Wei-Che
Wei-Che Chang, Chung Ho City TW
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20090116667 | Method and Apparatus for Volume Adjustment - A method and an apparatus for adjusting volume are provided. A determining module receives a sound input signal, wherein the sound input signal is connected to a plurality of sound input sources and corresponds to one of the said sound input sources, the determining module further determines the corresponding sound input source of the sound input signal is different; a storing module stores a plurality of sound output records; a first calculating module calculates a sound output signal according to the sound input signal and the sound output records. | 05-07-2009 |
Wei-Che Chang, Taichung TW
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20150179517 | SEMICONDUCTOR SUBSTRATE AND FABRICATION METHOD THEREOF - A method for fabricating a semiconductor substrate is disclosed, which includes: forming a first dielectric layer on a substrate body; forming a plurality of first vias penetrating the first dielectric layer to expose portions of the substrate body; forming a second dielectric layer on the first dielectric layer and the exposed portions of the substrate body, wherein the second dielectric layer extends on walls of the first vias; etching the second dielectric layer to form a plurality of openings communicating with the first vias and form a plurality of second vias penetrating the second dielectric layer in the first vias so as to expose portions of the substrate body, leaving the second dielectric layer on the walls of the first vias; and forming a circuit layer in the openings, and forming a plurality of conductive vias in the second vias for electrically connecting the circuit layer and the substrate body. | 06-25-2015 |
Wei-Che Chang, Taichung City TW
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20130157454 | SELF-ALIGNED WET ETCHING PROCESS - A self-aligned wet etching process comprises the steps of: etching a substrate having an etch protection layer on a surface thereof to form a plurality of trenches spaced from each other; and sequentially forming an insulating layer, an etch stop layer and a primary insulator in each trench, wherein the primary insulator is filled inside an accommodation space surrounded by the etch stop layer. During the wet etching process, the etch stop layer protects the primary insulator from being etched, whereby is achieved anisotropic wet etching. Further, the present invention expands the contact areas for electrically connecting with external circuits and exempts the electric contactors formed on the contact areas from short circuit caused by excessively etching the primary insulators. | 06-20-2013 |
20130193511 | VERTICAL TRANSISTOR STRUCTURE - A vertical transistor structure comprises a substrate, a plurality of pillars formed on the substrate and spaced from each other, a plurality of trenches each formed between two adjacent pillars, a protection layer formed on the surface of a first side wall and the surface of a second side wall of the trench, a first gate and a second gate respectively formed on the protection layer of the first side wall and the second side wall, and a separation layer covering a bottom wall of the trench. The present invention uses the separation layer functioning as an etch stopping layer to the first gate and the second gate while being etched. Further, thickness of the separation layer is used to control the distance between the bottom wall and the first and second gates and define widths of the drain and the source formed in the pillar via ion implantation. | 08-01-2013 |
20130234230 | Semiconductor Device and Method for Making the Same - A semiconductor device includes: a substrate having a base and an array of semiconductor pillars extending from the base, the substrate being formed with a plurality of trenches, each of which extends into the base and has two opposing trench side walls; a first insulative liner layer formed on each of the trench side walls of each of the trenches and divided into upper and lower segments by a gap that leaves a bit-forming surface of each of the trench side walls uncovered by the first insulative liner layer; and a plurality of buried bit lines, each of which extends into the base from the bit-forming surface of a respective one of the trench side walls of each of the trenches. | 09-12-2013 |
Wei-Che Chang, Taipei City TW
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20150245334 | METHOD AND APPARATUS FOR DEVICE TO DEVICE SERVICE IN A WIRELESS COMMUNICATION SYSTEM - Methods and apparatuses for supporting device to device (D2D) communication are disclosed herein. One method includes monitoring, by a first UE, a scheduling assignment (SA) resource pool. The method also includes transmitting, by the first UE, a first SA in a first SA resource. The method further includes finding, by the first UE, unused SA resources in the SA resource pool. The method also includes transmitting, by the first UE, an extra SA in a second SA resource, wherein the second SA resource is within the unused SA resources. | 08-27-2015 |
