMPLIFIER - A dual feedback low noise amplifier includes a negative-feedback capacitive mutual-coupled common-gate amplifier of parallel-input parallel-output (PIPO) composed of a first transistor, a second transistor, a first coupling capacitor and a second coupling capacitor and a positive-feedback common-gate amplifier of parallel-input parallel-output (PIPO) composed of the first transistor, the second transistor, a first transformer and a second transformer. By means of dual feedback, the transconductance gain of the dual feedback low noise amplifier is increased, and the noise figure of the dual feedback low noise amplifier is decreased. | 07-30-2015 |
Patent application number | Description | Published |
20100291703 | BIOSENSOR - A biosensor applicable to an environment suitable for biosensing is provided, which is a solid-state element for performing detections in an aqueous environment. The biosensor at least includes a biosensing layer, a light-emitting diode and a photodiode. The biosensing layer causes changes in the light-emitting property thereof after absorbing, adsorbing and/or bonding with a biological substance released during in vivo signal transduction in an organism, and the rays of light generated by excitation of the light-emitting diode causes the biosensing layer to emit fluorescence. After the fluorescence is absorbed by the photodiode, it can be converted into an interpretable photocurrent signal. Afterwards, the meaning of the in vivo signal transduction can be understood by interpretation of the photocurrent signal. | 11-18-2010 |
20130025666 | Novel Thin Film Solar Cell Structure - The present invention provides a kind of structure of a thin film solar cell, including: a transparent conductive layer, a first electrode, a second electrode, a conductive layer of metal, and a photoelectric conversion layer, wherein changing the structures of said first electrode and said second electrode can improve the efficiency of the cell. Because the distribution of electric potential is not uniform in the transparent conductive layer, it will reduce the efficiency of the cell. We can solve this problem by changing the electrode structures of the cell, and improve the efficiency of the cell. | 01-31-2013 |
20130025667 | Electrode Structure for Improving Efficiency of Solar Cells - The present invention provides an improved electrode structure for improving efficiency of solar cells, and the structure of the solar cells includes a back electrode, a transparent conducting glass layer, a photoelectric conversion layer, and a grid electrode. The transparent conducting glass layer includes a light-penetrated surface for accepting light. The photoelectric conversion layer is disposed between the back electrode and the transparent conducting glass layer to convert light energy into electric energy. The grid electrode is embedded in the transparent conducting glass layer to solve the problems of uneven electric potential for decreasing uneven voltage on the light-penetrated surface and further increasing efficiency of the solar cells. | 01-31-2013 |