Youichirou
Youichirou Chiba, Nirasaki City JP
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20150187643 | Depression Filling Method and Processing Apparatus - A depression filling method for filling a depression of a workpiece including a semiconductor substrate and an insulating film formed on the semiconductor substrate includes: forming an impurity-doped first semiconductor layer along a wall surface which defines the depression; forming, on the first semiconductor layer, a second semiconductor layer which is lower in impurity concentration than the first semiconductor layer and which is smaller in thickness than the first semiconductor layer; annealing the workpiece to form an epitaxial region at the bottom of the depression corresponding to crystals of the semiconductor substrate from the first semiconductor layer and the second semiconductor layer; and etching the first amorphous semiconductor region and the second amorphous semiconductor region. | 07-02-2015 |
Youichirou Honda, Miyazaki JP
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20120119965 | TRANSMISSION/RECEPTION ANTENNA AND TRANSMISSION/RECEPTION DEVICE USING SAME - Provided are a transmission/reception antenna and a transmission/reception device using the same wherein the transmission/reception antenna comprises an excitation loop antenna ( | 05-17-2012 |
20120208474 | TRANSMISSION/RECEPTION ANTENNA AND TRANSMISSION/RECEPTION DEVICE USING SAME - Provided are a transmission/reception antenna and a transmission/reception device using the same wherein the transmission/reception antenna comprises a dielectric base board ( | 08-16-2012 |
Youichirou Honda, Fukuoka JP
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20110115607 | TRANSMITTING / RECEIVING ANTENNA AND TRANSMITTER / RECEIVER DEVICE USING THE SAME - The present invention is concerned with a transmitting/receiving antenna, which includes a dielectric board, a driven loop antenna provided to the dielectric board, transmit processing portion connection terminals connected to the driven loop antenna, a transmitting/receiving loop antenna arranged in close vicinity to the driven loop antenna in a non-contact state, a resonance capacitor connected to both ends of the transmitting/receiving loop antenna, and receive processing portion connection terminals connected to the transmitting/receiving loop antenna. The driven loop antenna is constructed to have a loop wound in a single turn, and the transmitting/receiving loop antenna is constructed to have a loop wound in plural turns. According to this configuration, a wider frequency band of the frequency characteristic and a reduction of the power consumption can be achieved. | 05-19-2011 |
Youichirou Kawamura, Ibi-Gun JP
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20080302560 | PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD - A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm. | 12-11-2008 |
20090026250 | METHOD AND APPARATUS FOR LOADING SOLDER BALLS - A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having of openings that correspond to pads of the printed wiring board, one or more cylinder members positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion of the cylinder member, and a conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the printed wiring board through the openings of the ball array mask held by the holding device. | 01-29-2009 |
20090120680 | METHOD FOR MANUFACTURING A PRINTED WIRING BOARD - A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one opening in the solder resist layer has a depth D, from the solder resist layer to the exposed connection pad, of from 3 μm to 18 μm. The method also includes loading a solder ball into each of the at least one opening in the solder resist layer, and forming a bump on the exposed connection pad by heating the solder ball to a reflow temperature. | 05-14-2009 |
20120031659 | Printed Wiring Board And A Method Of Manufacturing A Printed Wiring Board - A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than | 02-09-2012 |
20120067938 | METHOD AND APPARATUS FOR LOADING SOLDER BALLS - A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having openings that correspond to the pads, one or more cylinder members is positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion. A conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the board through the openings of the mask held by the holding device. | 03-22-2012 |
Youichirou Kimura, Komatsu-Shi JP
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20140083781 | HYDRAULIC EXCAVATOR - A hydraulic excavator includes an undercarriage having a crawler and a rotating superstructure. The rotating superstructure includes a plate-shaped rotating frame, an engine, a fuel tank a counterweight and a fuel line. The engine is mounted inside the rotating frame. The fuel tank is disposed on one side of the engine. The counterweight is supported on the rotating frame to the rear of the engine, and disposed so that a bottom end portion faces a rear end surface of the rotating frame with a gap interposed therebetween and the gap is open to the atmosphere. The fuel line is connected to the fuel tank and disposed in the gap between the rear end surface of the rotating frame and the bottom end portion of the counterweight. | 03-27-2014 |
