Patent application number | Description | Published |
20090027858 | HEAT DISSIPATING DEVICE ASSEMBLY - A heat dissipating device assembly for dissipating heat generated by an electronic component ( | 01-29-2009 |
20090052175 | LED LAMP WITH A HEAT DISSIPATION DEVICE - An LED lamp includes a hollow, prism-shaped heat sink ( | 02-26-2009 |
20090059536 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink. | 03-05-2009 |
20090059604 | HEAT DISSIPATION DEVICE FOR LIGHT EMITTING DIODE MODULE - A heat dissipation device for a light emitting diode (LED) module includes a heat sink, a plurality of heat pipes received in the heat sink and a heat-absorbing plate thermally attached to the heat pipes and the LED module and located therebetween. The heat sink includes a base and a plurality of fins mounted on the base. The base defines a plurality of grooves for accommodating the heat pipes therein. Top surfaces of the heat pipes are coplanar with a top face of the base of the heat sink so that the heat-absorbing plate has an intimate contacting with the top face of the base of the heat sink and the top surfaces of the heat pipes, whereby the heat pipes can quickly transfer heat from the LED module to the heat sink via the heat-absorbing plate. | 03-05-2009 |
20090059605 | LED LAMP - An LED lamp includes a heat dissipation apparatus with a base, an LED module mounted on the base, and an AC-DC converter electrically connected to the LED module. The AC-DC converter is mounted on the base near the LED module. Heat generated by the LED module and heat-generating components of the AC-DC converter is transferred to the base from which the heat is dissipated by the heat dissipation apparatus. Heat pipes are embedded in the base of the heat dissipation apparatus. | 03-05-2009 |
20090095448 | HEAT DISSIPATION DEVICE FOR LED CHIPS - A heat dissipation device for removing heat from LED chips includes a finned heat sink, a plurality of heat pipes and a plurality of heat conductive substrates. The heat sink comprises a base plate and a plurality of fins formed on the base plate. The heat pipes which transfer heat in a unidirectional manner are embedded in the base plate. Each of the heat pipes defines a first wall and a second wall coupled to the heat sink. The heat pipes only transfer heat from the first walls to the second walls and restrict a heat transfer in a reversed direction. The substrates are in contact with first walls of the heat pipes. The LED chips are mounted on the substrates. When the LED chips generate heat, the heat is transferred to the fins via the unidirectional heat pipes to lower the temperature of the LED chips. | 04-16-2009 |
20090095959 | HEAT DISSIPATION DEVICE FOR LED CHIPS - A heat dissipation device for removing heat from LED chips includes a heat sink and a plurality of substrates. The heat sink comprises a base plate. A plurality of fins extends upwardly from the base plate. The substrates each have a unidirectional heat transfer and are attached to a bottom face of the heat sink. Each of the substrates defines a first wall on which The LED chips are mounted and a second wall coupled to the heat sink. The substrates only transfer heat from the first wall to the second wall and restrict the heat transfer in a reverse direction. When the LED chips generate heat, the heat is transferred to the fins of the heat sink via the unidirectional substrates to lower temperature of the LED chips. | 04-16-2009 |
20090103308 | LED LAMP WITH A HEAT SINK - An LED lamp includes a plurality of LED modules, a cone-shaped heat absorbing member, a heat sink and an envelope. The heat absorbing member comprises a plurality of heat absorbing portions. Each of the heat absorbing portions has a configuration like a triangular pyramid and comprises a sector base and an inclined surface extending from an edge of the sector base to a single apex. Each of the LED modules is attached on a corresponding inclined surface. The heat sink thermally connects with the heat absorbing member. The envelope is mounted below the heat sink and engages with the heat sink to enclose the heat absorbing member and the LED modules therein. Heat generated by the LED modules is first absorbed by the heat absorbing member and then dissipated to ambient air through the heat sink. | 04-23-2009 |
