Patent application number | Description | Published |
20080218971 | METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUCTOR DEVICES - A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink. | 09-11-2008 |
20080225484 | THERMAL PILLOW - Methods, apparatus and assemblies for enhancing heat transfer in electronic components using a flexible thermal pillow. The flexible thermal pillow has a thermally conductive material sealed between top and bottom conductive layers, with the bottom layer having a flexible reservoir residing on opposing sides of a central portion of the pillow that has a gap. The pillow may have roughened internal surfaces to increase an internal surface area within the pillow for enhanced heat dissipation. In an electronic assembly, the central portion of the pillow resides between a heat sink and heat-generating component for the thermal coupling there-between. During thermal cycling, the flexible reservoir of the pillow expands to retain thermally conductive material extruded from the gap, and then contracts to force such extruded material back into the gap. An external pressure source may contact the pillow for further forcing the extruded thermally conductive material back into the gap. | 09-18-2008 |
20080232072 | CIRCUIT BOARD CAM-ACTION STANDOFF CONNECTOR - A cam-action expanding standoff connector and related method are disclosed for mounting a circuit board. The standoff connector includes a body and a plurality of mounting members having interior longitudinally-extending camming portions for engagement by a cam. A cam is configured to be positioned within the mounting members in a first position in which the mounting members are not expanded against the interior of a mounting opening and in a second position in which the cam engages the camming portions to expand the plurality of mounting members against the interior of the mounting opening. Since the camming action is horizontal only (purely radial), practically no vertical forces are applied to the circuit board and a best-fit alignment between a circuit board and heatsink can be established and maintained. | 09-25-2008 |
20080310117 | METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUCTOR DEVICES - A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink. | 12-18-2008 |
20080313879 | METHOD AND STRUCTURE FOR A PULL TEST FOR CONTROLLED COLLAPSE CHIP CONNECTIONS AND BALL LIMITING METALLURGY - A tensile strength testing structure for controlled collapse chip connections (C | 12-25-2008 |
20090090229 | METHOD AND APPARATUS FOR CONTROLLING SIZE AND ALIGNMENT OF PRECISION GROUND PLATES - An apparatus for maintaining alignment between precision ground plates includes a first plate including a main body portion having plurality of passages. The first plate also includes a first heating device mounted to heat the main body portion to a selected temperature. A second plate including a main body portion having a plurality of passages is positioned adjacent the first plate. The second plate includes a second heating device mounted to heat the main body portion to a selected temperature. A controller operatively connected to the first and second heating devices selectively establishes a desired temperature in each of the first and second plates to facilitate a desired alignment between the plurality of passages in the first plate and the plurality of passages in the second plate. | 04-09-2009 |
20090145973 | STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION APPLICATIONS - A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module. | 06-11-2009 |
20090177357 | FEEDBACK LOOP SYSTEM FOR PASSENGER SAFETY - Methods, systems and apparatus for automatically ensuring passenger safety by identifying article(s) in need of securing in a vehicle and attaching at least one wireless signaling component to each article. Each wireless signaling component includes a wireless signaling device and a mechanical blocking device that controls a wireless signal emitted from the wireless signaling device. The emitted wireless signaling indicates a state of the article. State information relating to a state of each article is generated and received at a data network device, which generates state results based on this state information. The state results are output to an end user, whereby the state results identify those articles that are secured, unsecured, and/or improperly secured, for automatically ensuring passenger safety. | 07-09-2009 |
20100200197 | LIQUID COOLED COMPLIANT HEAT SINK AND RELATED METHOD - A heat sink and method for using the same for use in cooling an integrated circuit (IC) chip is provided herein. The heat sink includes a manifold block, a liquid-filled cooling system, and a compliant foil affixed to the manifold block and backed by a liquid in the closed loop cooling system. The pressure provided by the liquid behind the foil causes the foil to bow, and to conform to non-planarities in the surface of the IC chip, thus reducing air gaps and increasing thermal coupling between the IC chip and the heat sink. | 08-12-2010 |