Patent application number | Description | Published |
20080218840 | Methods for etching layers within a MEMS device to achieve a tapered edge - Certain MEMS devices include layers patterned to have tapered edges. One method for forming layers having tapered edges includes the use of an etch leading layer. Another method for forming layers having tapered edges includes the deposition of a layer in which the upper portion is etchable at a faster rate than the lower portion. Another method for forming layers having tapered edges includes the use of multiple iterative etches. Another method for forming layers having tapered edges includes the use of a liftoff mask layer having an aperture including a negative angle, such that a layer can be deposited over the liftoff mask layer and the mask layer removed, leaving a structure having tapered edges. | 09-11-2008 |
20080218843 | MICROELECTROMECHANICAL DEVICE AND METHOD UTILIZING A POROUS SURFACE - A microelectromechanical device (MEMS) utilizing a porous electrode surface for reducing stiction is disclosed. In one embodiment, a microelectromechanical device is an interferometric modulator that includes a transparent electrode having a first surface; and a movable reflective electrode with a second surface facing the first surface. The movable reflective electrode is movable between a relaxed and actuated (collapsed) position. An aluminum layer is provided on either the first or second surface. The aluminum layer is then anodized to provide an aluminum oxide layer which has a porous surface. The porous surface, in the actuated position, decreases contact area between the electrodes, thus reducing stiction. | 09-11-2008 |
20080226929 | SILICON-RICH SILICON NITRIDES AS ETCH STOP IN MEMS MANUFACTURE - The fabrication of a MEMS device such as an interferometric modulator is improved by employing an etch stop layer between a sacrificial layer and a an electrode. The etch stop may reduce undesirable over-etching of the sacrificial layer and the electrode. The etch stop layer may also serve as a barrier layer, buffer layer, and/or template layer. The etch stop layer may include silicon-rich silicon nitride. | 09-18-2008 |
20080278787 | MICROELECTROMECHANICAL SYSTEM HAVING A DIELECTRIC MOVABLE MEMBRANE AND A MIRROR - A microelectromechanical (MEMS) device includes at least one electrode, a first reflective layer, and a movable functional element. The movable functional element includes a flexible dielectric layer and a reflective element. The flexible dielectric layer flexes in response to voltages applied to the at least one electrode to move the functional element in a direction generally perpendicular to the first reflective layer. The reflective element has a first portion mechanically coupled to the flexible dielectric layer and a second portion spaced from the flexible dielectric layer and defining a gap therebetween. | 11-13-2008 |
20080278788 | MICROELECTROMECHANICAL SYSTEM HAVING A DIELECTRIC MOVABLE MEMBRANE AND A MIRROR - A microelectromechanical (MEMS) device includes at least one electrode, a first reflective layer, and a movable reflective element. The movable reflective element includes a flexible dielectric layer and a second reflective layer mechanically coupled to the flexible dielectric layer. The flexible dielectric layer flexes in response to voltages applied to the at least one electrode to move the reflective element in a direction generally perpendicular to the first reflective layer. | 11-13-2008 |
20090009847 | INTEGRATED IMODS AND SOLAR CELLS ON A SUBSTRATE - Embodiments of the present invention relate to interferometric display devices comprising an interferometric modulator and a solar cell and methods of making thereof. In some embodiments, the solar cell is configured to provide energy to the interferometric modulator. The solar cell and the interferometric modulator may be formed above the same substrate. A layer of the solar cell may be shared with a layer of the interferometric modulator. | 01-08-2009 |
20090040590 | MEMS DEVICE AND INTERCONNECTS FOR SAME - A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. A layer of the electrical interconnect is formed directly under, over, or between a partially reflective layer and a transparent layer of the device. The layer of the electrical interconnect preferably comprises nickel. | 02-12-2009 |
20090071932 | ETCHING PROCESSES USED IN MEMS PRODUCTION - The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process. | 03-19-2009 |
20090071933 | ETCHING PROCESSES USED IN MEMS PRODUCTION - The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process. | 03-19-2009 |
