Patent application number | Description | Published |
20080206530 | METHOD OF FORMING LOW-RESISTANCE METAL PATTERN, PATTERNED METAL STRUCTURE, AND DISPLAY DEVICES USING THE SAME - Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same. | 08-28-2008 |
20080223253 | ELECTROLESS COPPER PLATING SOLUTION, METHOD OF PRODUCING THE SAME AND ELECTROLESS COPPER PLATING METHOD - Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) thereof is about 11.5 to about 13.0, a method of producing the same, and an electroless copper plating method. According to the plating solution of the present invention, an electroless copper plating film having stable and improved adhesivity and low electrical resistance can be obtained. Further, display devices including a metal pattern formed with the electroless copper plating solution can improve the reliability and price competitiveness of products prepared therefrom. | 09-18-2008 |
20080268280 | METHOD OF PREPARING LOW RESISTANCE METAL LINE, PATTERNED METAL LINE STRUCTURE, AND DISPLAY DEVICE USING THE SAME - Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same. | 10-30-2008 |
20080314628 | METHOD OF FORMING METAL PATTERN, PATTERNED METAL STRUCTURE, AND THIN FILM TRANSISTOR-LIQUID CRYSTAL DISPLAYS USING THE SAME - Disclosed is a method of forming a metal pattern, the method comprising depositing a dielectric substrate on a supporting substrate; forming a latent mask pattern of a metal pattern on the dielectric substrate; etching the dielectric substrate exposed by the latent mask pattern; forming a seed layer on the supporting substrate by activating the supporting substrate; removing the latent mask pattern and the portion of the seed layer disposed on the latent mask pattern through a lift-off process; and plating a metal layer on the patterned seed layer. | 12-25-2008 |
20090117333 | METHOD OF MANUFACTURING DISPLAY DEVICE AND DISPLAY DEVICE THEREFROM - A method of manufacturing a display device includes: forming an auxiliary layer including at least one of metal and a metal oxide on an insulating substrate; forming a photoresist layer pattern partially exposing the auxiliary layer on the auxiliary layer; forming a trench on the insulating substrate by etching the exposed auxiliary layer and the insulating substrate under the exposed auxiliary layer; forming a seed layer including a first seed layer disposed on the photoresist layer pattern and a second seed layer disposed in the trench; removing the photoresist layer pattern and the first seed layer by lifting off the photoresist layer pattern; removing the auxiliary layer remaining on the insulating substrate after lifting off the photoresist layer pattern; and forming a main wiring layer on the second seed layer by electroless plating. | 05-07-2009 |
20090263197 | An extended head pile with inside and outside reinforcement - Disclosed herein is a head-extended pile with inside and outside reinforcements for supporting load of a structure. The head-extended pile includes a reinforcement part with the same length or area extending right and left with respect to a diameter of the pile provided at the front end of the pile so that a supporting force of the pile is increased, and a durability of the pile is improved by hammering after drilled piling. When the head-extended pile is applied according to the present invention, it improves the stability of proof stress of the pile and construction workability, and better economic efficiency is expected. | 10-22-2009 |
20100230679 | CONTACT PORTION OF WIRE AND MANUFACTURING METHOD THEREOF - A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut. | 09-16-2010 |
20100270552 | THIN FILM TRANSISTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A protrusion of dry-etched pattern of a thin film transistor substrate generated due to a difference between isotropy of wet etching and anisotropy of dry etching is removed by forming a plating part on a surface of the wet etched pattern through an electroless plating method. If the plating part is formed on a data pattern layer of the substrate, the width or the thickness of the data pattern layer may be increased without loss of aperture ratio, the channel length of the semiconductor layer may be reduced under the limit according to the stepper resolution and the protrusion part of the semiconductor layer may be removed. As a result, the aperture ratio may be increased, the resistance may be reduced, and the driving margin may be increased due to rising of the ion current. Furthermore, the so-called water-fall noise phenomenon may be eliminated. | 10-28-2010 |
20110051057 | LIQUID CRYSTAL DISPLAY AND MANUFACTURING METHOD THEREOF - The present invention relates to a liquid crystal display, wherein arrangement of liquid crystal molecules thereof is controlled by using a monomer that is polymerized by ultraviolet rays to provide a pre-tilt. To prevent damage to organic material layers when irradiating ultraviolet rays to the monomer, a blocking film made of an ultraviolet absorbing agent is formed on or over at least one such layer. | 03-03-2011 |
20110168669 | METHOD OF PREPARING LOW RESISTANCE METAL LINE, PATTERNED METAL LINE STRUCTURE, AND DISPLAY DEVICE USING THE SAME - Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same. | 07-14-2011 |
20130025503 | ANTI-FINGERPRINT COATING COMPOSITION AND FILM USING THE SAME - Disclosed herein is an anti-fingerprint coating composition, a coating composition for forming thin films that prevents fingerprints adhered to displays or touch panels from being remarkably visible and exhibits superior durability and slip properties, and a method for preparing the same. | 01-31-2013 |
20130121890 | PHOTOCATALYST-CONTAINING FILTER MATERIAL, AND PHOTOCATALYST FILTER INCLUDING THE FILTER MATERIAL - A filter material containing a photocatalyst that has both adsorption and decomposition functions is disclosed. A filter employing the filter material is also disclosed. | 05-16-2013 |
20130143017 | COATING STRUCTURE AND METHOD FOR FORMING THE SAME - A coating structure and a method for forming the same where, by forming an aluminum oxide layer and a silicon dioxide layer between a product to be coated and a coating layer, durability, reliability and anti-corrosion of the coating layer can be improved and furthermore, product yield can also be improved. The coating structure formed on the surface of a product includes an aluminum oxide (Al | 06-06-2013 |
20130299450 | METHOD OF FORMING LOW-RESISTANCE METAL PATTERN, PATTERNED METAL STRUCTURE, AND DISPLAY DEVICES USING THE SAME - Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same. | 11-14-2013 |