Youichirou Mansei, Chikusei-Shi, Ibaraki JP
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20150299520 | ADHESIVE SHEET FOR IMAGE DISPLAY DEVICE, METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY DEVICE - Provided is an adhesive sheet for an image display device ( | 10-22-2015 |
Youichirou Mansei, Ibaraki JP
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20100084169 | FLEXIBLE MULTILAYER WIRING BOARD - It is an object of the present invention to provide a flexible multilayer wiring board that can be easily reduced in thickness and that also has sufficient durability against repeated bending or heat shock. A preferred mode of the flexible multilayer wiring board comprises a flexible inner layer board obtained by forming an inner layer wiring on both sides of an insulating layer, an outer layer wiring situated on at least one side of the inner layer board, and insulating adhesive sheets lying between the inner layer board and outer layer wiring. One of the insulating adhesive sheets are composed of an imide group-containing polymer. | 04-08-2010 |
20100240821 | ADHESIVE COMPOSITION AND ADHESIVE FILM USING THE SAME - A thermosetting adhesive composition comprising (A) a modified polyamideimide resin that dissolves in organic solvents, (B) a thermosetting resin and (C) a curing agent or curing accelerator. | 09-23-2010 |
Youichirou Maruyama, Minato-Ku JP
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20160049324 | STACK, METHOD FOR TREATING SUBSTRATE MATERIAL, TEMPORARY FIXING COMPOSITION, AND SEMICONDUCTOR DEVICE - A stack includes a substrate material that has a circuit surface and that is temporarily fixed on a support via a temporary fixing material. The temporary fixing material includes a temporary fixing material layer (I) that is in contact with the circuit surface of the substrate material and a temporary fixing material layer (II) that is formed on the support-facing surface of the layer (I). The temporary fixing material layer (I) is formed of a temporary fixing composition (i) that includes a thermoplastic resin (Ai), a polyfunctional (meth)acrylate compound (Bi), and a radical polymerization initiator (Ci), and the temporary fixing material layer (II) is formed of a temporary fixing composition (ii) that includes a thermoplastic resin (Aii) and a release agent (Dii). | 02-18-2016 |
Youichirou Matsumoto, Tokyo JP
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20090025761 | ULTRASONIC CLEANING APPARATUS - An ultrasonic cleaning apparatus which performs ultrasonic cleaning of a contamination attached to a surface of an object to be cleaned, by using a cleaning liquid to which ultrasonic waves are applied has a cleaning bath pooling the cleaning liquid, a support base on which the object to be cleaned is supported in the cleaning liquid, ultrasonic wave generation device for alternately focusing first ultrasonic waves having a frequency of 1 to 10 MHz and second ultrasonic waves having a frequency equal to or lower than ½ of that of the first ultrasonic waves toward the object to be cleaned, a focus position adjustment device of adjusting the distance between a focus position for the focus and the surface of the object to be cleaned, and moving device of moving at least any one of the ultrasonic wave generation device and the support base so that the effect on the surface of the object to be cleaned of the ultrasonic waves generated by the ultrasonic wave generation device is uniform. | 01-29-2009 |
20100192974 | METHOD FOR ULTRASONIC CLEANING OF CONTAMINATION ATTACHED TO A SURFACE OF AN OBJECT - An ultrasonic cleaning method in which ultrasonic cleaning of a contamination attached to a surface of an object to be cleaned is performed by directing toward the object to be cleaned, a cleaning liquid to which ultrasonic waves are applied by alternately focusing first ultrasonic waves having a frequency of 1 to 10 MHz and second ultrasonic waves having a frequency equal to or lower than ½ of that of the first ultrasonic waves. A focus position adjustment device is used to adjust the distance of the focus position relative to the surface of the object to be cleaned, and a moving device is used to movie at least one of the ultrasonic wave generation device and a support base for the object so that the effect of the ultrasonic waves generated by the ultrasonic wave generation device on the surface of the object to be cleaned is uniform. | 08-05-2010 |
Youichirou Ogawa, Hamamatsu-Shi JP
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20150054895 | RECORDING MEDIUM TAKE-UP MECHANISM AND PRINTER - A recording medium take-up mechanism and a printer prevent a recording medium having been printed from easily twisting when winding the recording medium. A printer includes a platen supporting recording paper that is delivered frontward during printing, a take-up shaft on which the recording paper having been printed is wound, a tension bar configured to impart tension to the recording paper by pressing a portion of the recording paper that is between the platen and the take-up shaft, a support arm supporting the tension bar, and a support shaft pivotably supporting the support arm. A center of the support shaft is positioned inside a contour of the take-up shaft, as viewed in an axial direction of the support shaft. | 02-26-2015 |
