Hung, Taichung
Aky Hung, Taichung TW
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20140250733 | HOCKEY SKATE - A hockey skate includes a composite boot form having a rigid lower portion and a less rigid upper portion. The upper portion may be made of a thermoformable material that conforms to the shape of a wearer's foot and ankle. The construction of the boot form—particularly the lower portion of the boot form—may be varied across different size ranges by, for example, varying the fiber angles in the composite material. Varying the stiffness of the lower portion of the boot form in this manner allows the flexibility of different sized boots to be substantially equalized. A skate quarter and other skate-boot features may readily be attached to the upper portion of the boot form via stitching, rivets, or other connectors. The boot form also may include an integral toe cap having a flange or other element to which the skate tongue and other elements may be connected. | 09-11-2014 |
20140252736 | SKATE WITH INJECTED BOOT FORM - A boot form for a hockey skate is made of multiple plastic materials having different hardness properties, or different flexural moduli, and is formed via an injection-molding process or another similar process. One or more of the plastic materials may be reinforced with fibers of glass, carbon, aramid, or another stiffening material to strengthen one or more regions of the boot form. For example, pellets of a first plastic material having a flexural modulus of approximately 190 MPa (e.g., a polyamide elastomer block amide) may be injected into a mold to form a softer upper region of the boot form. And pellets of a second plastic having a flexural modulus of approximately 20,000 MPa (e.g., a Nylon 12 with long glass fibers) may be injected into the mold to form a stiffer lower region of the boot form. Additional skate components may then be attached to the boot form. | 09-11-2014 |
Chao Jung Hung, Taichung TW
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20110154717 | SHOCK-PROOF DEVICE FOR ELECTRIC MOSQUITO TRAP - A shock-proof device for electric mosquito trap is a frame body capable of being arranged to two sides of an electric mosquito trap. The frame body has a plurality of polygonal through holes formed by thin sheets so as to avoid human body from touching an electric net of the electric mosquito trap. User will not have a fear of being electric shocked. The voltage of the electric mosquito trap can be thus raised for efficiently killing mosquitoes by single shock. | 06-30-2011 |
20110173745 | SEPARABLE PAPERLESS BIDET TOILET SEAT - A separable paperless bidet toilet seat comprises a main frame which includes: a fixing portion installed at a rear end of the toilet seat for containing a flushing spray and a telescopic structure of the spray; and a separable portion for receiving a heater, a motor, a pump and a control circuit and wherein a water inlet tube and the control circuit serves to connect the fixing portion to the separable portion. The main frame is installed at a rear side of the toilet and a separable portion is installed at a proper position so as to achieve above object. | 07-21-2011 |
20110274475 | WORLD KEYBOARD AND AUXILIARY - A world keyboard and its auxiliary include a keyboard and a diaphragm cover. The diaphragm cover has a plurality of protrudent diaphragm key matching to all the keys of the keyboard. The diaphragm cover can be covered upon the keyboard and the printings on the keys. Large-size symbols of an input method for a language are printed on corresponding keys of the keyboard and diaphragm keys of the diaphragm cover. Or, symbols of multiple input methods for a language are printed on corresponding keys and diaphragm keys, and symbols of one of the input methods are printed larger. Or, symbols of multiple input methods for a language are printed on corresponding keys and diaphragm keys, and symbols of at least one input method are printed larger. Through the diaphragm covers and the keyboard, different input methods for different languages can be applied to a computer system. Once the language of computer system is changed, user can easily find out corresponding key locations of symbols of the input method. | 11-10-2011 |
Chao-Yi Hung, Taichung TW
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20090183830 | METHOD FOR PRINTING ON THIN PLASTIC SHELLS FOR HELMETS OR VEHICLE FASCIAS - A method for printing on thin plastic shells for helmets or vehicle fascias has the following steps. Preparing a colorful pattern board being preparing a colorful pattern board having a plastic board with a top and a bottom, a pattern layer and a melting layer. Forming a crude product by heating and attaching the colorful pattern board to a surface of an untreated shell by vacuum to obtain a crude product. Finally, a crude shell is modified. Accordingly, embellished thin plastic shells are obtained simply with fewer solvents. | 07-23-2009 |
Chia-Lin Hung, Taichung TW
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20130120599 | Positionable Mechanism With An Optical Image Stabilizing Unit - A positionable mechanism includes a base unit, a frame unit, an optical image stabilizing (OIS) unit and a positioning unit. The frame unit and the OIS unit are mounted on the base unit. The frame unit is retractable with respect to the base unit between a storage position and a working position, and has a first surface. The OIS unit includes a movable carrier that has a second surface facing the first surface, an optical element that is mounted on the movable carrier, and a driving element that is operable to drive the movable carrier to move with respect to the base unit. The positioning unit is disposed between the first surface and the second surface, and is configured to position the movable carrier with respect to the frame unit when the frame unit is at the storage position. | 05-16-2013 |