20090074646 | ETCHING PROCESSES USED IN MEMS PRODUCTION - The efficiency of an etching process may be increased in various ways, and the cost of an etching process may be decreased. Unused etchant may be isolated and recirculated during the etching process. Etching byproducts may be collected and removed from the etching system during the etching process. Components of the etchant may be isolated and used to general additional etchant. Either or both of the etchant or the layers being etched may also be optimized for a particular etching process. | 03-19-2009 |
20090273824 | ELECTROMECHANICAL SYSTEM HAVING A DIELECTRIC MOVABLE MEMBRANE - An electromechanical device includes a partially reflective and partially transmissive layer and a movable functional element. The movable functional element includes a patterned flexible dielectric layer and a reflective layer mechanically coupled to the flexible dielectric layer. The patterned flexible dielectric layer is configured to flex in response to voltages applied to the partially reflective and partially transmissive layer to move the functional element in a direction generally perpendicular to the partially reflective and partially transmissive layer. The reflective layer is situated between the flexible dielectric layer and the partially reflective and partially transmissive layer. | 11-05-2009 |
20090308452 | INTEGRATED IMODS AND SOLAR CELLS ON A SUBSTRATE - Embodiments of the present invention relate to interferometric display devices comprising an interferometric modulator and a solar cell and methods of making thereof. In some embodiments, the solar cell is configured to provide energy to the interferometric modulator. The solar cell and the interferometric modulator may be formed above the same substrate. A layer of the solar cell may be shared with a layer of the interferometric modulator. | 12-17-2009 |
20100019336 | MEMS DEVICES HAVING OVERLYING SUPPORT STRUCTURES AND METHODS OF FABRICATING THE SAME - Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference. | 01-28-2010 |
20100147790 | SUPPORT STRUCTURE FOR MEMS DEVICE AND METHODS THEREFOR - A microelectromechanical systems device having support structures formed of sacrificial material surrounded by a protective material. The microelectromechanical systems device includes a substrate having an electrode formed thereon. Another electrode is separated from the first electrode by a cavity and forms a movable layer, which is supported by support structures formed of a sacrificial material. | 06-17-2010 |
20100149627 | SUPPORT STRUCTURE FOR MEMS DEVICE AND METHODS THEREFOR - A microelectromechanical systems device having support structures formed of sacrificial material surrounded by a protective material. The microelectromechanical systems device includes a substrate having an electrode formed thereon. Another electrode is separated from the first electrode by a cavity and forms a movable layer, which is supported by support structures formed of a sacrificial material. | 06-17-2010 |
20100271688 | METHOD OF CREATING MEMS DEVICE CAVITIES BY A NON-ETCHING PROCESS - MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer. | 10-28-2010 |
20110115762 | MEMS DEVICES HAVING OVERLYING SUPPORT STRUCTURES AND METHODS OF FABRICATING THE SAME - Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference. | 05-19-2011 |
20110134505 | ELECTROMECHANICAL SYSTEM HAVING A DIELECTRIC MOVABLE MEMBRANE - An electromechanical device includes a partially reflective and partially transmissive layer and a movable functional element. The movable functional element includes a patterned flexible dielectric layer and a reflective layer mechanically coupled to the flexible dielectric layer. The patterned flexible dielectric layer is configured to flex in response to voltages applied to the partially reflective and partially transmissive layer to move the functional element in a direction generally perpendicular to the partially reflective and partially transmissive layer. The reflective layer is situated between the flexible dielectric layer and the partially reflective and partially transmissive layer. | 06-09-2011 |
20110205197 | ELECTROMECHANICAL DEVICES HAVING SUPPORT STRUCTURES AND METHODS OF FABRICATING THE SAME - Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device. | 08-25-2011 |
20110235155 | MECHANICAL LAYER AND METHODS OF SHAPING THE SAME - A method of shaping a mechanical layer is disclosed. In one embodiment, the method comprises depositing a support layer, a sacrificial layer and a mechanical layer over a substrate, and forming a support post from the support layer. A kink is formed adjacent to the support post in the mechanical layer. The kink comprises a rising edge and a falling edge, and the kink can be configured to control the shaping and curvature of the mechanical layer upon removal of the sacrificial layer. | 09-29-2011 |