20150334715 | METHOD AND APPARATUS FOR SUPPORTING FOR DEVICE-TO-DEVICE (D2D) SERVICES IN A WIRELESS COMMUNICATION SYSTEM - A method and apparatus are disclosed for supporting D2D (Device-to-Device) services in a wireless communication system, wherein a first user equipment (UE) and a second user equipment are capable of D2D communication and are served by an evolved Node B (eNB). The method includes the first UE transmitting a SA (Scheduling Assignment) and a data to the second UE. The method also includes the first UE transmitting a D2D power control information to the second UE. | 11-19-2015 |
20150334735 | METHOD AND APPARATUS FOR SUPPORTING FOR DEVICE-TO-DEVICE (D2D) COMMUNICATION IN A WIRELESS COMMUNICATION SYSTEM - A method and apparatus are disclosed for supporting D2D (Device-to-Device) communication in a wireless communication system, wherein a first user equipment (UE) and a second user equipment are capable of D2D communication and are served by an evolved Node B (eNB). The method includes the second UE transmitting a first Scheduling Assignment (SA) and a first data to the first UE. The method also includes the second UE receiving a Hybrid Automatic Repeat Request Acknowledgement (HARQ-ACK) and a D2D power control information from first UE. The method further includes the second UE transmits a second SA and a second data to the first UE, wherein the second UE adjusts a transmission power of the second SA and the second data based on the D2D power control information received from the first UE. | 11-19-2015 |
20160073382 | METHOD AND APPARATUS FOR IMPROVING DOWNLINK CONTROL INFORMATION (DCI) IN A WIRELESS COMMUNICATION SYSTEM - A method and apparatus are disclosed for improving downlink control information in a wireless communication system. In one embodiment, the method includes receiving a first control signaling indicating a first transmission to a first UE, wherein the first control signaling is identified by a first identification used by the first UE. The method also includes receiving a second control signaling indicating a second transmission to a second UE, wherein the second control signaling is identified by a second identification used by the second UE. The method further includes decoding the first transmission based on information provided by at least the first control signaling and the second control signaling, wherein radio resource used by the first transmission is indicated by the second control signaling but is not indicated by the first control signaling. | 03-10-2016 |
Wei-Che Chen, New Taipei TW
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20160137140 | HOLDER FOR MOBILE DEVICE AND VEHICLE SEAT EMPLOYING SAME - A holder for mobile device includes a holding structure and a mounting structure. The holding structure includes a holding member and a supporting member coupled to the holding member. The holding member is configured to hold the mobile device. The mounting structure includes a mounting structure, a latching assembly and a sliding support coupled to the latching assembly. The mounting structure defines a compartment. The sliding support is slidably engaged with in the compartment and transitionable between: an enclosed configuration in which the sliding support is received in the compartment to allow the latching assembly to be received in the compartment; and an exposed configuration in which the sliding support and the latching assembly are exposed to outside of the compartment to allow the latching assembly to detachably latch with the supporting member. | 05-19-2016 |
Wei-Che Chen, Kaohsiung City TW
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20130183801 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES - A method for manufacturing semiconductor devices includes providing a substrate having a first region and a second region defined thereon, and a shallow trench isolation (STI) formed in between the first region and the second region, the first region comprising a first gate structure and the second region comprising a second gate structure respectively formed therein; forming a patterned protecting layer covering at least the entire STI and the second region on the substrate; forming recesses not exposing the STI in the substrate respectively at two sides of the first gate structure; and forming an epitaxial layer in the recesses respectively, the epitaxial layer filling up the recesses. | 07-18-2013 |
Wei-Che Chung, Yun-Lin County TW
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20090153252 | MULTI-BAND VOLTAGE CONTROLLED OSCILLATOR CONTROLLING MODULE, PHASE LOCKED LOOP UTILIZING WHICH AND RELATED METHOD THEREOF - A multi-band VCO module includes a multi-band VCO and a controlling module. The multi-band VCO is for selecting a specific band from a plurality of bands according to a band selecting signal, and for outputting an oscillating signal according to a predetermined voltage and the specific band. The controlling module, coupled to the multi-band VCO, is for setting the band selecting signal according to a reference frequency of the reference signal and an oscillating frequency of the oscillating signal. A related method and a PLL circuit utilizing the multi-band VCO module are also disclosed. | 06-18-2009 |
Wei-Che Hsieh, Taipei TW