20160031158 | THREE-DIMENSIONAL PRINTING DEVICE - A three-dimensional printing device includes a base, a holder disposed above the base, a printing head fixed on the holder and including a nozzle configured to discharge a resin material, a stage disposed in the base below the printing head configured to hold the resin material discharged from the nozzle, and a stage moving mechanism configured to move the stage with five or more degrees of freedom. | 02-04-2016 |
Youichirou Shikine, Gunma JP
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20090128073 | Brushless Motor Control Method and Brushless Motor - In a brushless motor for an electric power steering device having a configuration of 2 poles and 3 slots, or of an integral multiple thereof, a stator coil is supplied with current containing a higher harmonic component. A difference of 0.5% to 1.5% is provided between the higher harmonic component content rate of the stator coil current and the higher harmonic component content rate of the induced electromotive force generated in the stator coil with rotation of a permanent magnet, thereby mitigating the influence by an armature reaction generated in the induced electromotive force to reduce torque ripples. The difference between the higher harmonic component content rates is set on the basis of a change that occurs in the induced electromotive force due to the armature reaction at a time of supplying electricity to the armature coil. | 05-21-2009 |
Youichirou Shimizu, Komatsu-Shi JP
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20090052997 | Milling cutter of crank shaft miller, and cutter tip and cutter tip set for milling cutter of crank shaft miller - A vertical outer circumferential cutter tip, which has an approximate hourglass shape that is narrower at its middle than at its ends, and all of its eight corners are acute angles. Both sides of the vertical outer circumferential cutter tip are relieved at an angle α. When performing cutting processing upon the side surface of a counter weight with the vertical outer circumferential cutter tip, excessive friction is prevented. The shapes of the upper end portion and the lower end portion of the vertical outer circumferential cutter tip are formed so as to be very gently convexed, and with a relief of an angle β. Abrasion of the upper end portion and the lower end portion of the vertical outer circumferential cutter tip is prevented before the acute angled corner used for cutting is damaged. | 02-26-2009 |
Youichirou Suzki, Nishio-City JP
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20090233565 | Receiving decive - A receiving device is provided capable of avoiding reception of unnecessary energy when a signal waveform actually changes on a receiving side. An impedance control circuit includes a sensing unit to sense one or more of a voltage, current, or power of a signal to be received by a receiving circuit. The impedance control unit varies an input impedance according to the change in the sensed one or more quantities so that the received signal will be reflected. Thus the excess energy of the signal is reflected and fed to any other receiving circuit achieving stable communications. | 09-17-2009 |
Youichirou Suzuki, Nishio-City JP
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20090296830 | SIGNAL RECEIVER FOR RECEIVING DIFFERENTIAL SIGNAL VIA TRANSMISSION LINE - A signal receiver includes: a receiving circuit that receives a differential signal via a transmission line, which includes a pair of signal wires for transmitting the differential signal; and an impedance control circuit that controls an input impedance so as to reduce a common mode noise. The impedance control circuit includes a detection element for detecting at least one of a voltage, a current and an electric power of the common mode noise. The impedance control circuit controls the input impedance in accordance with change of the at least one of the voltages the current and the electric power of the common mode noise. | 12-03-2009 |
20100177829 | Receiving device including impedance control circuit and semiconductor device including impedance control circuit - A receiving device includes a receiving circuit and an impedance control circuit. The receiving circuit receives a signal transmitted through a communication line. The impedance control circuit is coupled with the receiving circuit and has a detecting part. The detecting part detects a physical value of the signal and the physical value includes at least one of a voltage, an electric current, and an electric power. The impedance control circuit changes an input impedance based on the detected value so that a ringing of the signal is reduced. | 07-15-2010 |
