Patent application number | Description | Published |
20100126905 | STORAGE APPARATUS FOR STORING SEMICONDUCTOR ELEMENT OR RETICLE - The present invention provides a storage apparatus for storing a semiconductor element or a reticle. The storage apparatus comprises a first cover, a second cover and a flange. The first cover has a top and a plurality of laterals around the top. The second cover is for being assembled with the first cover to form an inner space for accommodating the reticle. As to the flange, it is provided on the first cover for being mechanically held and placed. The characteristic of the disclosed storage apparatus is that the flange and the first cover are integrally formed. | 05-27-2010 |
20110073521 | Wafer container with at least one oval latch - A wafer container includes a container body and a door joined with opening of the container body for protecting wafers therein. At least one latch component is disposed in the door, and each latch component includes an oval cam and a pair of moving bars, a first end of each moving bar connecting to one of the two opposite sides of the oval cam and a second end of each moving bar having a guiding structure, a pair of moving grooves being disposed between the first end and the second end of each moving bar, at least a pair of rollers being disposed on the door and each roller being embedded in each moving groove of moving bar, and a locating spring being formed as an integral part of the moving bars. | 03-31-2011 |
20110266192 | WAFER CONTAINER WITH OVAL LATCH - A wafer container includes a container body, in which a plurality of slots being disposed for supporting a plurality of wafers and an opening being formed on one sidewall of which for importing and exporting the plurality of wafers, and a door is joined with the opening of the container body for protecting the plurality of wafers therein, wherein the characteristic of the wafer container lies in that: at least one latch component is disposed in the door, the latch component including an oval cam with a pair of V-shape notches and on the surface of oval cam being a groove, a pair of moving bars including respectively an engaging portion, and a guiding element located on the moving bars, the engaging portion being engaged in the groove for the pair of moving bars to be respectively engaged with the oval cam. | 11-03-2011 |
20120018347 | Reticle POD with Sensor - An EUV pod with pressure sensors disposed between its inner container and outer container, wherein pressure sensors disposed on the inner side of the outer container are used to detect the pressure between the outer container and the inner container, and the pressure data are used to determine whether the inner container is firmly fastened by the outer container. | 01-26-2012 |
20120037522 | Reticle Storing Container - A reticle storing container is disclosed to include an outer container, an inner container, and a purging valve. The outer container comprises a container body and a container base on which at least a first through-hole is disposed, and a first inner space is formed between the container body and the container base for storing the inner container. The inner container comprises a top cover and a bottom base on which at least a second through-hole connected to the first through-hole is disposed, and a second inner space is formed between the top cover and the bottom base for storing a reticle. The purging valve is disposed in the first through-hole on the outer container base and connected to the second through-hole of said inner container, wherein the purging valve comprises a spring and a valve part. Thus, when the valve part is propped up by a purging head, the valve part compresses the spring for the purging valve to be connected to the purging head. And a filter material is disposed on the joint portion between the container body and the container base to prevent the interior of the reticle from being contaminated. | 02-16-2012 |
Patent application number | Description | Published |
20100019393 | PACKAGING STRUCTURE FOR INTEGRATION OF MICROELECTRONICS AND MEMS DEVICES BY 3D STACKING AND METHOD FOR MANUFACTURING THE SAME - A packaging structure for integration of microelectronics and MEMS devices by 3D stacking is disclosed, which comprises: an ASIC unit, comprising a first substrate and a circuit layout formed on a surface of the first substrate, wherein a cavity is formed on the other surface and at least a through hole is formed on the ASIC unit; and a MEMS unit, comprising a second substrate and a micro sensor disposed on the second substrate; wherein the micro sensor is disposed in the cavity and there is a conductive material filling the through hole so that the ASIC unit and the MEMS unit can be electrically connected to each other when the ASIC unit is attached onto the MEMS unit. | 01-28-2010 |
