Lin, Wugu Township
Chen-Hiang Lin, Wugu Township TW
Patent application number | Description | Published |
---|---|---|
20110203295 | COOLING RACK STRUCTURE OF THERMOELECTRIC COOLING TYPE - A cooling rack structure includes a cooling plate ( | 08-25-2011 |
Chih-Kuan Lin, Wugu Township TW
Patent application number | Description | Published |
---|---|---|
20120019158 | Polarity-reversible dimming controller having function of switching light source - A polarity-reversible dimming controller having function of switching light source has a power supply module and a dimming control module. The dimming control module receives an external PWM dimming signal to control a feedback signal of the power supply module so as to dim or power on/off an LED lamp. The dimming control module has an output current switching circuit, a switch control circuit and a dimming control circuit. The output current switching circuit performs a PWM control over a current outputted from the power supply module by using the external PWM dimming signal to maintain chromacity of the LED lamp as a constant. The switch control circuit turns off the PWM controller to enter a standby mode for saving power once the PWM dimming signal exceeds a threshold value. As a full-wave rectification is performed on the PWM dimming signal, the polarity match issue upon assembling can be disregarded. | 01-26-2012 |
Hsiu-Ping Lin, Wugu Township TW
Patent application number | Description | Published |
---|---|---|
20140134952 | CONNECTIVE TRANSMISSION DEVICE - A connective transmission device of the invention may include a first interface configured to connect to a first device; a second interface configured to connect to a second device; and a control module connected to the first interface and the second interface. When the first interface is connected to the first device and the second interface is connected to the second device, the control module is configured to connect the first device and the second device for data transmission or power transmission, or configured to receive a media message from the first device or the second device. | 05-15-2014 |
Sung-Tien Lin, Wugu Township TW
Patent application number | Description | Published |
---|---|---|
20100130051 | AFT-LIFT ELECTRIC CONNECTOR FOR A FLEXIBLE CIRCUIT BOARD - The present invention discloses an aft-lift electric connector for a flexible circuit board. The electric connector includes a housing, a terminal and a pressing element. As a fixed arm is formed with a flange and a side edge of the pressing element is formed with a first notch and a second notch to accommodate the flange, therefore, before the electric connector operates, the first notch of the pressing element can be latched with the flange of the pushed part, so as to achieve a pre-operational positioning effect. On the other hand, after the electric connector has operated, the second notch of the pressing element can be latched with the flange of the pushed part, so as to achieve a post-operational positioning effect, allowing a user to verify that the electric connector has accomplished the pre-determined pushing operation. | 05-27-2010 |
20120045949 | ELECTRICAL CONTACT - The present invention is to provide an electrical contact, including first and second contact arms being spaced apart from each other in a vertical relation and having a contact portion, respectively, a soldering arm connected with the second contact arm, a driven arm connected with the first contact arm, and a support arm disposed between and connecting the first and second contact arms and the soldering and driven arms, wherein the contact portions of the first and second contact arms are disposed in different alignment with each other so as to clamp a flexible circuit board securely. | 02-23-2012 |
Ting Keng Lin, Wugu Township TW
Patent application number | Description | Published |
---|---|---|
20080198532 | Solid capacitor and manufacturing method thereof - A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor. | 08-21-2008 |
20080198533 | Solid capacitor and manufacturing method thereof - A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor. | 08-21-2008 |
20080198534 | Solid capacitor and manufacturing method thereof - A solid capacitor and the manufacturing method thereof are disclosed. The solid capacitor consists of a dielectric layer and two electrodes. A plurality of holes formed by an opening process is disposed on surface of the dielectric layer. The two electrodes connect with the dielectric layer by the holes. By means of a plurality of high temperature volatile matters, the plurality of holes is formed on surface of the dielectric layer during sintered process. The holes are connected with the outside so as to increase surface area of the dielectric layer and further the capacity is increased. And the solid capacitor stores charge by physical means. Moreover, the solid capacitor can be stacked repeatedly to become a multilayer capacitor. | 08-21-2008 |