20110084730 | TRANSMISSION APPARATUS FOR DIFFERENTIAL COMMUNICATION - A transmission apparatus for differential communication includes a driver bridge circuit and a pair of noise protection circuits. The driver bridge circuit includes four output devices that are independently connected between each of a pair of transmission lines and a power line or a ground line. Each noise protection circuit is provided to a corresponding transmission lines. Each noise protection circuit includes a ground potential detector and an impedance controller. The ground potential detector detects a potential of the corresponding transmission line with respect to the ground line. The impedance controller causes an impedance of the corresponding transmission line with respect to the ground line to become equal to an impedance of the other transmission line with respect to the ground line, when the detected potential becomes outside a predetermined potential range. | 04-14-2011 |
20110135014 | Transmission device for differential communication - In a transmission device for differential communication, a first cathode-side element part is coupled between a first communication line and a cathode-side power supply line, a second cathode-side element part is coupled between a second communication line and the cathode-side power supply line, a first anode-side element part is coupled between the first communication line and an anode-side power supply line, and a second anode-side element part is coupled between the second communication line and the anode-side power supply line. A driving portion drives the element parts based on transmission data input from an outside. A target potential generating portion generates target potentials of the element parts based on potentials of the first communication line and the second communication line. | 06-09-2011 |
20110169547 | RINGING SUPPRESSION CIRCUIT - A ringing suppression circuit for a communication circuit that performs communication through a transmission line includes a high side switch connected between a high potential reference point and a high side line of the transmission line, a low side switch connected between a low potential reference point and a low side line of the transmission line, and a ringing suppression section. The ringing suppression section turns on the high side switch based on a difference between a potential of the high side line and a potential applied to a control terminal of the high side switch. The ringing suppression section turns on the low side switch based on a difference between a potential of the low side line and potential applied to a control terminal of the low side switch. | 07-14-2011 |
20110285424 | DIFFERENTIAL COMMUNICATION DEVICE - When a transmission signal is detected as having been changed from a high level to a low level, two transmission lines are connected for only a predetermined time through a diode by a first transistor and a second transistor. The diode is arranged such that its forward direction is from a high-side transmission line to a low-side transmission line. The diode turns on, when a potential of the high-side transmission line becomes higher than that of the low-side transmission line by ringing and a potential difference therebetween exceeds a forward drop voltage of the diode. As a result, a peak wave level of a positive side in the ringing is limited to the forward drop voltage of the diode. | 11-24-2011 |
20120293230 | RINGING SUPPRESSION CIRCUIT - An inter-line switching element formed of a MOSFET is provided between a pair of signal lines. When the level of a differential signal changes from high to low, a control circuit turns on the FET for a fixed period thereby to suppress ringing by decreasing the impedance between the signal lines when the level of the differential signal transitions, and causing the energy of the distortion of the differential signal waveform to be absorbed by the on-resistance of the FET. | 11-22-2012 |
20130099849 | RINGING SUPPRESSION CIRCUIT - A ringing suppression circuit for a communication circuit that performs communication through a transmission line includes a high side switch connected between a high potential reference point and a high side line of the transmission line, a low side switch connected between a low potential reference point and a low side line of the transmission line, and a ringing suppression section. The ringing suppression section turns on the high side switch based on a difference between a potential of the high side line and a potential applied to a control terminal of the high side switch. The ringing suppression section turns on the low side switch based on a difference between a potential of the low side line and a potential applied to a control terminal of the low side switch. | 04-25-2013 |
Youichirou Suzuki, Okazaki-City JP
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20130009671 | SWITCHING ELEMENT DRIVING DEVICE AND METHOD - A slew rate regulation circuit varies a slew rate of a waveform of a voltage outputted to a DC motor through a N-channel MOSFET. The slew rate regulation circuit lowers a peak level by dispersing frequency components of switching noise, which develops in a frequency range higher than a frequency range determined by a carrier frequency. | 01-10-2013 |
