Hou, Hsinchu
Chun-Lin Hou, Hsinchu TW
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20090237048 | Power management circuit and method of frequency compensation thereof - A power management circuit includes a regulator circuit, a first frequency compensation circuit, a first switch circuit and a detection circuit. The regulator circuit includes a signal output end. The first switch circuit is turned on in response to an enabled first control signal such that the first frequency compensation circuit is coupled to the regulator circuit. The detection circuit determines whether an output capacitor is coupled to the signal output end, and generates the enabled first control signal to turn on the first switch circuit and connect the first frequency compensation circuit to the regulator circuit when the output capacitor is not coupled to the signal output end. Therefore, the regulator circuit is frequency compensated by the first frequency compensation circuit. | 09-24-2009 |
Fu-Ju Hou, Hsinchu TW
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20140027823 | METHOD FOR FORMING THIN METAL COMPOUND FILM AND SEMICONDUCTOR STRUCTURE WITH THIN METAL COMPOUND FILM - A method for forming a metal compound film includes: providing a substrate structure; forming a first metal layer on the substrate structure; performing a first microwave annealing process to conduct a reaction between the first metal layer and the substrate structure so as to form a first polycrystalline film of a metal compound; and performing a second microwave annealing process to transform the first polycrystalline film into a second polycrystalline film of the metal compound with an enlarged grain size, wherein a microwave power output used in the second microwave annealing process is higher than that used in the first microwave annealing process. | 01-30-2014 |
20140094023 | FABRICATING METHOD OF SEMICONDUCTOR CHIP - A fabricating method of a semiconductor chip includes the following steps. Firstly, a substrate is provided, wherein an amorphous semiconductor layer is formed in a first surface of the substrate. Then, a first metal layer is formed on the amorphous semiconductor layer. Then, a thermal-treating process is performed to result in a chemical reaction between the first metal layer and a part of the amorphous semiconductor layer, thereby producing an amorphous metal semiconductor compound layer. Afterwards, a microwave annealing process is performed to recrystallize the amorphous metal semiconductor compound layer as a polycrystalline metal semiconductor compound layer. | 04-03-2014 |
Hao-Cheng Hou, Hsinchu TW
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20100159280 | PERPENDICULAR MAGNETIC RECORDING MEDIUM - A perpendicular magnetic recording medium includes a substrate, an antiferromagnetic layer disposed above the substrate, and a perpendicular magnetic recording layer formed on the antiferromagnetic layer and exchange-coupled to the antiferromagnetic layer. | 06-24-2010 |
Hou Lung Hou, Hsinchu TW
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20080211983 | Pixel Control Device and Display Apparatus Utilizing Said Pixel Control Device - A pixel control device and a display apparatus utilizing said pixel control device are provided. The pixel control device is electrically connected to a sub-pixel area to provide a first voltage level, a second voltage level, and a third voltage level to the sub-pixel area, so that liquid crystals can be disposed in various angles. A scan line of the pixel control device controls a first transistor, a second transistor, and a third transistor to be switched on. The first and second data lines thereof provide a first and a second data-referenced voltage levels, respectively, to determine the first, the second, and the third voltage levels. | 09-04-2008 |
Kai-Lun Hou, Hsinchu TW
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20100079732 | Lamp and Optical Projector - A lamp includes a lampwick, a reflector, and a shade. The reflector has an opening and a bottom portion opposite to the opening. The lampwick is disposed at the bottom portion and passes through the bottom portion and at least one part of the lampwick is disposed in the reflector. The shade disposed outside the reflector covers a part of the reflector. The shade connected to the bottom portion has an inlet and an outlet. The inlet and the outlet are disposed at two opposite sides of the reflector respectively. An air flow flows into the space between the reflector and the shade through the inlet. At least one part of the air flow flows through the outlet along a flowing direction. An included angle defined between the flowing direction and a transmitting direction of an illumination light beam formed by the reflector is an acute angle. | 04-01-2010 |
20100271600 | ILLUMINANCE DEVICE AND PROJECTION SYSTEM - An illuminance device including a gas discharge lamp, an airflow generator, and a distributing duct is provided. The lamp has a reflector, a base connected to the reflector, a burner installed in the reflector, and the base, a first opening located at the reflector and a front part of the lamp, and a second opening located at a rear part of the lamp and exposing the burner. The distributing duct has an inlet, a first outlet, and a second outlet, and an opening area of the first outlet is larger than that of the second outlet. A cooling airflow provided by the airflow generator enters the distributing duct via the inlet, the distributing duct guides a part of the cooling airflow to the first opening via the first outlet, and the distributing duct guides another part of the cooling airflow to the second opening via the second outlet. | 10-28-2010 |