20090120612 | HEAT DISSIPATION DEVICE FOR LIGHT EMITTING DIODE MODULE - A heat dissipation device includes a heat sink and an LED module attached to the heat sink. The heat sink includes a base and a plurality of fins mounted on the base. A plurality of channels is defined between the fins of the heat sink and slits are defined in two opposite side edges of the base. The slits extend through the base and corresponding fins and cross with corresponding channels. A plurality of grooves is defined in the fins opposite to the LED module. Each of the grooves interconnects corresponding two aligned slits. | 05-14-2009 |
20090129075 | LED LAMP WITH A HEAT DISSIPATION DEVICE - An LED lamp includes a heat sink, a plurality of vapor chambers mounted on the heat sink and an LED module mounted on the vapor chambers. The heat sink includes a base, a plurality of fins extending from a first surface of the base and a triangular ridge formed on a second surface opposite to the first surface of the base. The vapor chambers are mounted on the ridge of the base. The LEDs over two slopes of the ridge are oriented slantwise outwardly, thereby increasing an irradiation angle and area of the LED lamp. | 05-21-2009 |
20090129103 | LED LAMP WITH A HEAT DISSIPATION DEVICE - An LED lamp includes a heat sink, a triangular-shaped ridge positioned on the heat sink and an LED module mounted on the ridge. The heat sink includes a base and a plurality of first and second fins respectively extending from a first and a second surface of the base, with a plurality of channels defined between the first and second fins. The ridge is positioned on the second surface of the base. The ridge has a lateral surface which has a height decreasing from a middle to a lateral side of the ridge and decreasing from a rear end to a front end of the ridge. The LED module is mounted on the lateral surface of the ridge. | 05-21-2009 |
20090135605 | LED UNIT - An LED unit ( | 05-28-2009 |
20090147518 | LED LAMP WITH IMPROVED HEAT DISSIPATING STRUCTURE - An LED lamp includes a top cover, a heat sink, and a conducting member, a plurality of light bars and a light cover. The top cover has a plate and a head extending upwardly from a centre of the plate. The heat sink has a conducting tube coupled to the plate of the top cover and a plurality of fins extending outwardly from the conducting tube. The conducting member is received in and thermally contacts with the conducting tube, and has a top surface attached to the plate and an inner surface on which the plurality of light bars are mounted. The inner surface is oriented downwardly and concaved from a bottom of the conducting member. Each light bar has a printed circuit board and a plurality of LEDs thereon. | 06-11-2009 |
20090147521 | LED LAMP - An LED lamp includes a housing having a base, a frame at a top end of the housing and a plurality of stanchions interconnecting the base and the frame. A heat sink is mounted on the frame. An LED module is received in the housing and attached on a bottom surface of the heat sink. A printed circuit board is arranged on the base of the housing, and a reflector is located on the printed circuit board. A transparent envelope is received in the housing and covers windows defined between the stanchions. A light generated by the LED module is reflected by the reflector to transmit outwardly through the envelope to illuminate a surrounding environment. | 06-11-2009 |
20090151898 | HEAT SINK - A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are juxtaposed with each other at a central position thereof, and partially spaced from each other at two opposite end positions thereof. | 06-18-2009 |
20090151905 | HEAT SINK WITH VAPOR CHAMBER - A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a sintered wick layer formed at an inner face of base. The plate has a meshed wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. | 06-18-2009 |
20090151906 | HEAT SINK WITH VAPOR CHAMBER - A heat sink includes a tank and a plate covering on the tank and hermetically engaging with the tank. The tank includes a base for absorbing heat from heat-generating members and a first wick layer formed at an inner face of base. The plate has a second wick layer formed at an inner face thereof. A chamber is defined between the tank and the plate and contains working fluid therein. An artery mesh is located in the chamber between the tank and the plate. The artery mesh is in porosity communication with the first wick layer and the second wick layer. | 06-18-2009 |
20090151921 | HEAT SINK HAVING LOCKING DEVICE - A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together. | 06-18-2009 |