Chih-Jung Hung, Taichung TW
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20090011673 | Porous carbonized fabric with high efficiency and its preparation method and uses - A porous carbonized fabric with high efficiency and its preparation method and uses are provided. The carbonized fabric is prepared from a mixed spun fabric containing an oxidized fiber and a polyamide fiber. The carbonized fabric has excellent gas permeability, high porosity, and good electric conductivity. The carbonized fabric can be used as the gas diffusion layer (electrode) material in a fuel cell. The fuel cell can provide a relatively high power density. Moreover, the carbonized fabric is useful as an anti-electromagnetic material and a reinforced composite material. | 01-08-2009 |
20090047549 | MODIFIED CARBONIZED SUBSTRATE AND ITS MANUFACTURING METHOD AND USE - A process for modifying a carbonized substrate and a modified carbonized substrate obtained therefrom are provided. The process involves the application of a mixture containing a hydrophobic polymer and a carbonaceous material onto a carbonized substrate which is not subjected to a hydrophobic treatment. The subject invention uses a simpler procedure to modify a carbonized substrate to provide a modified carbonized substrate with good conductivity, air permeability, and hydrophobicity. The modified carbonized substrate is suitable for use as the material for the gas diffusion layer of the electrode in fuel cells. | 02-19-2009 |
20090061275 | Carbonized Paper With High Strength And Its Preparation Method And Uses - Strengthened carbonized paper, its preparation method and uses are provided. The carbonized paper comprises a mixed spun fabric containing oxidized fibers and polyamide fibers as the reinforced material. The carbonized paper has good tensile strength and electric conductivity. The carbonized paper can be used as the gas diffusion layer material in the fuel cell for better performance. Moreover, the carbonized paper of the subject invention is useful as the anti-electromagnetic material and reinforced composite material. | 03-05-2009 |
Chou Wen Hung, Taichung TW
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20140369171 | ELECTRONIC CLOCK - An electronic clock contains a clock module with at least one display panel and a transforming module. The transforming module is mounted in a power supply space of at least one switch on a wall. The clock module is fitted on a rear end of each switch, and the at least one display panel correspond to a displaying portion of each switch. The transforming module is electrically connected with supply mains in the power supply space of the at least one switch so as to output power to the clock module. The at least one display panel is electrically connected with the clock module, and the clock module is electrically coupled with the transforming module so as to receive power outputted by the transforming module, hence the clock module produces electronic signals to display time or/and date on the at least one display panel. | 12-18-2014 |
Chung Chieh Hung, Taichung TW
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20150070873 | MACHINE TOOL WITH TOUCH CONTROL WORK LAMP AND USING METHOD THEREOF - A machine tool with a touch control work lamp includes a machine and a touch control work lamp. The touch control work lamp includes an electrically insulating lamp base disposed on the machine, a connecting member mounted onto the base and extending outwardly from the base, a casing engaged to the connecting member, and a light emitting unit disposed in the casing. By utilizing the touch control work lamp, the machine is prevented from breaking down or malfunctioning, and by using the electrically insulating lamp base, user safety is effectively enhanced. | 03-12-2015 |
Chung-Ming Hung, Taichung TW
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20130273852 | BLUETOOTH DEDVICE - A Bluetooth device is provided, which comprises a body used for connecting with an earphone; a rotating member, rotating between a first position and a second position relative to the body, so as to control power on or off of the Bluetooth device. | 10-17-2013 |
Hao-Yi Hung, Taichung TW
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20150272508 | SIGNAL PROCESSING SYSTEM PROVIDING MARKING OF LIVING CREATURE PHYSIOLOGICAL SIGNAL AT A SPECIFIC TIME - A signal processing system aims to mark living creature physiological signal at a specific time by monitoring living creature's explicit characteristic behavior or ambient environment variation. It includes a trigger device to trigger a time marking device to generate a time signal, a signal processing device to receive the time signal through a transmission interface, and a detection device to measure and send a physiological signal of the living creature to the signal processing device. The signal processing device compensates delay time of the transmission interface, trigger device and time marking device to get a corrected time signal. Thus, the signal processing device can add the corrected time signal in the physiological signal or capture the physiological signal corresponding to a specific time of the corrected time signal to correctly interpret correlation between the living creature's explicit characteristic behavior or ambient environment variation and the physiological signal. | 10-01-2015 |
