Patent application number | Description | Published |
20090122708 | Method and system for link layer scheduling for networked applications - A method and system is provided for link layer scheduling for networked applications in a coordinator-based communications system. A network-coordinating device receives a request from a networked application to establish a communications session. The request includes a set of session parameters. The network-coordinating device allocates a first transmission opportunity in response to the request. The network-coordinating device allocates successive transmission opportunities based on the set of session parameters without receiving successive requests. The set of session parameters comprises at least one of a predetermined flow control mechanism, a quality-of-service (QoS) requirement, a bandwidth requirement, and an application type. In one embodiment, the predetermined flow control mechanism is additive increase and multiplicative decrease (AIMD) of transmission control protocol (TCP). Using the novel link layer scheduling, the network-coordinating device is able to allocate and adjust successive transmission opportunities to match the upper-layer resource requirement and traffic pattern dynamically. | 05-14-2009 |
20110105175 | Method and System for Managing Transmitting Power of Communications Devices Equipped with a Plurality of Antennas - A communications system and method for managing transmitting power of communications devices equipped with multiple antennas. A first communications device enables a first antenna configuration in accordance with a first pre-determined rule. A second communications device activates a second antenna configuration in accordance with a second predetermined rule. First and second messages are exchanged between the first and second communications devices. The first message includes the power management profile of the first communications device and the second message includes information pertinent to a power management profile of the second communications device, and signal integrity information determined by the second communications device from the received first message. The first communications device enables a third antenna configuration in accordance with the first pre-determined rule and the second communications device activates a fourth antenna in accordance with the second pre-determined rule configuration after the first and second messages have been exchanged. | 05-05-2011 |
20130195029 | Method and System for Supporting Incompatible Channelization of a Wireless Communications System - A method of supporting incompatible channelization in a wireless communications system is provided. A coordinating device determines a first set of physical parameters of a first wireless channel. The first set of physical parameters includes a channel bandwidth, a central frequency, a transmit power limit, and a modulation and coding scheme. The coordinating device establishes communication with a first set of communications devices over the first wireless channel. The coordinating device then broadcasts a channel-adjustment message and determines a protection period. The channel-adjustment message comprises a set of instructions on how to adjust to a second set of physical parameters of a second wireless channel. A second set of communications devices adjust physical parameters based on the channel-adjustment message. Finally, the coordinating device communicates with the second set of communications devices over the second wireless channel during the protection period. | 08-01-2013 |
20150043407 | METHOD FOR SIGNALING PAYLOAD TYPE IN SIGNALING FIELD OF A FRAME - A method of overloading a signaling subfield for different MAC frame types is proposed to provide enhanced functionality for the wireless communications network. In one embodiment, a transmitter encodes and transmits a bit stream into a frame having one or more subfields including a signaling subfield in a physical layer header of the bit stream. The signaling subfield has a type indication field that specifies the information carried in the one or more subfields is MAC layer or PHY layer information. The signaling subfield also has a sub-type indication field that specifies a type of MAC or PHY information. A receiver that receives the bit stream and decodes information carried in the one or more subfields in accordance with the type indication field and the sub-type indication field. | 02-12-2015 |
20150050957 | METHOD AND SYSTEM FOR MANAGING TRANSMITTING POWER OF COMMUNICATIONS DEVICES EQUIPPED WITH A PLURALITY OF ANTENNAS - A method for managing transmitting power of communications devices equipped with multiple antennas. The method enables a first antenna configuration of the plurality of antennas in accordance with a first pre-determined rule. The method transmits a first message to a peer communications device, wherein the first message comprises at least a power management profile of the communications device transmitting the first message. The method receives a second message comprising at least information pertinent to a power management profile of the peer communications device receiving the first message and signal integrity information determined by the peer communications device from the received first message. Finally, the method activates a second antenna configuration of the plurality of antennas by using the signal integrity information in accordance with a second pre-determined rule. | 02-19-2015 |