20120099178 | ELECTROMECHANICAL SYSTEM HAVING A DIELECTRIC MOVABLE MEMBRANE - An electromechanical device includes a partially reflective and partially transmissive layer and a movable functional element. The movable functional element includes a patterned flexible dielectric layer and a reflective layer mechanically coupled to the flexible dielectric layer. The patterned flexible dielectric layer is configured to flex in response to voltages applied to the partially reflective and partially transmissive layer to move the functional element in a direction generally perpendicular to the partially reflective and partially transmissive layer. The reflective layer is situated between the flexible dielectric layer and the partially reflective and partially transmissive layer. | 04-26-2012 |
20120105385 | ELECTROMECHANICAL SYSTEMS APPARATUSES AND METHODS FOR PROVIDING ROUGH SURFACES - This disclosure provides systems, methods, and apparatus for producing roughness in an electromechanical device by nucleation under plasma CVD conditions. In one aspect, a substrate and at least a first layer are provided. The disclosure further provides gas phase nucleating particles under plasma CVD conditions and depositing a first layer, where the particles are incorporated into the first layer to create roughness in the first layer. The roughness may be transferred to a second layer by conformal deposition of the second layer over the first layer. The roughness of the second layer corresponds to the roughness of the first layer, where the first layer has a roughness greater than or equal to about 20 Å root mean square (RMS). | 05-03-2012 |
20120120081 | ILLUMINATION DEVICE WITH PASSIVATION LAYER - This disclosure provides systems, methods and apparatus for providing illumination by using a light guide to distribute light. In one aspect, a passivation layer is attached to the light guide of an illumination device. The passivation layer may be an optically transparent moisture barrier and may have a thickness and refractive index which allows it to function as an anti-reflective coating. The passivation layer may protect moisture-sensitive underlying features, such as metallized light turning features that may be present in the light guide. The light turning features may be configured to redirect light out of the light guide. In some implementations, the redirected light may be applied to illuminate a display. | 05-17-2012 |
20120120682 | ILLUMINATION DEVICE WITH LIGHT GUIDE COATING - This disclosure provides systems, methods and apparatus for providing illumination by using a light guide to distribute light. In one aspect, the light guide includes a light turning film over an optically transmissive supporting layer. The light turning film may be formed of a material deposited in the liquid state. The light turning film may be formed of a photodefinable material, which may be glass, such a spin-on glass, or may be a polymer. In some other implementations, the glass is not photodefinable. The light turning film may have indentations that define light turning features and a protective layer may be formed over those indentations. The protective layer may also be formed of a glass material, such as spin-on glass. The light turning features in the light guide film may be configured to redirect light out of the light guide, for example, to illuminate a display. | 05-17-2012 |
20120154690 | FLEXIBLE INTEGRATED CIRCUIT DEVICE LAYERS AND PROCESSES - This disclosure provides systems, processes, and apparatus implementing and using techniques for fabricating flexible integrated circuit (IC) device layers. In one implementation, a sacrificial layer is deposited on a substrate. The sacrificial layer can include amorphous silicon or molybdenum, by way of example. One or more electronic components are formed on the sacrificial layer. A polymer coating is provided on the one or more electronic components to define a coated device layer. The sacrificial layer is removed to release the coated device layer from the substrate. The sacrificial layer can be removed using a xenon difluoride gas or by etching, for example. Coated device layers made in accordance with this process can be stacked. The substrate can be formed of glass, silicon, a plastic, a ceramic, a compound semiconductor, and/or a metal, depending on the desired implementation. The electronic component(s) can include a passive component such as a resistor, an inductor, or a capacitor. The electronic component(s) can also or alternatively include an active component such as a transistor. | 06-21-2012 |