Hsiao-Jen Hung, Taichung TW
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20080303134 | Semiconductor package and method for fabricating the same - A semiconductor package and a method for fabricating the same are disclosed, which includes: providing a carrier board, forming a plurality of metal bumps on the carrier board, forming a metal layer on the carrier board to encapsulate the metal bumps, having at least one semiconductor chip electrically connected to the metal layer, then forming an encapsulant on the carrier board to encapsulate the semiconductor chip, and next removing the carrier board and the metal bumps to correspondingly form a plurality of grooves on surface of the encapsulant, wherein bottom and sides of the grooves are covered with the metal layer to allow electroconductive components to be effectively positioned in the grooves and completely bonded with the metal layer. | 12-11-2008 |
20110157851 | PACKAGE STRUCTURE - A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted. | 06-30-2011 |
Jyun-Jhe Hung, Taichung TW
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20110238502 | SYSTEM FOR INTELLIGENT REAL TIME INFORMATION SERVICE AND METHOD OF THE SAME - A service method for real time information compares surrounding information provided by a transportation with conditional factors established in a database. A service center provides the real time information that conforming to the conditional factors to the transportation. Thence the transportation could respectively present the real time information on a multimedia display unit installed thereon. Whereby, the service center provides a corresponding real time information in accordance with the provided surrounding data around the transportation, and introduces the concept of time and region separation to preferably supply proper real time information to different users. | 09-29-2011 |
Liang-Chi Hung, Taichung TW
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20150328754 | NAILING MACHINE - A nailing machine | 11-19-2015 |
Liang-Yi Hung, Taichung TW
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20130026657 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package and a method of fabricating the same. The semiconductor package includes a dielectric layer having opposite first and second surfaces; a semiconductor chip disposed on the first surface; at least two conductive pads embedded in and exposed from the first surface of the dielectric layer, and electrically connected to the semiconductor chip; a plurality of ball-implanting pads formed on the second surface of the dielectric layer; and a plurality of conductive pillars formed in the dielectric layer, each of the conductive pillars having a first end electrically connected to one of the ball-implanting pads and a second end opposing the first end and electrically connected to one of the conductive pads. Through the installation of the conductive pillars, it is not necessary for the ball-implanting pads to be associated with the conductive pads in position, and the semiconductor package thus has an adjustable ball-implanting area. | 01-31-2013 |
20130228921 | SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF - A substrate structure includes a substrate body and a plurality of conductive pads formed on the substrate body and each having a first copper layer, a nickel layer, a second copper layer and a gold layer sequentially stacked. The thickness of the second copper layer is less than the thickness of the first copper layer. As such, the invention effectively enhances the bonding strength between the conductive pads and solder balls to be mounted later on the conductive pads, and prolongs the duration period of the substrate structure. | 09-05-2013 |
20130307152 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield. | 11-21-2013 |
20140308780 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE - A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield. | 10-16-2014 |
20150102484 | PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A package structure is disclosed, which includes: a first substrate; a build-up layer formed on and electrically connected to the first substrate and having a cavity; at least an electronic element disposed in the cavity and electrically connected to the first substrate; a stack member disposed on the build-up layer so as to be stacked on the first substrate; and an encapsulant formed between the build-up layer and the stack member. The build-up layer facilitates to achieve a stand-off effect and prevent solder bridging. | 04-16-2015 |
20150179598 | FLIP-CHIP PACKAGING STRUCTURE - A flip-chip packaging structure is provided, which includes: a packaging substrate having a substrate body and a circuit layer formed on the substrate body, wherein the circuit layer has a plurality of conductive pads embedded in the substrate body and exposed from a surface of the substrate body; and a chip disposed on and electrically connected to the packaging substrate through a plurality of conductive elements, wherein the conductive elements and the exposed portions of the conductive pads have a width ratio in a range of 0.7 to 1.3, thereby improving the product yield and reliability. | 06-25-2015 |