20150181469 | METHODS FOR MANAGING RADIO RESOURCES BETWEEN MULTIPLE RADIO MODULES AND COMMUNICATIONS APPARATUS UTILIZING THE SAME - Communications apparatus includes first and second radio modules and an antenna array coupled to the first and the second radio modules and includes multiple antennas. When the first and the second radio modules operate at the same time, the first radio module negotiates with a first communications device an amount of antenna(s) to be used by a first message, so that the first radio module operates with the amount of the antenna(s) and second radio module operates with at least one of the remaining antenna(s). | 06-25-2015 |
20160105855 | METHOD AND SYSTEM FOR MANAGING TRANSMITTING POWER OF COMMUNICATIONS DEVICES EQUIPPED WITH A PLURALITY OF ANTENNAS - A method for managing transmitting power of communications devices equipped with multiple antennas. The method enables a first antenna configuration of the plurality of antennas in accordance with a first pre-determined rule. The method transmits a first message to a peer communications device, wherein the first message comprises at least a power management profile of the communications device transmitting the first message. The method receives a second message comprising at least information pertinent to a power management profile of the peer communications device receiving the first message and signal integrity information determined by the peer communications device from the received first message. Finally, the method activates a second antenna configuration of the plurality of antennas by using the signal integrity information in accordance with a second pre-determined rule. | 04-14-2016 |
Patent application number | Description | Published |
20100177724 | METHOD FOR EFFICIENT UTILIZATION OF RADIO RESOURCES IN WIRELESS COMMUNICATIONS SYSTEM - The invention provides a wireless communications system. In one embodiment, the wireless communications system comprises a coordinating communications device, a source communications device, and a sink communications device. The coordinating communications device transmits a predetermined bits sequence at the beginning of a radio frame at a rate of a first fixed interval. The source communications device receives frames of a streaming session, detects a duration and first starting time of a frame, and wherein forwards information about the duration and the first starting time of one or more of the frames to the coordinating communications device. The coordinating communications device then determines the duration of a second fixed interval and second starting time in accordance with a predetermined rule based on the information received from the source communications device. The coordinating communications device then transmits the predetermined bits sequence at the second starting time of a radio frame at a rate of the second fixed interval, and the source communications device forwards the frames to a sink communications device. | 07-15-2010 |
20100254466 | METHOD FOR BEAMFORMING TRAINING AND COMMUNICATIONS APPARATUSES UTILIZING THE SAME - A communication system includes a trainee communications device and one or more trainer communications devices. The trainee communications device announces a first period of time for beamforming training, switches a receiving antenna pattern to a sector and stays in the sector for a second period of time. The trainer communications devices transmit one or more predetermined bit sequences in the first period of time. The predetermined bit sequences are transmitted in at least one sector. Each of the predetermined bit sequences carries an identifier identifying the transmitting trainer communications device. The trainee communications device further estimates channel characteristics and computes receiving antenna weighting vectors of the trainer communications devices by using the received predetermined bit sequences, respectively, and the trainer communications devices obtain pertinent information including the estimated channel characteristics and receiving time of the predetermined bit sequences about beamforming training from the trainee communications device. | 10-07-2010 |
20130201861 | Methods for Determining a Loading of a Wireless Communications System and Communication Apparatuses Utilizing the Same - A method for determining a loading of a wideband communications channel in a wireless communications system includes: setting up a loading table for the wideband communications channel comprising a plurality of narrow band communications channels; obtaining channel characteristics of the plurality of narrow band communications channels; deciding on a number of data streams and a practical bandwidth of the wideband communications channel for a data transmission transaction and selecting one or more peer communications devices for receiving the data streams; completing the data transmission transaction with the one or more peer communications devices; updating the loading table with the information about the practical bandwidth of the wideband communications channel, the number of data streams and duration of the data transmission transaction; and computing the loading by using the information in the loading table in accordance with a pre-determined formula. | 08-08-2013 |
