Patent application number | Description | Published |
20130281589 | THERMOPLASTIC POLYAMIDE COMPOSITION - Disclosed is a thermoplastic polyamide composition including a) a polyamide resin; b) one or more polyhydric alcohols; c) one or more anti-whitening agents selected from the group consisting of poly(ethylene glycol), poly(ethylene glycol) diesters, poly(propylene glycol), poly(propylene glycol) diesters; and styrene-isoprene-styrene block copolymers; and mixtures of these; d) a lubricant; e) one or more reinforcement agents; and, optionally, f) a polymeric toughener comprising a reactive functional group and/or a metal salt of a carboxylic acid. | 10-24-2013 |
20130338262 | THERMOPLASTIC MELT-MIXED COMPOSITION WITH EPOXY-AMINO ACID COMPOUND HEAT STABILIZER AND PROCESSES FOR THEIR PREPARATION - Disclosed is a thermoplastic melt-mixed composition including: a) a polyamide resin; b) a poly(amino acid)-polyol compound provided by reacting: b1) one or more amino acids selected from the group consisting of primary amino acids and secondary amino acids and combinations of these; the amino acid having no more than one hydroxyl group; and b2) one or more polyepoxy compound comprising at least two or more epoxy groups; the poly(amino acid)-polyol compound having a range of at least 10 percent conversion of epoxy equivalents of component (b1) up to, but excluding, the gel point of the components b1) and b2) and c) reinforcing agent; and, optionally, d) polymeric toughener; and f) further additives. Processes for making the composition are also disclosed. | 12-19-2013 |
20130338301 | THERMOPLASTIC MELT-MIXED COMPOSITION WITH EPOXY-CARBOXYLIC ACID COMPOUND HEAT STABILIZER AND PROCESSES FOR THEIR PREPARATION - Disclosed is a thermoplastic melt-mixed composition including: a) a semicrystalline polyimide; h) a polyacid-polyol compound provided by reacting: b1) one or more polyepoxy compound including at least two or more epoxy groups; and b2) one or more carboxylic acid compounds selected from the group consisting of polyacids, acid alcohols and combinations of these; said polyacid-polyol compound having a range of at least 10 percent conversion of epoxy equivalents of component (b1) up to, but excluding, the gel point of the components b1) and b2); c) reinforcing agent; and optionally d) polymeric toughener; and e) further additives. Also discloses are processes for preparing the thermoplastic melt-mixed blends. | 12-19-2013 |
20140288220 | HEAT RESISTANT POLYAMIDE COMPOSITIONS - Disclosed are heat resistant polyamide compositions including a) one or more polyamide resins, b) one or more reinforcing agents, c) a zinc compound; d) a copper heat stabilizer; and optionally, e) a polyhydric alcohol. | 09-25-2014 |