20090154168 | LED LAMP - An LED lamp includes a frame, a heat sink, an LED module and a reflector. The frame comprises a base, an upper ring spaced from the base and a plurality of stanchions connecting the upper ring and the base together. The heat sink is coupled to a top of the upper ring and covers a whole of a top of the frame. The LED module is attached to a bottom surface of the heat sink and surrounded by the upper ring. The reflector is placed on the base and has an outer surface facing and slantwise to the LED module. The reflector has a configuration like an inverted funnel. The outer surface of the reflector has multiple steps formed thereon. | 06-18-2009 |
20090155099 | PUMP FOR LIQUID COOLING SYSTEM - A pump includes a base ( | 06-18-2009 |
20090159252 | HEAT SINK HAVING BUMPS FOR POSITIONING HEAT PIPES THEREIN - A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a plurality of bumps projecting upwardly therefrom, which sandwich the heat pipes therebetween to position the heat pipes on the lower plate, wherein some of the heat pipes are bent and sandwiched between two bumps at each bended position, and some of the heat pipes are straight and located near one bump at each end portion thereof. | 06-25-2009 |
20090162225 | PUMP FOR LIQUID COOLING SYSTEM - A pump comprises a base ( | 06-25-2009 |
20090166000 | HEAT SINK WITH HEAT PIPES - A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end. | 07-02-2009 |
20090166003 | HEAT SPREADER WITH VAPOR CHAMBER - A heat spreader for cooling an electronic component includes a lower plate defining a chamber, an upper plate fixed on the lower plate to seal the chamber, a first wick layer and a second wick layer sandwiched between the upper plate, and a working liquid contained in the chamber. The first wick layer and the second wick layer respectively define a plurality of apertures, which include right-angled triangle, acute-angled triangle, and rhomb apertures communicating with each other for containing the working liquid therein. | 07-02-2009 |
20090166004 | HEAT PIPE - A heat pipe includes a hollow metal casing and a wick structure arranged at an inner surface of the hollow metal casing. A part of the inner surface of the hollow metal casing is covered with the wick structure and other parts of the inner surface are uncovered with the wick structure. | 07-02-2009 |
20090166005 | VAPOR CHAMBER - A vapor chamber includes a base ( | 07-02-2009 |
20090166008 | HEAT SPREADER WITH VAPOR CHAMBER - A heat spreader for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, a working liquid contained between the lower plate and the upper plate, and a wick structure formed between the lower plate and the upper plate. Each of the upper plate and the lower plate defines a cavity receiving a portion of the wick structure therein, and a plurality of grooves extending radially from the cavity to a periphery thereof. | 07-02-2009 |
20090168416 | LED LAMP - An LED lamp includes a heat sink having a base and a plurality of fins extending from the base. A plurality of LED modules is thermally attached to the base of the heat sink. A lamp frame surrounds the LED modules on the heat sink and is hermetically mounted to the heat sink. A lens is hermetically attached to the lamp frame and covers the LED modules. The fins includes a plurality of first fins extending from a first face of the base of the heat sink, and second fins extending from a second face of the base. The LED modules are located between the second fins. A pole has a top end engages with the lamp frame. The pole is used for mounting the LED lamp at a desired position, for example, a sidewalk of a street. | 07-02-2009 |
20090168417 | LED LAMP - An LED lamp includes a base, a top cover located above the base, a plurality of heat sinks spaced from each other and three LED modules respectively attached to inner sides of the three heat sinks. The heat sinks are sandwiched between base and the top cover and have a plurality of fins extending outwardly from outer sides thereof. | 07-02-2009 |
20090196045 | LED LAMP WITH IMPROVED HEAT SINK - An LED lamp includes a heat sink, an LED module attached to a top surface of the heat sink in a thermal conductive relationship therewith and a cover coupled to the top surface of the heat sink and covering the LED module. The heat sink is column-shaped and has a central axis. The heat sink comprises a conducting member and a plurality of spaced and parallel fins extending outwardly from the conducting member. A distance between each of inner edges of the fins and the central axis is gradually decreased from the top surface to a bottom surface of the heat sink. | 08-06-2009 |