20140223529 | Method of Sharing Credential and Wireless Communication System thereof - A method of sharing credential in a wireless communication system comprising a first user equipment, a second communication device and a network, includes transmitting a temporal credential and a credential custody request, from the first communication device, to the network; transmitting first custody information, by the network, to the first communication device; transmitting a credential acquiring request and second custody information, by the second communication device, to the network; and determining whether to transmit the temporal credential to the second communication device according to the second custody information. | 08-07-2014 |
20140355530 | METHOD FOR PERFORMING SEAMLESS TRANSMISSION CONTROL WITH AID OF REQUEST CARRYING FRAGMENT ID, AND ASSOCIATED APPARATUS - A method for performing seamless transmission control for an electronic device and an associated apparatus are provided, where the method includes the steps of: sending a request frame carrying a fragment identification (ID) to trigger a responder in a wireless network system to initiate retransmission corresponding to the fragment ID, wherein the fragment ID indicates beginning of a remaining portion within a plurality of fragments of data being sent from the responder to the electronic device; and receiving at least one response frame sent from the responder, for utilizing the remaining portion within the plurality of fragments of the data, wherein the remaining portion within the plurality of fragments of the data is obtained from the at least one response frame. | 12-04-2014 |
20150098460 | Group Based Location Service in Wireless Local Area Networks - A method of group-based location service is proposed. A wireless station initiates a ranging process with a plurality of wireless communications devices in a wireless local area network. The station belongs to a group of wireless stations. The station exchanges measurement frames with the plurality of wireless communications devices during the ranging process. The station then computes a plurality of distances to each of the plurality of wireless communications devices and thereby determining an absolute location of the station. Finally, the station informs the absolute location to a group owner of the group of wireless stations. | 04-09-2015 |
20150099538 | Multiple Antenna AP Positioning in Wireless Local Area Networks - A method of indoor positioning using Fine Timing Measurement (FTM) protocol with multi-antenna access point (AP) is proposed. In a wireless local area network, an AP has multiple antennas that are strategically located in different physical locations. The AP is used to exchange FTM frames with a wireless station for timing measurement of the FTM frames via its multiple antennas independently. The timing measurement result (e.g., timestamps of transmitting and receiving FTM frames) is then used to determine an absolute location of the station. A simplified Indoor Location operation with simplified deployment is achieved. | 04-09-2015 |
20150139116 | SECTORIZED BEAM OPERATION FOR WIRELESS NETWORKS - A communication method for a wireless network is disclosed. The wireless network comprises a plurality of wireless devices. The method comprises transmitting one or multiple packets with an omni-beam by a first wireless device to a second wireless device in a packet exchange during an omni-beam duration to indicate a sectorized-beam duration, receiving the packet(s) by a third wireless device, transmitting/receiving data by the first wireless device using a sectorized beam in a packet exchange with the second wireless device during the sectorized beam duration, and detecting by the third wireless device the sectorized beam packet(s) from the first wireless device and packet(s) from the second wireless device, if no sectorized beam packet(s)from the first wireless device and packet(s) from the second wireless device is detected, the third wireless device starting to communicating with a fourth wireless device. | 05-21-2015 |
20150139212 | Snooping Sensor STA or Neighbor AP Ranging and Positioning in Wireless Local Area Networks - A method of a ranging and positioning with sensor STA/neighbor AP is proposed. An initiating wireless device establishes an FTM procedure with a responding wireless device in an indoor wireless local area network. The initiating device exchanges FTM frames with the responding device and thereby receiving a first set of timestamps from the responding device. The initiating device receives a second set of timestamps associated with the exchanged FTM frames from one or more listening devices. Finally, the initiating device determines location information from the first and the second set of timestamps. | 05-21-2015 |