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20130027949 | LIGHT HARVESTING LENS MODULE - A light harvesting lens module for collecting an ambient light includes a plurality of annular lenses. The annular lenses are arranged in order from center to outside to form a disc-structure. Each annular lens has a light-input curved surface and a light-output curved surface. The light-input curved surface is in opposition to the center. The light-output curved surface is in opposition to the light-input curved surface, and faces the center. The light is incident on the light-input curved surface, and is refracted and tend to concentrate by the light-input curved surface. Then, the light is emitted from the annular lens, and is refracted to the direction of the center by the light-output curved surface. The ambient light is able to be compressed into a point light by the lens module, so as to increase the concentration ratio and the compression ratio to further get the effective advantage. | 01-31-2013 |
20140175983 | LED lamp - A lamp is provided with a full-wave rectifier for convert AC to DC; a SPD electrically connected to the full-wave rectifier for protecting the lamp from voltage spikes; series connected LEDs electrically connected to the SPD; a microprocessor electrically connected to the SPD; series connected MOSFET start circuits electrically to the microprocessor, the MOSFET start circuits configured to switch electronic signals; and resistors each electrically interconnected the LED and the MOSFET start circuit. In response to a normal DC supplied from the SPD, the microprocessor creates a PWM signal to activate the MOSFET start circuits which in turn initiate operations of the LEDs via the resistors respectively. In response to an abnormal DC having voltage spikes supplied from the SPD, the microprocessor deactivates the MOSFET start circuits which in turn direct the DC through the resistors rather than supply the DC to the LEDs via the resistors respectively. | 06-26-2014 |
Wei-Che Hsieh, New Taipei City TW
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20150191820 | INJECTOR FOR FORMING FILMS RESPECTIVELY ON A STACK OF WAFERS - An injector for forming films respectively on a stack of wafers is provided. The injector includes a plurality of hole structures. Every adjacent two of the wafers have therebetween a wafer spacing, and each of the wafers has a working surface. The hole structures respectively correspond to the respective wafer spacings. The working surface and a respective hole structure have therebetween a parallel distance. The parallel distance is larger than a half of the wafer spacing. A wafer processing apparatus and a method for forming films respectively on a stack of wafers are also provided. | 07-09-2015 |
Wei-Che Huang, Zhudong Township TW
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20130009741 | INTEGRATED CIRCUIT TRANSFORMER - The invention provides an integrated circuit transformer disposed on a substrate. The integrated circuit transformer includes a first coiled metal pattern disposed on the substrate, comprising an inner loop segment and an outer loop segment. A second coiled metal pattern is disposed on the substrate, laterally between the inner loop segment and the outer loop segment. A dielectric layer is disposed on the first coiled metal pattern and the second coiled metal pattern. A first via is formed through the dielectric layer, electrically connecting to one of the first and second coiled metal patterns. A first redistribution pattern is disposed on the dielectric layer, electrically connecting to and extending along the first via, wherein the first redistribution pattern covers at least a portion of the first coiled metal pattern and at least a portion of the second coiled metal pattern. | 01-10-2013 |
20130264676 | SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA INTERCONNECT AND METHOD FOR FABRICATING THE SAME - The invention provides a semiconductor package with a through silicon via (TSV) interconnect and a method for fabricating the same. An exemplary embodiment of the semiconductor package with a TSV interconnect includes a semiconductor substrate. A through hole is formed through the semiconductor substrate. A TSV interconnect is disposed in a through hole. A conductive layer lines a sidewall of the through hole, surrounding the TSV interconnect. | 10-10-2013 |
20130265121 | PASSIVE DEVICE CELL AND FABRICATION PROCESS THEREOF - An embodiment of the invention provides a passive device cell. The passive device cell has a substrate layer, a passive device, and an intermediary layer formed between the substrate layer and the passive device. The intermediary layer includes a plurality of LC resonators. | 10-10-2013 |
20130270670 | SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA INTERCONNECT - The invention provides a semiconductor package with a through silicon via (TSV) interconnect. An exemplary embodiment of the semiconductor package with a TSV interconnect includes a semiconductor substrate, having a front side and a back side. A contact array is disposed on the front side of the semiconductor substrate. An isolation structure is disposed in the semiconductor substrate, underlying the contact array. The TSV interconnect is formed through the semiconductor substrate, overlapping with the contact array and the isolation structure. | 10-17-2013 |