20090213592 | LED LAMP WITH HEAT SINK ASSEMBLY - An LED lamp includes a support, an envelope, a heat sink assembly and a plurality of LED modules. The envelope is coupled to the support. The heat sink assembly includes a first heat sink mounted on the envelope, a cylindrical second heat sink attached to a bottom surface of the first heat sink and positioned in the envelope, and a plurality of heat pipes. The LED modules are mounted on an outside wall of the second heat sink. The heat pipes have condensing portions embedded in the bottom surface of the first heat sink and evaporating portions sandwiched between the outside wall of the second heat sink and the LED modules. | 08-27-2009 |
20090236262 | PROTECTIVE PACKAGING FOR AN LED MODULE - A protective packaging for protecting an LED module from being damaged during transportation, includes a housing containing the LED module therein and a cover slidably fixed in the housing to cover a top opening of the housing. The housing defines a room to receive the LED module therein. A bottom portion of the housing is concaved to form a space, in which a thermal interface material bonded on the LED module is accommodated. An end of the housing is closed to abut against an end of the cover, and an opposite end of the housing is partially opened to receive an opposite end of the cover. The protective packaging is made from an antistatic plastic and has a wall thickness larger than 0.5 mm. | 09-24-2009 |
20090290342 | LIGHT-GUIDING MODULE AND LED LIGHT SOURCE USING THE SAME - An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED. | 11-26-2009 |
20090316403 | LED LAMP - An LED lamp includes a lamp frame, a plurality of LED modules, an envelope and a heat sink made of metal. The envelope and the heat sink are mounted on top and bottom sides of the lamp frame. A frame body of the lamp frame is attached to a top face of a base of the heat sink. A heat absorbing member made of metal and provided with a plurality of heat absorbing portions is attached on the top face of the base. The LED modules are attached on top boards of the heat absorbing portions. The envelope engages with the lamp frame and receives the heat absorbing member and the LED modules therein. The top boards are inclined downwards from a middle toward an outside of the heat absorbing member. | 12-24-2009 |
20090323347 | LED LAMP - An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates. | 12-31-2009 |
20100002438 | LED LAMP - An LED lamp includes a heat sink having a base and a plurality of LED module assemblies mounted on a top surface of the base of the heat sink. Each of the LED module assemblies includes a fixing bracket secured to the top surface of the base, an LED module mounted on a top surface of the fixing bracket and two heat pipes engaging with the fixing bracket and the heat sink. The fixing bracket includes a bottom plate attached on the top surface of the base, a top plate on which the LED module is attached and a connecting plate interconnecting the bottom plate with the top plate. The heat pipes thermally connect the bottom plate and the heat sink with the top plate. | 01-07-2010 |
20100027262 | LED LAMP - An LED lamp includes a bracket and a heat sink mounted on a top side of the bracket. The heat sink includes a base. A plurality of LED module assemblies is mounted to a bottom surface of the base of the heat sink. Each of the LED module assemblies includes a heat absorbing plate located below the bottom surface of the base of the heat sink, an LED module mounted on a bottom surface of the heat absorbing plate and a heat pipe interconnecting the bottom surface of the base and a top surface of the heat absorbing plate. The heat pipes are U-shaped and horizontally positioned and have different heights. | 02-04-2010 |
20100061092 | LED LAMP - An LED lamp includes an LED module, a heat sink having a base to which the LED module is mounted, a plurality of screws extending through the LED module and into the base of the heat sink to secure the LED module on the base of the heat sink, and a plurality of elastic members mounted on the screws and positioned between the base and the LED module. The elastic members are expanded by the screws to generate a force engaging with the screws to thereby combine the screws and the LED module together beforehand. | 03-11-2010 |
20100097766 | FIXING DEVICE FOR HEAT SINK - A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards. | 04-22-2010 |
20100103674 | LED LAMP HAVING A VAPOR CHAMBER FOR DISSIPATING HEAT GENERATED BY LEDS OF THE LED LAMP - An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces. | 04-29-2010 |
20110255285 | ILLUMINATION DEVICE WITH HEAT DISSIPATION STRUCTURES - An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air. | 10-20-2011 |