20150181239 | Method and Apparatus for frame rate control in Transmitter of Wireless Communications System - A method for frame rate control in a transmitter of a wireless communications system is disclosed. The method comprises generating a frame and a first information corresponding to a first expiration time of the frame by a frame generating module; handling the frame according to the first expiration time by the driver module; and informing the frame generating module an adjusting information according to a first pre-determined rule by the driver module. | 06-25-2015 |
20150365952 | Basic Service Set Load Management - A method of managing BSS network loading is proposed. An access point (AP) transmits BSS session time and data limit element in beacon or probe response frame or a response frame to a service request frame. The AP determines the session time and data limit according to the network load and AP resourced. The AP adjusts the session time and data limit dynamically. An STA decides whether to join a specific BSS based on the BSS session time and the BSS session data limit. AP encourages or discourages the STA to join the BSS by increasing or reducing the session time and data limit. The per-AP loading will be distributed according to AP's capabilities. | 12-17-2015 |
Patent application number | Description | Published |
20130277829 | Method of Fabricating Three Dimensional Integrated Circuit - A method of fabricating a three dimensional integrated circuit comprises forming a redistribution layer on a first side of a packaging component, forming a holding chamber in the redistribution layer, attaching an integrated circuit die on the first side of the packaging component, wherein an interconnect bump of the integrated circuit die is inserted into the holding chamber, applying a reflow process to the integrated circuit die and the packaging component and forming an encapsulation layer on the packaging component. | 10-24-2013 |
20130313121 | Method of Forming Interconnects for Three Dimensional Integrated Circuit - A method of forming interconnects for three dimensional integrated circuits comprises attaching a metal layer on a first carrier, attaching a first side of a packaging component on the metal layer, wherein the packaging component comprises a plurality of through vias. The method further comprises filling the plurality of through vias with a metal material using an electrochemical plating process, wherein the metal layer functions as an electrode for the electrochemical plating process, attaching a second carrier on a second side of the packaging component, detaching the first carrier from the packaging component, forming a photoresist layer on the metal layer, patterning the photoresist layer and detaching exposed portions of the metal layer. | 11-28-2013 |
20140070348 | Methods and Apparatus for Sensor Module - Methods and apparatus for integrating a CMOS image sensor and an image signal processor (ISP) together using an interposer to form a system in package device module are disclosed. The device module may comprise an interposer with a substrate. An interposer contact is formed within the substrate. A sensor device may be bonded to a surface of the interposer, wherein a sensor contact is bonded to a first end of the interposer contact. An ISP may be connected to the interposer, by bonding an ISP contact in the ISP to a second end of the interposer contact. An underfill layer may fill a gap between the interposer and the ISP. A printed circuit board (PCB) may further be connected to the interposer by way of a solder ball connected to another interposer contact. A thermal interface material may be in contact with the ISP and the PCB. | 03-13-2014 |
20140231991 | Method of Fabricating Three Dimensional Integrated Circuit - A method of fabricating a three dimensional integrated circuit comprises forming a redistribution layer on a first side of a packaging component, forming a holding chamber in the redistribution layer, attaching an integrated circuit die on the first side of the packaging component, wherein an interconnect bump of the integrated circuit die is inserted into the holding chamber, applying a reflow process to the integrated circuit die and the packaging component and forming an encapsulation layer on the packaging component. | 08-21-2014 |
20150036970 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING - A semiconductor device includes a first chip, a dielectric layer over the first chip, and a second chip over the dielectric layer. A conductive layer is embedded in the dielectric layer and is electrically coupled to the first chip and the second chip. The second chip includes an optical component. The first chip and the second chip are arranged on opposite sides of the dielectric layer in a thickness direction of the dielectric layer. | 02-05-2015 |