20110154905 | CAPACITIVE SENSOR AND MANUFACTURING METHOD THEREOF - A capacitive sensor includes a substrate, at least one first electrode, at least one second electrode, a sensing device, at least one anchor base, at least one movable frame, and a plurality of spring members. The first and second electrodes are disposed on the substrate, and the anchor base surrounds the first and second electrodes and is disposed on the substrate. The movable frame surrounds the sensing device. Some of the spring members connect the movable frame and the sensing device, and the other spring members connect the movable frame and the anchor base. The sensing device and the first electrode are both sensing electrodes. The movable frame is disposed above the second electrode, and cooperates with the second electrode to act as a capacitive driver. | 06-30-2011 |
20120161253 | GAS SENSOR AND MANUFACTURING METHOD THEREOF - A gas sensor manufacturing method including the following steps: providing a SOI substrate, including an oxide layer, a device layer, and a carrier, wherein the oxide layer is disposed between the device layer and the carrier; etching the device layer to form an integrated circuit region, an outer region, a trench and a conducting line, the conducting line including a connecting arm connecting to the integrated circuit region, the trench is formed around the conducting line and excavated to the oxide layer for reducing power consumption of the heater circuit, the connecting arm reaches over a gap between the integrated circuit region and the outer region and electrically connects to the integrated circuit region; coating or imprinting a sensing material on the circuit region; and etching the carrier and the oxide layer to form a cavity to form a film structure suspended in the cavity by the cantilevered connecting arm. | 06-28-2012 |
Patent application number | Description | Published |
20090115051 | Electronic Circuit Package - An electronic circuit package has a thin-film circuit integrated with the ceramic substrate. The thin-film circuit includes at least two passive circuit elements joined by an integrated electrical interconnect. At least one active power electronic component mounted on the ceramic substrate and is electrically connected with the integrated thin-film circuit. | 05-07-2009 |
20100112757 | ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate. | 05-06-2010 |
20100247879 | SUBSTRATE WARPAGE-REDUCING STRUCTURE - The subject matter disclosed herein relates to methods to reduce warpage of a substrate. | 09-30-2010 |
20120267765 | WAFER-LEVELED CHIP PACKAGING STRUCTURE AND METHOD THEREOF - A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias. | 10-25-2012 |
20140217587 | Wafer Leveled Chip Packaging Structure and Method Thereof - A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias. | 08-07-2014 |
Patent application number | Description | Published |
20090117776 | Easy-pull type swivel plug - An easy-pull type swivel plug includes a body, a rotatable disk and a handle. The rotatable disk is rotatably provided on one side of the body. The rotatable disk is provided with two conductive pieces. The two conductive pieces extend beyond the body. The handle is pivoted to the other side of the body opposite to the rotatable disk in a liftable and foldable manner. The pivoting position between the handle and body corresponds to the center of the rotatable disk. Via this arrangement, the deformation of the conductive pieces caused by a torque generated in misalignment with the center can be avoided and the user can unplug more easily with less labor. | 05-07-2009 |
20110097914 | ROTATABLE AND FOLDABLE ELECTRICAL PLUG CONNECTOR - A electrical plug connector includes a rotary assembly, an electrical plug assembly having a live prong assembly, a neutral prong assembly, and a ground prong assembly and capable of rotating with respect to a first predetermined axis, and a linkage portion between the rotary assembly and the electrical plug assembly for linking the live prong assembly, the neutral prong assembly, and the ground prong assembly. The linkage portion is configured to enable the live prong assembly, the neutral prong assembly, and the ground prong to rotate with respect to a first predetermined axis simultaneously. | 04-28-2011 |
20110177703 | ROTATABLE AND CONCEALABLE ELECTRICAL POWER RECEPTACLE - Disclosed is a reversible and concealable electrical power receptacle, comprising: a main body, a shaft section, an accommodating section, and an electrical outlet assembly. The electrical outlet assembly is disposed on the main body; the accommodating section is for receiving the main body; the shaft section, comprises a first shaft member and a second shaft member. The second shaft member, being coupled to the main body and is perpendicular to the first shaft member, and the main body is rotatable with respect to the first and the second shaft members transversely respectively. Consequently, the main body is able to rotate transversely and perpendicularly with respect to the accommodating section in accordance with the rotational movements of the first shaft and the second shaft members, for resulting in an exposed state in use or a concealed state when not in use, thereby achieving effective space utilization. | 07-21-2011 |