Patent application number | Description | Published |
20090121327 | Semiconductor device having spacer formed on semiconductor chip connected with wire - A semiconductor device includes a semiconductor chip, a supporting body that is disposed below the semiconductor chip and supports the semiconductor chip, a spacer that is fixed onto the first semiconductor chip, and a substrate that is located below the first semiconductor chip and electrically connected to the semiconductor chip with a wire. At least a part of the peripheral portion of the semiconductor chip is an overhang portion that projects more laterally than the peripheral portion of the supporting body. A covering portion that covers a part of the upper surface of the overhang portion is formed in the spacer. The wire is connected to a region in the upper surface of the overhang portion, the region being lateral to the outermost periphery of the covering portion of the spacer and not being covered with the covering portion of the spacer. A height of an apex of the wire from the upper surface of the first semiconductor chip as a reference, is greater than a height, from the reference, of at least a portion in the outermost periphery of the covering portion of the spacer, the portion having the wire arranged at its lateral side. | 05-14-2009 |
20090250802 | Multilayer wiring substrate, semiconductor package, and methods of manufacturing semiconductor package - A multilayer wiring substrate included in the semiconductor package includes: a first insulating layer and a second insulating layer, in which wiring layers are respectively provided on the upper and the lower surfaces; and; a core layer provided between the first insulating layer and the second insulating layer. The first insulating layer and the second insulating layer are constituted by different materials from each other. | 10-08-2009 |
20100085512 | SURFACE LIGHT SOURCE DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE ASSEMBLY - Disclosed herein is a surface light source device that illuminates a transmissive liquid crystal display device having a display area formed of pixels arranged in a two-dimensional matrix from a back side of the liquid crystal display device, the surface light source device comprising a plurality of light emitting element units, wherein each of the light emitting element units includes: at least one first light emitting element assembly; at least one second light emitting element assembly; and at least one third light emitting element assembly, and focal length and lateral magnification of each of the first lens, the second lens, and the third lens are adjusted based on emission intensity distribution of each of the first light emitting element, the second light emitting element, and the third light emitting element. | 04-08-2010 |
20100102461 | Semiconductor device and method of manufacturing the same - A semiconductor device including a substrate, a semiconductor chip mounted on the substrate, and an encapsulation resin encapsulating the semiconductor chip, wherein the encapsulation resin contains a first resin region composed of a first resin composition, a second resin region composed of a second resin composition, and a mixed layer formed between the first resin region and the second resin region so as to have the first resin composition and the second resin composition mixed therein is provided. | 04-29-2010 |
20100117210 | Semiconductor device - A semiconductor device including: a substrate formed with a concave portion at one surface thereof; and a first semiconductor chip provided in the concave portion of the substrate and is adhered to the substrate by an underfill in the concave portion, wherein the concave portion includes a chip arrangement region in which the first semiconductor chip is arranged, and an adjustment region which protrudes from at least a portion of the periphery of the chip arrangement region when seen in a plan view at a height of at least a portion of a region where the first semiconductor chip is placed in a stacked direction of the substrate, and has different shapes from the chip arrangement region is provided. | 05-13-2010 |
20100117244 | Semiconductor device and manufacturing method therefor - The present invention can avoid spaces not filled with resin by using simplified procedures and configuration even when multiple semiconductor chips are stacked, creating an overhanging portion. A semiconductor device | 05-13-2010 |
20100176517 | Electronic device - Differences in contraction forces of a sealing resin can be alleviated and strain on a package can be reduced even when electronic components are unevenly positioned on a substrate. An electronic device ( | 07-15-2010 |
20100258955 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The semiconductor device includes a substrate over one surface of which an electroless plating electrode film is formed; a semiconductor chip mounted over the one surface of the substrate; and a bonding wire which connects the semiconductor chip and one surface of the electroless plating electrode film, a recessed depth which is a difference between a lowermost height of a bonding portion of the one surface of the electroless plating electrode film to the bonding wire, and an uppermost height of the one surface other than the bonding portion being equal to or less than 1.5 μm. | 10-14-2010 |
20110049701 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The semiconductor device includes a substrate; a semiconductor chip mounted over the substrate; resin encapsulating the semiconductor chip; and a heat dissipation material that is arranged over the semiconductor chip and in contact with the resin, wherein the resin includes a first resin region made of a first resin composition, a second resin region made of a second resin composition, and a mixed layer that is formed between the first and second resin regions and obtained by mixing the first resin composition and the second resin composition. | 03-03-2011 |
20120032298 | SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor chip is mounted on a first surface of an interconnect substrate, and has a multilayer interconnect layer. A first inductor is formed over the multilayer interconnect layer, and a wiring axis direction thereof is directed in a horizontal direction to the interconnect substrate. A second inductor is formed on the multilayer interconnect layer, and a wiring axis direction thereof is directed in the horizontal direction to the interconnect substrate. The second inductor is opposite to the first inductor. A sealing resin seals at least the first surface of the interconnect substrate and the semiconductor chip. A groove is formed over the whole area of a portion that is positioned between the at least first inductor and the second inductor of a boundary surface of the multilayer interconnect layer and the sealing resin. | 02-09-2012 |
20140346636 | SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor chip is mounted on a first surface of an interconnect substrate, and has a multilayer interconnect layer. A first inductor is formed over the multilayer interconnect layer, and a wiring axis direction thereof is directed in a horizontal direction to the interconnect substrate. A second inductor is formed on the multilayer interconnect layer, and a wiring axis direction thereof is directed in the horizontal direction to the interconnect substrate. The second inductor is opposite to the first inductor. A sealing resin seals at least the first surface of the interconnect substrate and the semiconductor chip. A groove is formed over the whole area of a portion that is positioned between the at least first inductor and the second inductor of a boundary surface of the multilayer interconnect layer and the sealing resin. | 11-27-2014 |