Patent application number | Description | Published |
20090034928 | Optical waveguide film, optical substrate, and methods for manufacturing the same - An optical waveguide film includes a clad layer having an adhesive function; and a core layer covered by the clad layer. | 02-05-2009 |
20090041416 | Optical waveguide film and manufacturing method thereof - An optical waveguide film includes a film including a clad layer and a core layer covered by the clad layer; an adhesive layer formed on at least one surface of the film; and a plurality of projection portions formed on a surface of the adhesive layer and arranged at spaced intervals to one another. | 02-12-2009 |
20090067798 | Optical waveguide film and manufacturing method thereof - An optical waveguide film includes a film including a clad layer and a core layer covered by the clad layer; and an adhesive layer formed at least on one surface of the film, having a rough structured surface having an arithmetic mean surface roughness of 0.1 to 2.0 μm, and having a storage modulus at 25° C. of 10 to 100 MPa obtained by dynamic viscoelastic measurement in torsion mode with a frequency of 1 Hz. | 03-12-2009 |
20090116799 | MANUFACTURING METHOD OF OPTICAL WAVEGUIDE DEVICE AND OPTICAL WAVEGUIDE DEVICE OBTAINED THEREBY - A manufacturing method of an optical waveguide device which is capable of easily and precisely aligning the optical axis of a light receiving and emitting element and the optical axis of an optical waveguide and capable of shortening manufacturing time, and to provide an optical waveguide device obtained thereby. An under cladding layer | 05-07-2009 |
20090127577 | OPTICAL WAVEGUIDE DEVICE PRODUCTION METHOD, OPTICAL WAVEGUIDE DEVICE PRODUCED BY THE METHOD, AND OPTICAL WAVEGUIDE CONNECTION STRUCTURE TO BE USED FOR THE DEVICE - An optical waveguide device production method which ensures that a receptacle structure can be easily and highly accurately produced in a single step, an optical waveguide device produced by the method, and an optical waveguide connection structure to be used for the optical waveguide device. The optical waveguide device includes a light emitting element ( | 05-21-2009 |
20100129036 | OPTO-ELECTRIC HYBRID BOARD AND MANUFACTURING METHOD THEREOF - An opto-electric hybrid board which includes an optical waveguide portion | 05-27-2010 |
20100209054 | OPTO-ELECTRIC HYBRID MODULE AND METHOD OF MANUFACTURING THE SAME - An opto-electric hybrid module capable of achieving the reduction in distance between an optical element and a core end portion to improve the efficiency of light coupling therebetween, and a method of manufacturing the same are provided. The opto-electric hybrid module includes an optical waveguide section, an electric circuit section, and a light-emitting element ( | 08-19-2010 |
20100254666 | MANUFACTURING METHOD OF OPTO-ELECTRIC HYBRID MODULE AND OPTO-ELECTRIC HYBRID MODULE OBTAINED THEREBY - A manufacturing method of an opto-electric hybrid module which is capable of suppressing losses in cost, and an opto-electric hybrid module obtained thereby. An optical waveguide portion W | 10-07-2010 |
20110005677 | Optical waveguide film, optical substrate, and methods for manufacturing the same - An optical waveguide film includes a clad layer having an adhesive function; and a core layer covered by the clad layer. | 01-13-2011 |
20110008010 | Optical waveguide film, optical substrate, and methods for manufacturing the same - An optical waveguide film includes a clad layer having an adhesive function; and a core layer covered by the clad layer. | 01-13-2011 |
20110026873 | MANUFACTURING METHOD OF OPTICAL SENSOR MODULE AND OPTICAL SENSOR MODULE OBTAINED THEREBY - A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide section and an optical element in a substrate section, and an optical sensor module obtained thereby. An optical waveguide section W | 02-03-2011 |
20110064354 | OPTO-ELECTRIC HYBRID MODULE AND METHOD OF MANUFACTURING THE SAME - An opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide section, and a method of manufacturing the same. A recessed portion ( | 03-17-2011 |
20110085758 | METHOD OF MANUFACTURING OPTICAL SENSOR MODULE AND OPTICAL SENSOR MODULE OBTAINED THEREBY - A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide section and an optical element in a substrate section and which achieves improvement in alignment accuracy and reduction in costs, and an optical sensor module obtained thereby. An optical waveguide section W | 04-14-2011 |
20110135250 | MANUFACTURING METHOD OF OPTO-ELECTRIC HYBRID MODULE AND OPTO-ELECTRIC HYBRID MODULE OBTAINED THEREBY - A manufacturing method of an opto-electric hybrid module which is capable of suppressing losses in cost, and an opto-electric hybrid module obtained thereby. An optical waveguide portion W | 06-09-2011 |
20110216995 | METHOD OF MANUFACTURING OPTICAL SENSOR MODULE AND OPTICAL SENSOR MODULE OBTAINED THEREBY - A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide unit and an optical element in a substrate unit and which does not reduce the accuracy of alignment, and an optical sensor module obtained thereby. An optical waveguide unit including protruding portions having vertical walls with a height less than 50 μm and groove portions, and a substrate unit including positioning members of respective positioning plate portions to be positioned in the protruding portions and fitting plate portions for fitting engagement with the groove portions are individually produced. Corners of the positioning members are positioned on the vertical walls of the protruding portions, and the fitting plate portions are brought into fitting engagement with the groove portions whereby the substrate unit and the optical waveguide unit are integrated together. | 09-08-2011 |
20120027338 | OPTICAL SENSOR MODULE - An optical sensor module is provided which reduces variations in optical coupling loss between a core in an optical waveguide unit and an optical element in a substrate unit and which reduces the optical coupling loss. The optical waveguide unit including vertical groove portions for fitting engagement with the substrate unit and the substrate unit including fitting plate portions for fitting engagement with the vertical groove portions are produced individually. The fitting plate portions in the substrate unit are brought into fitting engagement with the vertical groove portions in the optical waveguide unit, so that the substrate unit and the optical waveguide unit are integrated together. The vertical groove portions in the optical waveguide unit are in an appropriate position relative to a light-transmissive surface of the core. The fitting plate portions in the substrate unit are in an appropriate position relative to the optical element. | 02-02-2012 |
20140132466 | ANTENNA MODULE - A dielectric film has a main surface and a back surface and is formed of resin. Electrodes that can receive or transmit an electromagnetic wave having a frequency of not less than 0.05 THz and not more than 10 THz in the terahertz band are formed on the main surface of the dielectric film. The electrodes constitute a tapered slot antenna. The dielectric film and the electrodes are formed of a flexible printed circuit board. A semiconductor device that is operable at a frequency in the terahertz band is mounted on the main surface of the dielectric film so as to be electrically connected to the electrodes. | 05-15-2014 |
20140203994 | ANTENNA MODULE AND METHOD FOR MANUFACTURING THE SAME - An antenna module includes a support body and an antenna body. The support body has a flat support surface and a support surface that extends obliquely upward from one side of the support surface. The antenna body is attached to the support surface while being bent along the support surface of the support body. The antenna body is constituted by a dielectric film, a pair of electrodes and a semiconductor device. The pair of electrodes is formed on a main surface of the dielectric film, and the semiconductor device is mounted on the end of the electrode. | 07-24-2014 |