20150061126 | MANUFACTURE INCLUDING SUBSTRATE AND PACKAGE STRUCTURE OF OPTICAL CHIP - A manufacture includes a package structure, a first substrate, and a conductive member of a same material. The package structure includes a chip comprising a conductive pad, a conductive structure over the chip, and a passivation layer over the conductive structure. The passivation layer has an opening defined therein, and the opening exposes a portion of a planar portion of the conductive structure. The first substrate includes a first surface defining a first reference plane and a second surface defining a second reference plane. The conductive member extends across the first reference plane and the second reference plane and into the opening. The conductive member is electrically coupled to the exposed portion of the planar portion. | 03-05-2015 |
20150061137 | PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRCUITS - A package for holding a plurality of heterogeneous integrated circuits includes a first chip having a first conductive pad and a first substrate including a first semiconductor, and a second chip having a second conductive pad and a second substrate including a second semiconductor. The second semiconductor is different from the first semiconductor. The package also includes a molding structure in which the first chip and the second chip are embedded, a conductive structure over the first chip and conductively coupled to the first conductive pad and over the second chip and conductively coupled to the second conductive pad, and a passivation layer over the conductive structure. The passivation layer comprises an opening defined therein which exposes a portion of the second chip. | 03-05-2015 |
20150104909 | APPARATUS AND METHOD FOR SELF-ALIGNING CHIP PLACEMENT AND LEVELING - An approach is provided for aligning and leveling a chip package portion. The approach involves filling, at least partially, a reservoir formed between a first sidewall portion having a first slanted surface and a second sidewall portion having a second slanted surface with a fluid. The approach also involves placing a chip package portion into the reservoir. The approach further involves draining the fluid from the reservoir to cause the chip package portion to align with respect to a center of the reservoir. The chip package portion aligns with respect to the center of the reservoir and levels based on a relationship between the chip package portion, an angle of the first slanted surface, an angle of the second slanted surface, and the fluid. The chip package portion is secured in the aligned and leveled state by a molding compound. | 04-16-2015 |
20150108667 | APPARATUS AND METHOD FOR CHIP PLACEMENT AND MOLDING - An approach is provided for placing and securing a chip package portion in an aligned position during a curing process. The approach involves providing an apparatus having a first reservoir configured to receive a first chip package, a second reservoir, and a third reservoir. The approach also involves placing the first chip package portion into the first reservoir, the second chip package portion into the second reservoir, and the third chip package portion into the third reservoir. The approach further involves causing the first chip package portion to be secured in a first curing position, the second chip package portion to be secured in a second curing position and the third chip package portion to be secured in a third curing position. | 04-23-2015 |
20150115464 | Chip on Package Structure and Method - A system and method for packaging semiconductor device is provided. An embodiment comprises forming vias over a carrier wafer and attaching a first die over the carrier wafer and between a first two of the vias. A second die is attached over the carrier wafer and between a second two of the vias. The first die and the second die are encapsulated to form a first package, and at least one third die is connected to the first die or the second die. A second package is connected to the first package over the at least one third die. | 04-30-2015 |
20150130045 | THERMALLY CONDUCTIVE STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES - A method of forming a semiconductor package includes providing a substrate, wherein the substrate has at least one chip attached on an upper surface of the substrate. An insulating barrier layer is deposited above the substrate, wherein the at least one chip is at least partially embedded within the insulating barrier layer. A thermally conductive layer is formed over the insulating barrier layer to at least partially encapsulate the at least one chip. | 05-14-2015 |
20150130047 | THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES - A method of forming a semiconductor package includes forming a thermal conductivity layer and attaching the thermal conductivity layer to a chip. The chip has a first surface and a second surface. The thermal conductivity layer is attached to the first surface of the chip. The thermal conductivity layer provides a path through which heat generated from the chip is dissipated to the ambient. A substrate is attached to the second surface of the chip. A molding compound is formed above the substrate to encapsulate the chip and the thermal conductivity layer. | 05-14-2015 |