Kuan-Chou Hou, Hsinchu TW
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20130032719 | ELECTRICAL CALIBRATED RADIOMETER - An electrical calibrated radiometer includes a base, a suspension unit extending from the base, and a first heat measuring unit and a second heat measuring unit formed in the base. By applying a known voltage to the first heat measuring unit, the first heat measuring unit could serve as a thermal background for the second heat measuring unit, and an absolute temperature of a heat source could be determined with high precision from output voltages of the second heat measuring unit. | 02-07-2013 |
Shang-Yun Hou, Hsinchu TW
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20080286938 | Semiconductor device and fabrication methods thereof - A method for packaging a semiconductor device disclosed. A substrate comprising a plurality of dies, separated by scribe line areas respectively is provided, wherein at least one layer is overlying the substrate. A portion of the layer within the scribe lines area is removed by photolithography and etching to form openings. The substrate is sawed along the scribe line areas, passing the openings. In alternative embodiment, a first substrate comprising a plurality of first dies separated by first scribe line areas respectively is provided, wherein at least one first structural layer is overlying the first substrate. The first structural layer is patterned to form first openings within the first scribe line areas. A second substrate comprising a plurality of second dies separated by second scribe line areas respectively is provided, wherein at least one second structural layer is overlying the substrate. The second structural layer is patterned to form second openings within the second scribe line areas. The first substrate and the second substrate are bonded to form a stack structure. The stack structure is cut along the first and second scribe line areas, passing the first and second openings. | 11-20-2008 |
20090032945 | SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE - A solder bump on a semiconductor substrate is provided. The solder bump has a semiconductor substrate with a top copper pad thereon, a protective layer on the semiconductor substrate and at least one inorganic passivation layer overlying the protective layer with a first opening exposing the top copper pad, wherein the inorganic passivation layer has a thinner portion adjacent a top portion of the first opening. The solder bump further has a soft passivation layer on the inorganic passivation layer with a second opening larger than the first opening, an under bump metal layer conformally formed along the first opening and the second opening and a solder bump formed on the under bump metal layer. | 02-05-2009 |
20140327464 | TESTING OF SEMICONDUCTOR CHIPS WITH MICROBUMPS - A test structure including an array of microbumps electrically connecting a chip and a substrate, wherein a width of each microbump of the array of microbumps is equal to or less than about 50 microns (μm). The test structure further includes an interconnect structure connected to the array of microbumps. The test structure further includes an array of test pads around a periphery of the array of microbumps, wherein a test pad of the array of test pads is connected to a corresponding microbump of the array of microbumps through the interconnect structure. A width of the test pad is greater than a width of the corresponding microbump, and the test pad is adapted to be covered after circuit probing by a passivation material to prevent particle and corrosion issues. | 11-06-2014 |
Sheng-Fa Hou, Hsinchu TW
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20090122417 | Tunable-Shape Prism - A tunable-shape prism comprises: a fluid chamber including a first fluid and a second fluid. The first fluid is electrically conducted and the second fluid is electrically insulated. The first fluid and the second fluid have different refractive indexes and the first fluid and the second fluid are non-miscible to each other. A meniscus is formed between the first fluid and the second fluid. A plurality of first electrodes are contacted with the first fluid and a plurality of second electrodes are even-annularly arranged around the first and the second fluids. The plurality of the second electrodes are coated by an insulator; and the plurality of the second electrodes and the corresponding first electrode together constitute a plurality of electrode pairs. The surface tension of the second fluid can be controlled by a plurality of voltages correspondingly applied to the plurality of electrode pairs, which results in that the shape of the meniscus can be controlled by the plurality of voltages correspondingly applied to the plurality of electrode pairs. | 05-14-2009 |
20090122547 | Lighting System with an Adjustable Illuminated Area - The present invention discloses a lighting system with an adjustable illuminated area. The lighting system comprises a light source for outputting a light, a first refractive optical element and a second refractive optical element. The first and second refractive optical elements have continuous curvature. The first refractive optical element is movable along a first direction, while the second refractive optical element is movable along a second direction. The light passes through the first refractive optical element and the second refractive optical element to form an illuminated area. The shape and the size of the illuminated area are adjusted when the relative position of the first refractive optical element and the second refractive optical element is adjusted. | 05-14-2009 |