Patent application number | Description | Published |
20080218258 | DIGITAL ISOLATOR - A signal isolator comprises an isolation barrier, a transmitter, a differentiator, and a recovery circuit. The transmitter is coupled to a first side of the isolation barrier and is configured to receive and convert an information signal to a differential signal that encodes information in the information signal in a single transition edge. The differentiator is coupled to a second side that is isolated from the first side of the isolation harrier and differentiates the differential signal. The recovery circuit is coupled to the differentiator and operates to recover an output information signal based on the information in the single transition edge. | 09-11-2008 |
20080267212 | Isolated Ethernet Physical Layer (PHY) - A network device comprises an Ethernet physical layer (PHY) comprising an isolation, protection, and electromagnetic interference suppression barrier operative for isolated power and data transfer. | 10-30-2008 |
20080279288 | Digital Isolator Interface with Process Tracking - An interface comprises a converter configured to track process characteristics across an isolation barrier and modify amplitude of a fast differential edge modulation as a function of speed of an active device on a transmitting side of the isolation barrier, and a differentiator configured to differentiate the fast differential edge modulation on a receiving side of the isolation barrier whereby differentiation bandwidth tracks slope rate of the differential edge modulation. | 11-13-2008 |
20080290444 | CAPACITOR STRUCTURE IN A SEMICONDUCTOR DEVICE - A semiconductor device comprises an integrated circuit formed on a substrate with a signal interface and at least one isolator capacitor. The integrated circuit comprises a plurality of interleaved inter-metal dielectric layers and interlayer dielectrics formed on the substrate, a thick passivation layer formed on the plurality of the interleaved inter-metal dielectric layers and interlayer dielectrics, and a thick metal layer formed on the thick passivation layer. The thick passivation layer has a thickness selected to be greater than the isolation thickness whereby testing for defects is eliminated. The one or more isolator capacitors comprise the thick metal layer and a metal layer in the plurality of interleaved inter-metal dielectric layers and interlayer dielectrics separated by the thick passivation layer as an insulator. | 11-27-2008 |
20090201115 | INDUCTANCE ELEMENT IN AN INTEGRATED CIRCUIT PACKAGE - An electronic circuit in an integrated circuit package comprises an inductance element. The inductance element further comprises a plurality of separated metal strips formed on a substrate and a ferrite core coupled to the substrate. The metal strip plurality is formed between the substrate and the ferrite core. The inductance element further comprises a plurality of wires coupled to the separated metal strips whereby the metal strips and wires form a continuous coil. The ferrite core is interposed between the metal strip plurality and the wire plurality. | 08-13-2009 |
20090207538 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT - A network device comprises an interface coupling an electronic device to a differential pair of signal lines, and an integrated active common mode suppression and electrostatic discharge protection circuit coupled to the interface in parallel to differential signal lines of the electronic device. First and second resistors are respectively coupled to the differential lines between the integrated active common mode suppression and electrostatic discharge protection circuit and the electronic device. | 08-20-2009 |
20090327766 | Power Over Ethernet Reclassification - A power over Ethernet (PoE) system has a reclassification functionality. The illustrative PoE system comprises a powered device (PD) and a power sourcing equipment (PSE) communicatively coupled to the PD. A classification identification component coupled to the PD encodes a classification value. A classification identification component can typically be implemented as a classification resistor, although any other suitable component such as a capacitor, inductor, register, or other structure or method can otherwise be implemented. The PoE system can further comprise a reclassification register in a non-volatile memory that stores a value indicative of a new classification state and a new classification identifier and a power switch that powers the powered device to a classification voltage. A PD controller is coupled to the powered device that reads the value indicative of the new classification state and, if the new classification state is asserted, reads the new classification identifier and sets classification according to the new classification identifier. If the new classification state is not asserted, the PD controller sets classification according to the classification identification component. | 12-31-2009 |
20100054001 | AC/DC Converter with Power Factor Correction - A power converter is configured for usage in a power factor correction system. The power converter comprises a transformer with a primary winding and a secondary winding which isolates a primary side from a secondary side. A primary side switch is coupled to the primary winding. An isolator coupled to the primary side switch isolates the primary side from the secondary side and comprises a signal pathway passing a digital signal from the primary side to the secondary side. Power factor correction circuitry is coupled to the primary side switch and adjusts electric load characteristics to improve power factor toward unity. | 03-04-2010 |
20100193907 | CAPACITOR STRUCTURE IN A SEMICONDUCTOR DEVICE - A semiconductor device comprises an integrated circuit formed on a substrate with a signal interface and at least one isolator capacitor. The integrated circuit comprises a plurality of interleaved inter-metal dielectric layers and interlayer dielectrics formed on the substrate, a thick passivation layer formed on the plurality of the interleaved inter-metal dielectric layers and interlayer dielectrics, and a thick metal layer formed on the thick passivation layer. The thick passivation layer has a thickness selected to be greater than the isolation thickness whereby testing for defects is eliminated. The one or more isolator capacitors comprise the thick metal layer and a metal layer in the plurality of interleaved inter-metal dielectric layers and interlayer dielectrics separated by the thick passivation layer as an insulator. | 08-05-2010 |
20110026655 | FREQUENCY MODULATION OF CLOCKS FOR EMI REDUCTION - In an electronic system, a frequency modulator manages clock signals for electromagnetic interference (EMI) reduction. The illustrative frequency modulator comprises a core oscillator, and a clock divider coupled to the core oscillator that modulates frequency of the core oscillator and deterministically spreads clock spectral components of a digital clock signal whereby electromagnetic interference (EMI) is reduced. The frequency modulator further comprises a circuit coupled to the clock divider that receives the digital clock signal, combines the digital clock signal with a data bitstream for transmission across an isolation barrier, and resynchronizes to the digital clock signal. | 02-03-2011 |