20150131938 | LIGHT COUPLING FORMATION IN A WAVEGUIDE LAYER - An approach is provided for forming a light coupling in a waveguide layer. The approach involves forming a waveguide layer overlaying an upper surface of a substrate. The approach also involves placing a chip package portion within the waveguide layer in a selected position. The approach further involves forming a molding compound layer overlaying the waveguide layer and the chip package portion. The approach additionally involves curing the molding compound layer to form a cured package. The approach also involves releasing the cured package from the substrate and inverting the cured package. The approach further involves forming a ridge waveguide structure in the waveguide layer by removing a portion of the lower surface of the cured package. | 05-14-2015 |
20150131939 | APPARATUS AND METHOD OF FORMING CHIP PACKAGE WITH WAVEGUIDE FOR LIGHT COUPLING - An apparatus and method of forming a chip package with a waveguide for light coupling is disclosed. The method includes depositing an adhesive layer over a carrier. The method further includes depositing a laser diode (LD) die having a laser emitting area onto the adhesive layer and depositing a molding layer over the LD die and the adhesive layer. The method still further includes curing the molding layer and partially removing the molding layer to expose the laser emitting area. The method also includes depositing a ridge waveguide structure adjacent to the laser emitting area and depositing an upper cladding layer over the ridge waveguide structure. | 05-14-2015 |
20150132008 | VIA-LESS MULTI-LAYER INTEGRATED CIRCUIT WITH INTER-LAYER INTERCONNECTION - A multi-layer integrated circuit comprises a light source configured to input source light to a first optical transmitter. The first optical transmitter is configured to modify the source light and to output a first modulated light based on data received from a first circuit to a second optical receiver. The first modulated light indicates a first data set, the second optical receiver is configured to receive the first modulated light and communicate the first data set to a second circuit. | 05-14-2015 |
20150146268 | OPTICAL SCANNER INTEGRATED WITH SUBSTRATE METHOD OF MAKING AND METHOD OF USING THE SAME - An optical scanner includes a substrate, and a tunable laser on the substrate, wherein the tunable laser is configured to emit light, and to sweep a wavelength of the emitted light through a waveband. The optical scanner further includes a grating over a top surface of the substrate, the grating configured to diffract light emitted from the tunable laser, and an angled reflective surface configured to reflect the diffracted light from the grating. The optical scanner further includes a refractive element configured to receive the reflected light from the angled reflective surface. The refractive element is configured to focus the reflected light in a first direction and to diverge the reflected light in a second direction perpendicular to the first direction. | 05-28-2015 |
20150147852 | VACUUM CARRIER MODULE, METHOD OF USING AND PROCESS OF MAKING THE SAME - A vacuum carrier module includes a substrate having at least one hole and an edge region. There is at least one support on a top surface of the substrate. Further, a gel film is adhered to the edge region of the substrate. The at least one hole fluidly connects a reservoir located above the top surface of the substrate. A method of using a vacuum carrier module includes planarizing a gel film by passing an alignment material through a hole in a substrate to contact a first surface of the gel film, positioning at least one chip on a second surface of the gel film opposite the first surface. The method further includes encasing the at least one chip in a molding material and applying a vacuum to the first surface of the gel film. | 05-28-2015 |
20150155260 | Temporary Bonding Scheme - A method includes filling a trench formed in a first integrated circuit carrier with temporary bonding material to form a temporary bonding layer. At least one chip is bonded over the temporary bonding layer. | 06-04-2015 |
20150187743 | WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF FORMING SAME - An embodiment is a package including a first package component. The first package component including a first die attached to a first side of a first interconnect structure, a molding material surrounding the first die, and a second interconnect structure over the molding material and the first die, a first side of the second interconnect structure coupled to the first die with first electrical connectors. The first package component further includes a plurality of through molding vias (TMVs) extending through the molding material, the plurality of TMVs coupling the first interconnect structure to the second interconnect structure, and a second die attached to a second side of the second interconnect structure with second electrical connectors, the second side of the second interconnect structure being opposite the first side of the second interconnect structure. | 07-02-2015 |
20150206865 | Integrated Circuit Package and Methods of Forming Same - An embodiment package-on-package (PoP) device includes a package structure, a package substrate, and a plurality of connectors bonding the package structure to the package substrate. The package structure includes a logic chip bonded to a memory chip, a molding compound encircling the memory chip, and a plurality of conductive studs extending through the molding compound. The plurality of conductive studs is attached to contact pads on the logic chip. | 07-23-2015 |
