Patent application number | Description | Published |
20090096510 | REFERENCE VOLTAGE GENERATING CIRCUIT FOR USE OF INTEGRATED CIRCUIT - An amplifying circuit receives an output from a comparator. The output is provided to each gate of first, second and third transistors. First and second resistors are connected in series. The first and second resistors and a first diode are connected to a drain of the first transistor. Second diodes are connected in parallel. The second diodes are connected to one end of a third resistor. The other end of the third resistor is connected to a drain of the second transistor. Fourth and fifth resistors are connected in series. One end of the fourth resistor is connected to the drain of the second transistor. The comparator receives first and second feedback voltages respectively obtained from a connection node between the first and second resistors and a connection node between the fourth and fifth resistors. A drain of the third transistor outputs a reference voltage. | 04-16-2009 |
20090108919 | POWER SUPPLY CIRCUIT USING INSULATED-GATE FIELD-EFFECT TRANSISTORS - A power supply circuit is disclosed. The power supply circuit is provided with a reference voltage generation circuit to receive a voltage from a higher voltage supply so as to generate a reference voltage. The reference voltage from the reference voltage generation circuit is outputted to a power supply voltage generation circuit. The power supply voltage generation circuit boosts the reference voltage to generate a boosted power supply voltage. The boosted power supply voltage is inputted to a bandgap reference circuit. The bandgap reference circuit generates a reference voltage by using the boosted power supply voltage. | 04-30-2009 |
20090115387 | VOLTAGE GENERATING CIRCUIT - A voltage generating circuit comprising: a switching device which includes a first end connected to a high potential side power source, and which becomes conductive in a first mode and becomes non-conductive in a second mode; a first transistor including a first main electrode connected to a second end of the switching device, a second main electrode connected to an output terminal, and a gate connected to a gate potential supply node; a second transistor including a first main electrode connected to the high potential side power source, a second main electrode connected to the output terminal, and a gate connected to the gate potential supply node; and a gate voltage stabilizing circuit that suppresses a fluctuation in potential of the potential supply node, the fluctuation accompanying a change between the first and second modes. | 05-07-2009 |
20100011260 | MEMORY SYSTEM - To provide a memory system which determines a memory state such as an exhaustion level and allows a memory to be efficiently used. | 01-14-2010 |
20100020587 | SEMICONDUCTOR MEMORY DEVICE - A ferroelectric memory is provided with a voltage generating circuit configured to generate prescribed driving potential, a driving interconnection to which the driving potential is applied, a plurality of memory cells connected to the driving interconnections and an internal voltage comparison circuit configured to compare inputted potential and to output results thereof. A plurality of voltage monitoring interconnections are provided to connect between a portion of the driving interconnection disposed at a position distant from the voltage generating circuit on the substrate and the internal voltage comparison circuit. The internal voltage comparison circuit compares potential inputted through the voltage monitoring interconnection with the driving potential. | 01-28-2010 |
20100107021 | SEMICONDUCTOR MEMORY DEVICE - This disclosure concerns a memory including: a first memory region including memory groups including a plurality of memory cells, addresses being respectively allocated for the memory groups, the memory groups respectively being units of data erase operations; a second memory region temporarily storing therein data read from the first memory region or temporarily storing therein data to be written to the first memory region; a read counter storing therein a data read count for each memory group; an error-correcting circuit calculating an error bit count of the read data; and a controller performing a refresh operation, in which the read data stored in one of the memory groups is temporarily stored in the second memory region and is written back the read data to the same memory group, when the error bit count exceeds a first threshold or when the data read count exceeds a second threshold. | 04-29-2010 |
20100238699 | SEMICONDUCTOR MEMORY AND TEST METHOD FOR THE SEMICONDUCOR MEMORY - Semiconductor memory contains memory cells having ferroelectric capacitors and cell transistors, bit lines connected to memory cells, word lines connected to gate electrodes of cell transistors, plate lines connected to one of two electrodes of ferroelectric capacitors, sense amplifiers connected between each pair of bit lines. Further, a test pad is provided in order to apply an external voltage to each of bit lines, test transistors are provided corresponding to bit lines respectively, each of test transistors is connected between the test pad and each of bit lines, a fatigue test bias circuit is connected to a first node located between the test pad and test transistors. Test transistors are shared in a first test to apply a first voltage to ferroelectric capacitors from an outside via the test pad and a second test to apply a second voltage to ferroelectric capacitors from the fatigue test bias circuit. | 09-23-2010 |
20100325343 | MEMORY SYSTEM - This disclosure concerns a memory system including: chips (MC | 12-23-2010 |
20130242638 | RESISTANCE-CHANGE TYPE NON-VOLATILE SEMICONDUCTOR MEMORY - A memory cell is formed with a resistance variable element, which is interposed between first and second electrodes and can store resistance changes representing 2 or more different values, and first and second cell transistors having source terminals thereof connected to the first electrode, and gates thereof to a word line. A drain of the first cell transistor is connected to a bit line, and a drain of the second cell transistor is connected to a data line. The second electrode is connected to a source line. During a read operation, the first and second cell transistors are kept in an ON state, and a current is supplied from the bit line to the source line through the memory cell. Data is read according to the electrical potential difference between the data line and the source line. | 09-19-2013 |