20140070346 | RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME - The invention provides a radio-frequency (RF) device package and a method for fabricating the same. An exemplary embodiment of a radio-frequency (RF) device package includes a base, wherein a radio-frequency (RF) device chip is mounted on the base. The RF device chip includes a semiconductor substrate having a front side and a back side. A radio-frequency (RF) component is disposed on the front side of the semiconductor substrate. An interconnect structure is disposed on the RF component, wherein the interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure. A through hole is formed through the semiconductor substrate from the back side of the semiconductor substrate, and is connected to the interconnect structure. A TSV structure is disposed in the through hole. | 03-13-2014 |
20150162242 | RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a electronic device package provides a electronic device chip, wherein the electronic device chip includes a semiconductor substrate having a front side and a back side, wherein the semiconductor substrate has a first thickness, an electronic component disposed on the front side of the semiconductor substrate, and an interconnect structure disposed on the electronic component. The method further performs a thinning process to remove a portion of the semiconductor substrate from the back side thereof The method then removes a portion of the thinned semiconductor substrate and a portion of a dielectric layer of the interconnect structure from a back side of the thinned semiconductor substrate until a first metal layer pattern of the interconnect structure is exposed, thereby forming a through hole. Finally, the method forms a TSV structure in the through hole, and mounts the electronic device chip on a base. | 06-11-2015 |
20150162267 | RADIO-FREQUENCY DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME - An electronic device package has a base and an electronic device chip mounted on the base. The electronic device chip includes a semiconductor substrate having a front side and a back side, a electronic component disposed on the front side of the semiconductor substrate, an interconnect structure disposed on the electronic component, a through hole formed through the semiconductor substrate from the back side of the semiconductor substrate, connecting to the interconnect structure, and a TSV structure disposed in the through hole. The interconnect structure is electrically connected to the RF component, and a thickness of the semiconductor substrate is less than that of the interconnect structure. | 06-11-2015 |
20160028359 | PASSIVE DEVICE CELL AND FABRICATION PROCESS THEREOF - An implementation of the invention is directed to a passive device cell having a substrate layer, and intermediary layer formed above the substrate layer, and a passive device formed above the intermediary layer. The intermediary layer includes a plurality of LC resonators and a plurality of segmented conductive lines, wherein the plurality of segmented conductive lines are disposed between the plurality of LC resonators. | 01-28-2016 |
20160099231 | SEMICONDUCTOR PACKAGE ASSEMBLY - The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package and a second semiconductor package stacked on the first semiconductor package. The first semiconductor package includes a first redistribution layer (RDL) structure. A first semiconductor die is coupled to the first RDL structure. A first molding compound surrounds the first semiconductor die, and is in contact with the RDL structure and the first semiconductor die. The second semiconductor package includes a second redistribution layer (RDL) structure. A first dynamic random access memory (DRAM) die without through silicon via (TSV) interconnects formed passing therethrough is coupled to the second RDL structure. | 04-07-2016 |
20160118318 | SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA INTERCONNECT - The invention provides a semiconductor package with a through silicon via (TSV) interconnect. An exemplary embodiment of the semiconductor package with a TSV interconnect includes a semiconductor substrate, having a front side and a back side. A contact array is disposed on the front side of the semiconductor substrate. An isolation structure is disposed in the semiconductor substrate, underlying the contact array. The TSV interconnect is formed through the semiconductor substrate, overlapping with the contact array and the isolation structure. | 04-28-2016 |
Wei-Che Huang, Hsinchu County TW
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20150091158 | PACKAGE STRUCTURE - A package structure, comprising: a substrate, having at least one conductive units provided at a first surface of the substrate; at least one first die, provided on a second surface of the substrate; a connecting layer; a second die, provided on the connecting layer, wherein the connecting layer comprises at least one bump for connecting the first die to the second die such that the first die and the second die are electrically connected; and at least one bonding wire, for electrically connecting the first die to the conductive units or the substrate. | 04-02-2015 |
20150364549 | SEMICONDUCTOR DEVICE WITH SILICON CARBIDE EMBEDDED DUMMY PATTERN - A semiconductor device with dummy patterns for alleviating micro-loading effect includes a semiconductor substrate having thereon a middle annular region between an inner region and an outer region; a SiC device on the semiconductor substrate within the inner region; and a plurality of dummy patterns provided on the semiconductor substrate within the middle annular region. At least one of the dummy patterns contains SiC. | 12-17-2015 |
