Patent application number | Description | Published |
20080198511 | Suspension for a hard disk drive microactuator - A disk drive flexure is provided. The disk drive flexure includes a first surface for coupling with a microactuator, the microactuator comprising a moving portion and a stationary portion wherein the moving portion and the stationary portion are integrated within a substrate and wherein the stationary portion is coupled to the first surface by an adhesive. The disk drive flexure further includes a spacer portion for maintaining a distance between the microactuator and the flexure such that the moving portion does not contact the flexure and wherein the spacer portion prevents the adhesive from contacting the moving portion of the microactuator. | 08-21-2008 |
20090039505 | Thermally insulating bonding pad structure for solder reflow connection - A thermally insulating bonding pad for solder reflow is described. The bonding pad includes a structure. The structure forms the bonding pad. The bonding pad further includes an insulator formed on the structure. The insulator is configured to be interposed between the structure and a substrate of a component onto which said bonding pad is to be disposed. The bonding pad provides thermal insulation for said substrate when said bonding pad is subject to a solder reflow process being performed thereon. | 02-12-2009 |
20090080116 | Microactuator,head gimbal assembly, and magnetic disk drive - Embodiments of the present invention help to suppress reduction of the operation quantity of a microactuator. According to one embodiment, a microactuator comprises a silicon substrate and a piezoelectric element. The silicon substrate has some rigidity and provides elastic counter force to the piezoelectric element. In the piezoelectric element a secondary piezoelectric layer is laminated on a primary piezoelectric layer opposite from the silicon substrate. The contraction force of the secondary piezoelectric layer acts on the primary piezoelectric layer so that it bends toward the secondary piezoelectric layer opposite from the silicon substrate. When the primary piezoelectric layer expands, the contraction force of the secondary piezoelectric layer acts on the primary piezoelectric layer so that it warps against the primary piezoelectric layer. | 03-26-2009 |
20090128950 | High aspect ratio motion limiter of a microactuator and method for fabrication - A high-aspect ratio motion limiter of a microactuator and a method for fabrication are disclosed. In one embodiment, at least one low-aspect ratio gap is created in a substrate of a microactuator of a hard disk drive. The low-aspect ratio gap is then utilized to facilitate the creation of a high-aspect ratio motion limiter in the substrate of the microactuator. | 05-21-2009 |
20090135523 | MICROACTUATOR, HEAD GIMBAL ASSEMBLY, AND DISK DRIVE DEVICE - Embodiments of the present invention relate to approaches to effectively let noise on a head slider bonded to a silicon substrate of a microactuator, escape to the ground. A head gimbal assembly (HGA) according to an embodiment of the present invention comprises a microactuator bonded to a gimbal tongue. The microactuator comprises a piezoelectric element and a movable part for moving in response to expansion or contraction of the piezoelectric element. The motion of the movable part causes a head slider to slightly move. The microactuator further comprises a conductive path including an impurity-containing silicon layer formed on the silicon substrate. The conductive path transmits electric charge of the head slider to a suspension. The conductivity of the impurity-containing silicon layer is lower than the one of the silicon substrate so that the noise charge of the head slider may escape to the suspension. | 05-28-2009 |
20090251825 | Micro electro mechanical system and head gimbal assembly - Embodiments of the present invention help to prevent dropout of a head slider from an micro electrical mechanical system (MEMS) and damage of the MEMS. In an embodiment of the present invention, a suspension for a slider dynamic electric test (DET) comprises an MEMS for supporting a head slider. The MEMS has a clamper for holding a head slider and the clamper moved by an external force can attach or detach a head slider. The suspension comprises limiters for limiting the clamper's lateral movement. The limiters limit the clamper's undesirable movement, which prevents the clamper's lateral movement in attaching a head slider, a head slider's dropout and the MEMS's damage caused by a contact with a magnetic disk, or a head slider's dropout and the MEMS's damage in handling. | 10-08-2009 |
20110075301 | HEAD-GIMBAL ASSEMBLY, MICROACTUATOR, AND MANUFACTURING METHOD OF THE MICROACTUATOR - A head-gimbal assembly. The head-gimbal assembly includes a suspension, a microactuator disposed on the suspension, and a head-slider bonded to the microactuator. The head-gimbal assembly further includes a connection pad disposed on the suspension, a connection pad disposed on the microactuator and formed over an edge between a side surface and a top surface of the microactuator to have a bend portion with an obtuse angle, and a metallic interconnection joint for interconnecting the connection pad of the suspension with the connection pad of the microactuator. | 03-31-2011 |
20110096438 | HEAD-GIMBAL ASSEMBLY WITH TRACE CONFIGURED TO REDUCE STRESS ON A MICROACTUATOR AND DISK DRIVE INCLUDING THE HEAD-GIMBAL ASSEMBLY - A head-gimbal assembly. The head-gimbal assembly includes a gimbal including a tongue, a stage forming a portion of the tongue, a head-slider bonded to the stage, first and second piezoelectric elements disposed on a rear side of the stage within an area of the tongue, and a trace formed on the gimbal. The first and second piezoelectric elements include respectively both a front connection pad and a rear connection pad, and are configured to extend and to contract in a fore-and-aft direction. The trace includes a plurality of leads for connecting a plurality of connection pads interconnected with a plurality of connection pads of the head-slider and configured for interconnection to connection pads of a preamplifier integrated circuit. The plurality of leads runs through and in between the front connection pad of the first piezoelectric element and the front connection pad of the second piezoelectric element. | 04-28-2011 |