20120327092 | PLANARIZED SPACER FOR COVER PLATE OVER ELECTROMECHANICAL SYSTEMS DEVICE ARRAY - This disclosure provides systems, methods and apparatus for a MEMS device. In one aspect, an electromechanical systems apparatus includes a substrate, a stationary electrode positioned over the substrate, a movable electrode spaced from the stationary electrode by a gap, and at least one support structure extending above the movable electrode. The support structure includes an inorganic dielectric layer and a polymer layer. | 12-27-2012 |
20130026136 | SPUTTER-ETCH TOOL AND LINERS - This disclosure provides systems, methods and apparatus for fabricating electromechanical system devices within a plasma-etch reaction chamber. In one aspect, a plasma-etch system includes a plasma-etch reaction chamber, an inlet in fluid communication with the reaction chamber, a cathode positioned within the reaction chamber and a non-hollow anode positioned within the reaction chamber between the inlet and the cathode. The inlet is configured to introduce a process gas into the reaction chamber such that at least a portion of the process gas strikes an upper surface of the anode and is allowed to flow across the upper surface and around the edges of the anode. The anode can be a liner plate in place of a showerhead. | 01-31-2013 |
20130100144 | ILLUMINATION DEVICE AND PROCESS FOR FORMING COATED RECESSED LIGHT GUIDE FEATURES - This disclosure provides systems, methods and apparatus for providing illumination by using light turning features in a light guide. In an aspect, an illumination system is provided with a light guide configured to support propagation of light along the length of the light guide. The light guide includes a light turning feature formed by an indentation in the light guide. A coating layer is disposed along surfaces of the indentation and the volume of the indentation over the coating is filled with a filler. The filler substantially fills the indentation to an upper surface of the light turning feature and is spaced apart from the light guide. The light guide is configured to provide total internal reflection of light at the upper surface of the light guide. Light from a light source can be injected into the light guide and then redirected by the turning features to illuminate a display. | 04-25-2013 |
20130127880 | DISPLAY DEVICE AND DUAL-SIDED PROCESS FOR FORMING LIGHT TURNING FEATURES AND DISPLAY ELEMENTS - This disclosure provides systems, methods and apparatus for providing illumination by using a light guide to distribute light. In an aspect, an illumination system is provided with a substrate having a first side and a second side opposite the first. The substrate can be optically transmissive and form part of the light guide for distributing light. The first side of the substrate is processed using a first processing technology. Processing the first side includes forming a light turning feature on the first side and forming a protective layer over the light turning feature. The second side is processed using a second processing technology to form display elements, while the protective layer protects the first side from damage. The first and second processing technologies can be performed using the same tool set. In addition to protecting the first side, the protective layer may function as an optical cladding and/or passivation layer. | 05-23-2013 |
20130129922 | BATCH PROCESSING FOR ELECTROMECHANICAL SYSTEMS AND EQUIPMENT FOR SAME - This disclosure provides systems, methods and apparatus for processing multiple substrates in a batch cluster tool. A batch cluster tool can include a transfer chamber, an etch process chamber, and one or both of an ALD process chamber and an SAM process chamber. Multiple substrates are transferred from a transfer chamber into an etch chamber. The substrates are exposed to a vapor phase etchant. The substrates can then transferred to an atomic layer deposition (ALD) chamber and exposed to vapor phase reactants to form a thin film on the substrates by ALD. The substrates can be transferred either from the etch process chamber or the ALD chamber to a third chamber and exposed to vapor phase reactants to form a self-assembled monolayer (SAM) on the substrates. | 05-23-2013 |
20130335312 | INTEGRATION OF THIN FILM SWITCHING DEVICE WITH ELECTROMECHANICAL SYSTEMS DEVICE - This disclosure provides systems and methods for thin film switching devices, such as thin film transistors and thin film diodes, which are integrated in a display apparatus. In one aspect, a thin film switching device is positioned on a rear side of an electromechanical systems (EMS) display element formed over a substrate and is in electrical communication with the EMS display element. In another aspect, the thin film switching device is positioned between the EMS display element and the substrate. A planar layer is disposed between the EMS display element and the thin film switching device, with the planar layer having a planar surface. | 12-19-2013 |
