Patent application number | Description | Published |
20100136185 | MULTI-REGION CONFECTIONERY COMPOSITION, ARTICLE, METHOD, AND APPARATUS - A dough-like confectionery material contains a solid particulate, a liquid, and a diffusion controller. The dough-like confectionery material is an effective replacement for panned coatings, and it can be applied to an edible substrate, such as candy or chewing gum to form a layered confection. Methods and apparatus for forming layered confections are also described. | 06-03-2010 |
20110011459 | HYBRID AND/OR COMPLEX MATERIAL, PHOTOELECTRIC CONVERSION MATERIAL, DYE-SENSITIZED SOLAR CELL, DYE-SENSITIZED SOLAR CELL DEVICE, MANUFACTURING METHOD OF PHOTOELECTRIC CONVERSION DEVICE, AND METHOD OF ANALYZING TITANIUM OXIDE CRYSTAL STRUCTURE - There is provided a hybrid and/or complex material or the like which can realize a high-efficient photoelectric conversion material or the like. One aspect of the present invention lies in a dye-sensitized solar cell device | 01-20-2011 |
20130216661 | MULTI-REGION CONFECTIONERY - A dough-like confectionery material contains a solid particulate, a liquid, and a diffusion controller. The dough-like confectionery material is an effective replacement for panned coatings, and it can be applied to an edible substrate, such as candy or chewing gum to form a layered confection. Methods and apparatus for forming layered confections are also described. | 08-22-2013 |
20140020761 | ORGANIC DYE MATERIAL AND DYE-SENSITIZED SOLAR CELL USING SAME - Provided is an inexpensive and high-performance dye compound that does not use an expensive precious metal and does not require the use of a strong electron-withdrawing group. The compound is formed such that a boron substituent is introduced into a heteroatom-containing π electron-based backbone containing a double bond between carbon and the heteroatom to obtain a compound in which a backbone having boron and a coordination bond in a molecule thereof is used as a π electron-accepting backbone. | 01-23-2014 |
20140127353 | FLUIDIC FOOD COMPOSITION AND CONFECTIONARY - The purpose of the present invention is to provide: a flowable food composition which contains xylitol in an amount sufficient to obtain excellent sweetness and which can retain the flowability over a long period even when the water content is low; and a confection which is obtained using the flowable food composition. This flowable food composition comprises glycerol, xylitol, which is contained in an amount effective for sweetness, and one or more sugar alcohols excluding xylitol and glycerol. The sugar alcohols preferably comprise one or more compounds selected from the group consisting of sorbitol, maltitol, and reduced palatinose. This confection comprises a center composition which comprises the flowable food composition and a shell composition with which at least some of the center composition is surrounded, the shell composition being selected from the group consisting of candy, chewing gum, and chocolate. | 05-08-2014 |
Patent application number | Description | Published |
20090173522 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring. | 07-09-2009 |
20090173530 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer includes a first insulating layer made of an inorganic material and having a first land, a second land and a first wiring electrically connecting the first land and the second land, and a second insulating layer formed over a first surface of the first insulating layer and having a second wiring, a second pad for loading a second electronic component over the second insulating layer and a first via conductor electrically connecting the second land and the second wire. The first wiring and the second wiring electrically connect the first land and the second pad. The first land and second land are positioned such that a first electronic component is mounted over a second surface of the first insulating layer on the opposite side of the first surface. The second wiring has a longer wiring length and a greater thickness than the first wiring. | 07-09-2009 |
20090175023 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring. | 07-09-2009 |
20110265323 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method of manufacturing an interposer including forming an inorganic insulating layer over a support substrate, forming a first wiring in or on a surface of the inorganic insulating layer, forming an organic insulating layer over the inorganic insulating layer and the first wiring, forming a second wiring on the organic insulating layer, and forming a conductor portion connecting the second wiring and the first wiring. | 11-03-2011 |
20110265324 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - A method for manufacturing an interposer including forming a first insulating layer comprising an inorganic material on a supporting substrate, forming a first wire in the first insulating layer, forming a second insulating layer on a first side of the first insulating layer, forming a second wire with a longer wire length and a greater thickness than the first wire on the second insulating layer, and removing the supporting substrate. | 11-03-2011 |
20130014982 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer. | 01-17-2013 |