Wei-Che Hung, Tahsi TW
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20100213641 | Method for Manufacturing a Material with a Multispectral Smoke Screening - A method for manufacturing a material with a multispectral smoke screening, that is, to mix the composite materials of carbon fiber and graphite, carbon fiber and bamboo-charcoal, carbon fiber and carbon black respectively with epoxy resin to produce an absorbing film which dimensions are 15 cm×15 cm×0.2 cm and can absorbs millimeter-wave (8 mm) and infrared wave (3-5 and 8-12 μm). The film can be a smoke material of the M56 turbo smoke generator to resist the millimeter-wave and infrared wave. | 08-26-2010 |
Wei-Che Hung, Tauyan TW
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20080239209 | Polarizer-and-compensator assembly and method for makeing the same - A method for making a polarizer-and-compensator assembly includes: (a) forming an alignment film on a releasable substrate; (b) forming a liquid crystal film on the alignment film so as to form a compensator layer on the releasable substrate; and (c) transferring the compensator layer from the releasable substrate to a polarizer plate by removing the releasable substrate from the compensator layer and attaching the alignment film to the polarizer plate. | 10-02-2008 |
Wei-Che Hung, Zhongli City TW
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20130107190 | Method of Preparing Composite Optical Retarder | 05-02-2013 |
20140020824 | Method of Annealing Liquid Crystal - A method for annealing liquid crystal is provided. First, a substrate having a liquid crystal layer thereon is provided, and a lens structure is disposed between the substrate and a contact surface of the liquid crystal layer. The liquid crystal layer fills and levels up the lens structure, and it has a thickness difference between the thickest portion and the thinnest portion in a range of 10 to 150 μm. An infrared light-absorbing layer having transmittance of infrared light in a range of 5 to 70% is covered on the liquid crystal layer. Infrared light is irradiated to the infrared light-absorbing layer to anneal the liquid crystal. | 01-23-2014 |
20150309233 | RETARDATION FILM AND FABRICATION METHOD THEREOF - A method of fabricating a retardation film and a retardation film is provided. In the method, a primary transparent substrate is provided, and a liquid crystal aligning layer is formed over the primary transparent substrate, in which the liquid crystal aligning layer includes a first liquid crystal alignment region and a second liquid crystal alignment region interlacing with each other. A plurality of opacifier stripes are printed on a secondly transparent substrate, which the opacifier stripes are aligned with the interface between the first and second liquid crystal alignment regions. An adhesive layer is coated over the surface of the secondly transparent substrate and surfaces of the opacifier stripes. Further, the adhesive layer is bonded to the liquid crystal aligning layer, and then the liquid crystal aligning layer is separated from the primary transparent substrate. | 10-29-2015 |
20150323719 | PATTERNED RETARDER - A patterned retarder is provided. A microstructure layer is disposed on a substrate of the optical retarder. The microstructure layer has a plurality of trapezoid protrusions. A bottom angel of the trapezoid protrusions is 12-85 degree. A conformal alignment layer and a liquid crystal phase retarder layer are sequentially disposed on the microstructure layer. | 11-12-2015 |
Wei-Che Kao, Changhua TW
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20100073763 | Adjustable optical signal delay module and method thereof - The present invention relates to an adjustable optical signal delay module, particularly to a module, which adjusts power of an amplified spontaneous emission generated by a semiconductor optical amplifier and reversely feeds the adjusted amplified spontaneous emission back to the semiconductor optical amplifier to vary a group refractive index of the semiconductor optical amplifier and delay the timing of an optical signal, whereby the present invention can replace the pump laser conventionally required by a CPO mechanism. In the present invention, the feedback optical loop comprises a variable optical attenuator, an optical filter, and optical circulators. An user can control the delay timing of optical signals via adjusting optical power in the feedback optical loop. The present invention can decrease the fabrication cost of an optical signal delay module and reduce the volume thereof. | 03-25-2010 |
Wei-Che Lai, Taipei City TW
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20150263667 | SUNLIGHT-COLLECTING SYSTEM - A sunlight-collecting system is disclosed, which includes a plurality of lenses changing the angle of an incident sunlight, a wedged light guide plate (LGP) receiving the incident sunlight passing through a lens of the plurality of lenses and a holder fixing the lens of the plurality of lenses at a desired position corresponding the LGP. The structures, materials and desired positions of the lens and LGP make the incident sunlight passing through the lens and then going into the LGP perform total internal reflection (TIR) transmission in the LGP and then concentrate at one end of the LGP. The present sunlight-collecting system changes the corresponding lens to the desired position to keep the above TIR transmission condition, depending on the initial angle of the incident sunlight. In other words, the present sunlight-collecting system collects sunlight by changing corresponding lens instead of using sunlight tracking methods. | 09-17-2015 |