20130335808 | ANALOG IMOD HAVING HIGH FILL FACTOR - This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator (AIMOD) includes a reflective display pixel having a movable element disposed between first and second electrodes. The movable element includes a third electrode embedded within a deformable layer and a reflector. The movable element is moved to different positions between first and second electrodes, with different positions corresponding to different reflected colors from the AIMOD. In another aspect, the reflector is coupled to, but spaced apart from, the deformable layer, thereby decoupling the mechanical and optical properties of the movable element. In another aspect, the need for a bending region in the reflector is eliminated, providing for increased fill factor. In another aspect, the reflector may include a dielectric layer having substantially identical metal layers above and below, so as to provide increased rigidity to the reflector. | 12-19-2013 |
20130337171 | N2 PURGED O-RING FOR CHAMBER IN CHAMBER ALD SYSTEM - This disclosure provides systems, methods and apparatus for purge gas delivery in an atomic layer deposition (ALD) processing apparatus. The ALD processing apparatus can include a processing chamber including a lid and a chamber wall. One or more process gas lines for delivering process gases are coupled to one or more process gas delivery sources in the processing chamber. An o-ring can be positioned proximate an outer edge of the processing chamber to provide a seal with the chamber wall and the lid. The lid is configured to open for removal of the substrate and close to process the substrate. A purge line for delivering purge gas is coupled to one or more purge gas delivery line sources in the processing chamber, and the purge gas delivery line sources are disposed between the o-ring and the one or more process gas delivery sources. | 12-19-2013 |
20140029078 | DEVICES AND METHODS FOR PROTECTING ELECTROMECHANICAL DEVICE ARRAYS - This disclosure provides systems, methods and apparatus for protecting electromechanical systems (EMS) devices from mechanical interference. In one aspect, an array of EMS devices may include one or more regions in which an EMS device is replaced with a spacer structure, such that the overall height of the spacer structure is greater than the height of the surrounding EMS devices. In another aspect, resilient spacer structures can be formed overlying stable portions of an EMS device array. These resilient spacer structures may be formed from a cross-linked organic material. | 01-30-2014 |
20140174955 | HIGH FLOW XEF2 CANISTER - This disclosure provides systems, methods and apparatus for delivery of gas from solid phase sources. A solid phase gas source canister can include multiple separated volumes configured to contain multiple quantities of a solid phase gas source. Sublimated vapor can be independently produced by each quantity of the solid phase gas source. In some implementations, the solid phase gas source canisters are configured for simultaneous fill of the multiple volumes with a solid source gas phase powder. | 06-26-2014 |
20140175055 | ADJUSTABLE COIL FOR INDUCTIVELY COUPLED PLASMA - Systems, methods and apparatus for fabricating devices use an inductively-coupled plasma. An inductively coupled plasma system includes a reaction chamber including a reaction space and a coil chamber. The system includes a workpiece support within the reaction space. The system includes a first inductive coil section and a second inductive coil section, the first and second inductive coil sections being independently movable. At least one power source is coupled to the first and second inductive coil sections. The first and second inductive coil sections and the at least one power source are configured to induce an inductively coupled plasma (ICP) in the reaction space. An adjustment mechanism is configured to move the first inductive coil section relative to the second inductive coil section. | 06-26-2014 |
20140349469 | PROCESSING FOR ELECTROMECHANICAL SYSTEMS AND EQUIPMENT FOR SAME - This disclosure provides systems, methods and apparatus for processing multiple substrates in a processing tool. An apparatus for processing substrates can include a process chamber, a common reactant source, and a common exhaust pump. The process chamber can be configured to process multiple substrates. The process chamber can include a plurality of stacked individual subchambers. Each subchamber can be configured to process one substrate. The common reactant source can be configured to provide reactant to each of the subchambers in parallel. The common exhaust pump can be connected to each of the subchambers. | 11-27-2014 |