20160031273 | TIRE DEVICE - A tire device includes a vibration power generating element, a signal processing unit, and a transmitter. The vibration power generating element is arranged inside a tire and outputs a voltage corresponding to a time variation of a vibration generated in a tread of the tire. The signal processing unit is disposed inside the tire and performs signal processing on the voltage outputted from the vibration power generating element. The transmitter is arranged inside the tire and sends data subjected to the signal processing in the signal processing unit to a device provided outside the tire. The signal processing unit and the transmitter are driven by power generated in the vibration power generating element. | 02-04-2016 |
Youichirou Suzuki, Wako-Shi JP
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20140035325 | STRUCTURE FOR FRONT PROTION OF AUTOMOBILE BODY - A structure for a front portion of an automobile body includes a bulkhead side, which is joined to a front portion of a front side frame extending in the fore-and-aft direction extends in the vertical direction, and a side frame gusset, which provides a connection between the front portions of the front side frame and a wheel house upper member. The bulkhead side and the side frame gusset are joined by a linking panel having a right-angled triangle shape when viewed from the front within a plane perpendicular to an axis in the fore-and-aft direction. When a load is applied for relatively moving the front side frame, the side frame gusset and the wheel house upper member supporting the load by a shear force of the linking panel disposed within the plane enhance the rigidity of a front portion of a vehicle body and minimize any increase in weight. | 02-06-2014 |
20140061412 | BRACKET WITH NUT - A bracket with nut fitted into an interior of a groove-shaped bead formed on a surface of a member includes a nut part into which a bolt is screwed, and a bracket part that supports the nut part and is retained by an opening formed in the bead. The bracket part includes the base portion and a first to third leg portions, and if the bolt is screwed into the nut part in a state in which the second leg portions and the third let portions are inserted into the opening, the third leg portions are pushed by the bolt to thus open out the second leg portions on the interior side of the opening, thus retaining the bracket part so as not to fall out of the opening and thereby enabling another member to be secured to the base portion of the member into the nut part. | 03-06-2014 |
Youichirou Suzuki, Kawachi-Gun JP
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20140232138 | VEHICLE BODY SIDE PORTION STRUCTURE - In a vehicle body side portion structure, a center pillar includes an upper pillar section joined to a roof side rail and a lower pillar section joined to a side sill, the upper pillar section including a metallic pipe having a high-strength steel plate, has a substantially constant cross-sectional shape, and is convexly curved outwardly in a vehicle width direction, the lower pillar section is formed by two pressed components including a steel plate having lower strength than the steel plate of the hollow metallic pipe of the upper pillar section and are joined to each other into a closed cross-sectional shape, and the upper pillar section is joined to the two pressed components such that the lower edge part of the upper pillar section is inserted within a section configured by the two pressed components of the lower pillar section and having the closed cross-sectional shape. | 08-21-2014 |
Youichirou Uka, Osaka JP
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20150262754 | METHOD FOR MANUFACTURING SOLID ELECTROLYTIC CAPACITOR - A first conductive polymer solution in which fine particles of a conductive polymer are dispersed is applied to a dielectric layer of aluminum oxide, and this solution is dried to form a first conductive polymer layer. Next, a coating solution is applied to the first conductive polymer layer, this solution containing at least one selected from an aromatic sulfonic acid having, in one molecule of the acid, a carboxyl group and a hydroxyl group, or two carboxyl groups, and a salt of the aromatic sulfonic acid. The solution is then dried to form a coating layer. Next, a second conductive polymer solution is applied to the coating layer, the solution being a solution in which fine particles of a conductive polymer are dispersed. This solution is then dried to form a second conductive polymer layer. This process gives a solid electrolyte layer of a capacitor element. | 09-17-2015 |
Youichirou Wada, Machida City JP
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20160075838 | Black Polytetrafluoroethylene Porous Film, Production Process for the Same, and Uses of the Same - Provided is a black PTFE porous film which comprises a black colorant-containing PTFE nanofiber (D) containing a polytetrafluoroethylene (PTFE) nanofiber (E) and a black colorant (B) and has a value (V), as represented by a Munsell symbol in accordance with JIS Z 8721, of not more than N2.5, wherein the black colorant-containing PTFE nanofiber (D) is obtained by subjecting a spinning solution containing at least PTFE or modified PTFE (A) to an electrospinning method. | 03-17-2016 |