20150268390 | OPTICAL FILM HAVING MICROSTRUCTURE LAYER ON BOTH SIDES - An optical film having a microstructure layer on both sides comprises a transparent substrate, a first microstructure layer, and a second microstructure layer. The transparent substrate has a first optical surface and a second optical surface opposite the first optical surface. The first microstructure layer is located on the first optical surface, and comprises a plurality of cylindrical structures. Each of the cylindrical structures has a curved surface. The second microstructure layer is located on the second optical surface, and comprises a plurality of prism structures. Each of the prism structures has a first surface to perpendicular to the transparent substrate and a second surface having a reflection center, which aligns with one of the corresponding cylindrical structures. | 09-24-2015 |
Wei-Che Wu, Hsinchu TW
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20100072497 | LIGHT EMITTING DIODE CHIP - A light emitting diode chip includes a permanent substrate having a holding space formed on the permanent substrate; an insulating layer and a metal layer sequentially formed on the permanent substrate and the holding spacer; a die having a eutectic layer and a light-emitting region and bonded to the metal layer within the holding space via the eutectic layer coupling to the metal layer; a filler structure filled between the holding space and the die; and an electrode formed on the die and in contact with the light-emitting region. | 03-25-2010 |
20120322180 | LIGHT EMITTING DIODE AND MANUFACTURING METHOD OF THE SAME - A light emitting diode comprises a permanent substrate having a chip holding space formed on a first surface of the permanent substrate; an insulating layer and a metal layer sequentially formed on the first surface of the permanent substrate and the chip holding space, wherein the metal layer comprises a first area and a second area not being contacted to each other; a chip having a first surface attached on a bottom of the chip holding space, contacted to the first area of the metal layer; a filler structure filled between the chip holding space and the chip; and a first electrode formed on a second surface of the chip. The chip comprises a light-emitting region and an electrical connection between the first area of the metal layer and the light emitting region is realized by using a chip-bonding technology. | 12-20-2012 |
Wei-Che Yeh, Miaoli County TW
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20130264033 | HEAT DISSIPATION MODULE - A heat dissipation module includes a centrifugal fan and a heat pipe. The centrifugal fan includes at least one axial air inlet and a radial air outlet, wherein an air channel sidewall of the centrifugal fan has heat dissipation fins in an inner wall thereof. The heat pipe has a heat source contact section and a heat dissipation section, the heat dissipation section is in contact with an outer wall of the air channel sidewall, and the heat source contact section is in contact with a heat source. | 10-10-2013 |
Wei-Che Yeh, Miaoli City TW
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20150277519 | ELECTRICAL DEVICE HAVING THERMAL ISOLATION FUNCTION - An electrical device having thermal isolation function includes a housing, a heat-generating source, a heat-conductive member, and a thermal isolation plate. The housing includes an accommodation space therein, an inner surface and an outer surface which is opposite to the inner surface. The heat-generating source is disposed in the accommodation space. The heat-conductive member is disposed in the accommodation space, and is in contact with the heat-generating source. The thermal isolation plate is disposed between the heat-conductive member and the inner surface of the housing, and the thermal isolation plate is formed with a vacuum camber therein. | 10-01-2015 |
Wei-Che Yu, New Taipei City, TW
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20150027321 | BARBECUE SPIT WITH TEMPERATURE PROBE - The present invention is to provide a barbecue spit equipped with a probe, which includes a rod configured to pierce a food and connected to a power device of an electric barbecue apparatus so that the rod can be driven to rotate by the power device, a temperature setting device provided adjacent to one end of the rod and including a control module and an alert module, a conductive wire provided in the rod and having one end electrically connected to the setting device, and a probe having one end to be inserted into the food and an opposite end electrically connected to the other end of the conductive wire. Thus, when the food temperature measured by the probe reaches a predetermined temperature, the control module drives the alert module to generate an alert signal (e.g., a continuous sound), thereby informing the user of the roasted state of the food. | 01-29-2015 |