20150206866 | Semiconductor Package and Methods of Forming Same - An embodiment package-on-package (PoP) device includes a fan-out structure, one or more memory chips, and a plurality of connectors bonding the one or more memory chips to the fan-out structure. The fan-out structure includes a logic chip, a molding compound encircling the logic chip, and a plurality of conductive pillars extending through the molding compound. | 07-23-2015 |
20150235949 | Functional Block Stacked 3DIC and Method of Making Same - An embodiment device package includes a fan-out redistribution layer (RDL), a device over and bonded to the fan-out RDL, and a molding compound over the fan-out RDL and extending along sidewalls of the device. The device includes a first functional tier having a first metallization layer and a second functional tier having a second metallization layer. The second functional tier is bonded to the first functional tier. The device further includes an interconnect structure electrically connecting the first metallization layer to the second metallization layer. The interconnect structure includes an inter-tier via (ITV) at least partially disposed in both the first functional tier and the second functional tier, and the ITV contacts the first metallization layer. | 08-20-2015 |
20150287705 | APPARATUS AND PACKAGE STRUCTURE OF OPTICAL CHIP - An apparatus includes a package structure. The package structure includes a chip, a conductive structure over the chip, a molding structure surrounding and underneath the chip, and a first passivation layer over the conductive structure. The chip includes an optical component and a chip conductive pad. The conductive structure is electrically coupled to the chip conductive pad. The conductive structure has a planar portion substantially in parallel with an upper surface of the chip. The first passivation layer has a first opening defined therein. The first opening exposes a portion of the planar portion. The package structure is configured to receive an electrical coupling through the first opening in the first passivation layer. | 10-08-2015 |
20150303174 | Fan-Out Stacked System in Package (SIP) and the Methods of Making the Same - An embodiment package includes a first fan-out tier having a first device die, a molding compound extending along sidewalls of the first device die, and a through intervia (TIV) extending through the molding compound. One or more first fan-out redistribution layers (RDLs) are disposed over the first fan-out tier and bonded to the first device die. A second fan-out tier having a second device die is disposed over the one or more first fan-out RDLs. The one or more first fan-out RDLs electrically connects the first and second device dies. The TIV electrically connects the one or more first fan-out RDLs to one or more second fan-out RDLs. The package further includes a plurality of external connectors at least partially disposed in the one or more second fan-out RDLs. The plurality of external connectors are further disposed on conductive features in the one or more second fan-out RDLs. | 10-22-2015 |
20150318239 | APPARATUS AND METHOD FOR CHIP PLACEMENT AND MOLDING - An apparatus includes a base portion having an upper surface and a lower surface opposite the upper surface. The apparatus also includes a first sidewall portion having a first upper portion distal the upper surface of the base portion and a first slanted sidewall between the first upper portion and the upper surface of the base portion. The apparatus further includes a second sidewall portion having a second upper portion distal the upper surface of the base portion and a second slanted sidewall between the second upper portion and the upper surface of the base portion. The first sidewall portion and the second sidewall portion define a first reservoir between the first slanted sidewall and the second slanted sidewall, the first reservoir being configured to receive a first chip package portion and to secure the first chip package portion in a first curing position. | 11-05-2015 |
20160049385 | PACKAGES AND METHODS OF MANUFACTURE THEREOF - Packages and methods of manufacture thereof are described. In an embodiment, a package may include a first chip package and a die structure disposed over the first chip package. In an embodiment, the first chip package may include: a molding compound; a first die within the molding compound; a first via structure and a second via structure within the molding compound at opposite lateral portions of the first die, wherein the first and second via structures extend between an active surface of the first die and a first surface of the molding compound; and a second die within the molding compound, the second die disposed at the active surface of the first die and between the first via structure and the second via structure. | 02-18-2016 |
20160056086 | Temporary Bonding Scheme - A method includes filling a trench formed in a first integrated circuit carrier with temporary bonding material to form a temporary bonding layer. At least one chip is bonded over the temporary bonding layer. | 02-25-2016 |