20150303073 | METHOD OF FABRICATING A PACKAGING SUBSTRATE - A method of fabricating a packaging substrate is provided, including: providing a carrier having two carrying portions, each of the carrying portions having a first side and a second side opposite to the first side and the carrying portions are bonded through the second sides thereof; forming a circuit layer on the first side of each of the carrying portions; and separating the two carrying portions from each other to form two packaging substrates. The carrying portions facilitate the thinning of the circuit layers and provide sufficient strength for the packaging substrates to undergo subsequent packaging processes. The carrying portions can be removed after the packaging processes to reduce the thickness of packages and thereby meet the miniaturization requirement. | 10-22-2015 |
Lung-Tang Hung, Taichung TW
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20140191393 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, including a carrier having electrical connecting pads, a semiconductor element disposed on the carrier and having electrode pads, conductive elements electrically connected to the electrode pads and the electrical connecting pads, fluorine ions formed between the conductive elements and the electrode pads or between the conductive elements and the electrical connecting pads, and an encapsulant formed on the carrier and the conductive elements, wherein the electrode pads or the electrical connecting pads are formed by aluminum materials to form fluorine aluminum by way of packaging the fluorine ions after the completion of the packaging process. Accordingly, the corrosion resistance of the semiconductor package is increased. | 07-10-2014 |
20150028081 | METHOD FOR FABRICATING WIRE BONDING STRUCTURE - A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad. | 01-29-2015 |
Ming-Chain Hung, Taichung TW
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20080220162 | Method for manufacturing metal-carrying carbonaceous material - A method for manufacturing a metal-carrying carbonaceous material is provided. The method comprises immersing a carbonaceous material in a metal-containing aqueous solution under vacuum, with stirring, and/or in the presence of a polar solvent, and then thermally treating the immersed carbonaceous material at a temperature ranging from 120° C. up to a temperature not higher than the melting point of the involved metal under vacuum or in the presence of a protective gas. According to the method, the metal can be effectively carried on a carbonaceous material so as to enhance the applicability of the metal-carrying carbonaceous material. | 09-11-2008 |
Ming-Chean Hung, Taichung TW
Min-Shun Hung, Taichung TW
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20110287587 | METHOD FOR FABRICATING HEAT DISSIPATION PACKAGE STRUCTURE - A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome. | 11-24-2011 |
Shao-Lun Hung, Taichung TW
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20090092021 | DEVICE AND METHOD FOR DETECTING BLANK AREA IN OPTICAL DISC - A method and a device of distinguishing blank area from non-blank area in an optical disc are provided. An input signal such as a DPD TE signal or RF ripple signal is first filtered to obtain a filtered signal. A subtracting operation of the input signal and the filtered signal is then performed to obtain a first signal. According to a peak value and a bottom value of the first signal, the first signal is processed into a second signal. By comparing the second signal with a reference signal, whether the currently read area is blank area or non-blank area can be discriminated. An indicating signal is outputted at a first value to indicate the blank area while the indicating signal is outputted at a second value to indicate the non-blank area. | 04-09-2009 |
Shih-Hsin Hung, Taichung TW
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20080247688 | Wiper for linear motion guide apparatus - A linear motion guide device includes a slider slidably attached onto a guide rail, an end cap and a wiper device attached to each side of the slider, the wiper device includes two wiping members to be easily and detachably attached to each of the end cap without tools and fasteners. The wiping members each include one or more projections or one or more latches for engaging with the end cap and for anchoring and positioning the wiping members to the end cap without tools and fasteners. The end cap includes a space separated into two chambers and for receiving the wiping members respectively. The wiping members each include a soft wiping portion for resiliently engaging with the guide rail. | 10-09-2008 |
Shu-Hui Hung, Taichung TW
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20090114160 | Barrier for poultry trough - A barrier for poultry troughs has a ridge bracket, two shutters and a holding device. The ridge bracket has two surfaces, a mounting edge and a connecting edge. The shutters are respectively mounted on the surfaces of the ridge bracket. The holding device is connected securely to the ridge bracket to allow the barrier to be raised and lowered over the poultry trough to prevent poultry from feeding from the trough whilst the troughs are being filled. Once filed the holding device is used to raise the barrier and expose feed to the poultry. When the barrier is lowered, the pivoting of the shutters prevents damage to poultry straddling the trough and automatically closes once the poultry have left the trough. | 05-07-2009 |
