Patent application number | Description | Published |
20100001612 | LAMINATED CORE AND METHOD FOR MANUFACTURING THE SAME - A laminated core ( | 01-07-2010 |
20100270888 | LAMINATED CORE AND METHOD FOR MANUFACTURING THE SAME - A laminated core ( | 10-28-2010 |
20120222289 | METHOD OF MANUFACTURING LAMINATED ROTOR CORE - A method of manufacturing a laminated rotor core, including inserting permanent magnets into magnet insertion portions of an iron core formed by laminating plural core sheets; and thereafter to fix the magnets, injecting resin into the magnet insertion portions from a resin reservoir part in a die holding the iron core; the method comprising: a first process of placing a segment dummy plate between the body and the die, the plate covering one or more of the plural magnet insertion portions individually and including a resin injection hole continuing thereto; a second process of injecting the resin from the resin reservoir part of the die through the resin injection hole of the plate to the corresponding magnet insertion portions; and a third process of detaching the dummy plate with excess resin after the resin injected to the magnet insertion portions is cured; and the method improving a resin sealing process. | 09-06-2012 |
20140109391 | METHOD OF MANUFACTURING LAMINATED CORE HAVING PERMANENT MAGNETS SEALED WITH RESIN - A method of manufacturing a laminated core, having a laminated core body | 04-24-2014 |
20140124980 | METHOD FOR MANUFACTURING LAMINATED CORE - A method for manufacturing a laminated core, in which while a laminated core body | 05-08-2014 |
20140196276 | METHOD OF MANUFACTURING LAMINATED ROTOR CORE - There is provided a method of manufacturing a laminated rotor core, including: a mounting step of placing a core body on a carrier tray, the core body having a plurality of magnet insertion holes provided around the shaft hole, the carrier tray having a mount plate and a columnar guide member standing on a front surface of the mount plate | 07-17-2014 |
Patent application number | Description | Published |
20100213785 | LAMINATED CORE AND METHOD FOR MANUFACTURING THE SAME - A laminated core ( | 08-26-2010 |
20120058313 | METHOD FOR MANUFACTURING LAMINATED CORE AND LAMINATED CORE - A method for manufacturing a laminated core is provided that makes positions of boundary parts of laminated blocks and improves an efficiency of a welding operation of the blocks. The above-described object is achieved by the method of manufacturing the laminated core | 03-08-2012 |
20120091846 | ROTOR CORE - There is provided a rotor core which increases the quality and reliability thereof by preventing the occurrence of a core separation of the rotor core. There is provided a rotor core including a plurality of substantially cylindrical core blocks which are stacked on each other; and a plurality of magnets, characterized in that a plurality of magnet holes extending in an axial direction are provided in the plurality of core blocks so as to extend over the plurality of core blocks in that the plurality of magnets are accommodated in each of the plurality of magnet accommodation holes and fixed therein with a resin, and in that an axial position of core block boundary planes where the plurality of core blocks are brought into abutment with each other and an axial position of magnet boundary planes where the plurality of magnets are brought into abutment with each other differ from each other. | 04-19-2012 |
20130127282 | METHOD OF RESIN SEALING PERMANENT MAGNET AND LAMINATED CORE MANUFACTURED BY THE METHOD - A method of resin sealing a permanent magnet in a magnet insertion portion of a laminated body, the body formed by laminating plural core sheets and including the plural portions formed around a shaft hole in a center thereof, the portion connected to an internal space via an opening. The method includes a first process of positioning a blocking member blocking the opening from a side of the space in a way that the member is vertically-placed in a lower die or an upper die, while the both dies hold the body from both sides in an axial direction and close the portion; and a second process of filling a resin extruded from a resin reservoir portion provided in the die or the die into the portion having the magnet inserted therein and having the opening closed by the member. | 05-23-2013 |
20130234363 | METHOD OF MANUFACTURING LAMINATED CORE - In a method of manufacturing a laminated core, a laminated core body | 09-12-2013 |
20130249346 | LAMINATED IRON CORE AND METHOD FOR MANUFACTURING SAME - A laminated iron core and a method for manufacturing the same are provided to secure the lamination strength of the respective iron core pieces thereof, and to provide good magnetic efficiency and to reduce a loss. In a laminated iron core including a first caulking section formed in an area thereof having larger magnetic flux density than other area and a second caulking section formed in the other area, the engagement area A of the recessed sub-sections and projecting sub-sections of the first caulking sections of divided iron core pieces adjoining each other in the laminating direction is set smaller than the engagement area B of the recessed sub-sections and projecting sub-sections of the second caulking sections adjoining each other in the laminating direction. | 09-26-2013 |
Patent application number | Description | Published |
20090012233 | Epoxy Resin Molding Material for Sealing and Electronic Component Device - The present invention relates to an epoxy resin molding material for sealing, comprising an epoxy resin (A), a curing agent (B) and an acrylic compound (C), wherein the acrylic compound (C) is an acrylic compound obtained by polymerizing compounds represented respectively by the following general formulae (I) and (II) in a (I)/(II) mass ratio of from 0 to 10. The present invention provides an epoxy resin molding material for sealing, which is excellent in fluidity and reflow soldering resistance without reducing curability, as well as an electronic component device comprising an element sealed therewith. | 01-08-2009 |
20090247670 | Epoxy Resin Molding Material for Sealing, and Electronic Component Device - The invention relates to an epoxy resin molding material for sealing, comprising an epoxy resin (A), a curing agent (B), and a colorant resin mixture (C) wherein a resin (C1) and a colorant (D) having an electric resistivity of 1×10 | 10-01-2009 |
20090326100 | EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT DEVICE - The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound. | 12-31-2009 |
20100003771 | PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM - To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product | 01-07-2010 |
20100140638 | THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, METHOD FOR MANUFACTURING THE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION - This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device. | 06-10-2010 |
20110121447 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 05-26-2011 |
20110127667 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 06-02-2011 |
20110133346 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 06-09-2011 |
Patent application number | Description | Published |
20100013078 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 01-21-2010 |
20110241228 | EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF - An epoxy resin composition for a underfilling of a semiconductor comprising an epoxy resin, an acid anhydride, a curing accelerator and a flux agent as essential components, wherein the curing accelerator is a quaternary phosphonium salt, as well as a semiconductor device and manufacturing method employing the same. | 10-06-2011 |
20120101191 | THERMOSETTING RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE - A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm. | 04-26-2012 |
20150014842 | SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR - A manufacturing method for a semiconductor device in which connection portions of a semiconductor chip are electrically connected to connection portions of a wiring circuit substrate or a semiconductor device in which connection portions of a plurality of semiconductor chips are electrically connected to each other, the method comprising a step of encapsulating at least part of the connection portions with an adhesive for a semiconductor containing a compound having a group represented by the following formula (1-1) or (1-2): | 01-15-2015 |
20150035175 | ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - An adhesive for a semiconductor, containing an epoxy resin, a curing agent, and a fluxing agent comprising a compound having a group represented by the following formula (1-1) or (1-2): | 02-05-2015 |
20150048495 | ADHESIVE FOR SEMICONDUCTOR, FLUXING AGENT, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - An adhesive for a semiconductor, comprising an epoxy resin, a curing agent, and a compound having a group represented by the following formula (1): | 02-19-2015 |
Patent application number | Description | Published |
20090314533 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 12-24-2009 |
20110247867 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 10-13-2011 |
20110247873 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 10-13-2011 |
20110247874 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 10-13-2011 |