Ta-Sheng Hung, Taichung TW
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20140153296 | ISOLATED POWER CONVERSION APPARATUS AND METHOD OF CONVERTING POWER - An isolated power conversion apparatus includes an isolation transformer and an auto charge pump circuit. The isolation transformer has a primary side and a second side, wherein the primary side is electrically connected to a pulsed power supply, and the secondary side has a first end and a second end; the auto charge pump circuit electrically connects the isolation transformer to a loading to improve power conversion efficiency and suppress output voltage ripples. | 06-05-2014 |
20140153305 | AC/DC CONVERTER WITH PASSIVE POWER FACTOR CORRECTION CIRCUIT AND METHOD OF CORRECTING POWER FACTOR - An AC/DC converter includes a rectifier circuit and a power factor correction circuit. An input port of the rectifier circuit receives an alternate current. The power factor correction circuit includes a first inductor, a second inductor, a first capacitor, a second capacitor, a first diode and a second diode. An end of the first inductor electrically connects to a positive pole of an output port of the rectifier circuit, and the other end electrically connects to a ground terminal of the output port through two parallel series routes which are bridged by the first diode. Wherein a series route contains the first capacitor and the second diode, and the other series route contains the second inductor and the second capacitor. The second capacitor is provided for parallel connecting with a loading. In this way, the input current could be controlled to increase the power factor effectively. | 06-05-2014 |
20140153306 | AC/DC CONVERTER AND METHOD OF CORRECTING POWER FACTOR - An AC/DC converter includes a rectifier circuit and an active power factor correction circuit. The rectifier circuit is electrically connected to a power supply, and is used to convert an alternate current into a direct current, wherein the rectifier circuit has a positive output and a negative output for sending out the direct current. The active power factor correction circuit electrically connects the rectifier circuit and a loading, wherein the active power factor correction circuit is used to suppress voltage ripples provided to the loading. | 06-05-2014 |
Wei-Chun Hung, Taichung TW
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20150124392 | Combinational Cooling Pad Structure with Flash Drive Storage - A combinational cooling pad structure with flash drive storage comprises a cooling pad and a flash drive. The cooling pad comprises at least three combinational pads with structural surfaces. At least two connecting portions are correspondingly disposed between the combinational pads. Limiting structures are correspondingly disposed on outer sides of the outer combinational pads. The combinational pads are connected by the connecting portions to form a structure which can be unfolded flatly; and are folded closely together to form a structural body surrounded by the structural surfaces; and are combined securely by the corresponding limiting structures. An inner hole for inserting the flash drive is defined and formed by inner surfaces of the surrounding combinational pads. A coupling portion is protrudingly disposed at an end of the flash drive, and an interface connector is disposed on the coupling portion. The coupling portion is then inserted into the inner hole. | 05-07-2015 |
Wei-Shen Hung, Taichung TW
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20150268443 | Optical Device - An optical device is provided wherein an image sensor is disposed on a base, a cam barrel is rotatably disposed on the base and has a first cam groove and a second cam groove, a first motor is connected to the cam barrel and drives the cam barrel rotating with respect to a first axis, a straight barrel is disposed on the base and within the cam barrel and has at least one straight groove and parallel to the first axis, a first lens frame is joined to the first cam groove via the straight groove, a second lens frame is movable on a rail which axially extends on inner surfaces of the straight barrel, a third lens frame is joined to the second cam groove via the straight groove and a second motor drives the second lens frame to move along the rail. The cam barrel rotates to drive the first lens frame and the third lens frame moving along the straight groove. | 09-24-2015 |
Wen-Lang Hung, Taichung TW
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20080291514 | LIGHT GUIDE DEVICE AND ILLUMINATION MODULE USING THE SAME - An illumination module is provided in the invention. The illumination module includes a light source having a plurality of light emitting elements arranged in a linear array and a light guide device. The light guide device receives light from the light source and generates uniform light which is transmitted onto an article to be scanned, has a longitudinal direction, and includes a diffraction structure and a reflection portion. The diffraction structure has a shape inducing light to be scattered and deflects the scattered light toward the longitudinal direction. The reflection portion reflects the light scattered and deflected by the diffraction structure, and is inclined to have an inclined angle with the light propagating direction. In addition, the reflection portion is formed on the diffraction structure or apart from it. | 11-27-2008 |
20090109408 | LIGHT-FILTERING MODULE AND PROJECTING SYSTEM APPLIED THEREWITH - A light-filtering module includes a light-source module, a dichroic mirror and a first image unit. The light-source module outputs a light beam. The dichroic mirror divides the light beam into a first colored light and a dual colored light. The first image unit provides the first colored light with image information. The light-filtering module includes a light-filtering unit and a driving unit. The light-filtering unit located between the dichroic mirror and the first image unit is located at a light path of the first colored light. The driving unit includes a coupling element coupled to the light-filtering unit and a driving element utilized to drive the coupling element. The driving element drives the light-filtering unit, switching between a first status and a second status by the coupling element, and a wide-wavelength spectrum and a narrow-wavelength spectrum are provided when the light-filtering unit is in the first and second statuses, respectively. | 04-30-2009 |
20090109640 | OPTICAL ENGINE - An optical engine is provided, including an imaging module, a driver module and a connecting unit. The imaging module includes an imaging housing with an imaging space and an imaging unit installed in the imaging space. The imaging housing is made of a conductive material. The driver module includes a driver housing with a driver space and a driver circuit board installed in the driver space. The connecting unit includes at least one of the cables is electrically connected to the imaging unit and the driver circuit board and at least a protruding module protruding from the imaging housing (or the driver housing) to contact with the driver housing (or the imaging housing). The cable is installed in the protruding module made of a conductive material. | 04-30-2009 |
20090110020 | LIGHT EMITTING SYSTEM - A light emitting system is disclosed, including a light generator, a complex lens and an activating unit. The light generator provides a light beam emitted in a first direction in parallel to an optic axis. The complex lens, disposed on a path of the light beam, includes a plurality of micro structures for refracting the light beam. The activating unit includes an activating member coupled to the complex lens. The activating member activates the complex lens with an activation frequency to reciprocally move in a second direction alternate to the first direction. By the disposition of the complex lens, the energy of the light beam is uniformly distributed. Additionally, speckle produced by the light beam is reciprocally moved within an area by the activating unit, creating a photogene reaction, to successfully eliminate existence of the speckle. | 04-30-2009 |
Yi-Chung Hung, Taichung TW
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20090109640 | OPTICAL ENGINE - An optical engine is provided, including an imaging module, a driver module and a connecting unit. The imaging module includes an imaging housing with an imaging space and an imaging unit installed in the imaging space. The imaging housing is made of a conductive material. The driver module includes a driver housing with a driver space and a driver circuit board installed in the driver space. The connecting unit includes at least one of the cables is electrically connected to the imaging unit and the driver circuit board and at least a protruding module protruding from the imaging housing (or the driver housing) to contact with the driver housing (or the imaging housing). The cable is installed in the protruding module made of a conductive material. | 04-30-2009 |
20090110020 | LIGHT EMITTING SYSTEM - A light emitting system is disclosed, including a light generator, a complex lens and an activating unit. The light generator provides a light beam emitted in a first direction in parallel to an optic axis. The complex lens, disposed on a path of the light beam, includes a plurality of micro structures for refracting the light beam. The activating unit includes an activating member coupled to the complex lens. The activating member activates the complex lens with an activation frequency to reciprocally move in a second direction alternate to the first direction. By the disposition of the complex lens, the energy of the light beam is uniformly distributed. Additionally, speckle produced by the light beam is reciprocally moved within an area by the activating unit, creating a photogene reaction, to successfully eliminate existence of the speckle. | 04-30-2009 |
20140063474 | Electronic Device - An electronic device includes a lens assembly, a lens focusing rod, a power switch and a lens protective cover. When the lens protective cover is located in the first position, the lens assembly is shielded by the lens protective cover, the power switch is turned off, and the lens protective cover is separated from the lens focusing rod. When the lens protective cover is located in the second position, the power switch is turned on, and the lens protective cover is contacted with the lens focusing rod. When the lens protective cover is moved between the second position and the third position, the power switch is turned on, and the lens assembly is driven by the lens protective cover through the lens focusing rod for focusing operation. | 03-06-2014 |