Patent application number | Description | Published |
20080217782 | METHOD FOR PREPARING 2-DIMENSIONAL SEMICONDUCTOR DEVICES FOR INTEGRATION IN A THIRD DIMENSION - A method which is intended to facilitate and/or simplify the process of fabricating interlayer vias by selective modification of the FEOL film stack on a transfer wafer is provided. Specifically, the present invention provides a method in which two dimensional devices are prepared for subsequent integration in a third dimension at the transition between normal FEOL processes by using an existing interlayer contact mask to define regions in which layers of undesirable dielectrics and metal are selectively removed and refilled with a middle-of-the-line (MOL) compatible dielectric film. As presented, the inventive method is compatible with standard FEOL/MOL integration schemes, and it guarantees a homogeneous dielectric film stack specifically in areas where interlayer contacts are to be formed, thus allowing the option of a straightforward integration path, if desired. | 09-11-2008 |
20080268574 | HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS - A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure. | 10-30-2008 |
20090026623 | BURIED METAL-SEMICONDUCTOR ALLOY LAYERS AND STRUCTURES AND METHODS FOR FABRICATION THEREOF - A method for forming a metal-semiconductor alloy layer uses particular thermal annealing conditions to provide a stress free metal-semiconductor alloy layer through interdiffusion of a buried semiconductor material layer and a metal-semiconductor alloy forming metal layer that contacts the buried semiconductor material layer within an aperture through a capping layer beneath which is buried the semiconductor material layer. A resulting semiconductor structure includes the metal-semiconductor alloy layer that further includes an interconnect portion beneath the capping layer and a contiguous via portion that penetrates at least partially through the capping layer. Such a metal-semiconductor alloy layer may be located interposed between a substrate and a semiconductor device having an active doped region. | 01-29-2009 |
20090042338 | Capping Coating for 3D Integration Applications - A structure for a semiconductor component is provided having a bi-layer capping coating integrated and built on supporting layer to be transferred. The bi-layer capping protects the layer to be transferred from possible degradation resulting from the attachment and removal processes of the carrier assembly used for layer transfer. A wafer-level layer transfer process using this structure is enabled to create three-dimensional integrated circuits. | 02-12-2009 |
20090140404 | HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS - A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure. | 06-04-2009 |
20100146019 | AUTOMATED FILE RELOCATION - A computer-implemented method, system and computer program product for managing computer file storage is presented. In one embodiment the method includes receiving a file for storage. In response to determining that the file exceeds a pre-determined size, the file is stored in a pre-designated folder that is reserved for oversized files. | 06-10-2010 |
20100211950 | Automated Termination of Selected Software Applications in Response to System Events - The illustrative embodiments disclose a computer implemented method, apparatus, and computer program product for managing a set of applications. In one embodiment, the process registers a system management event in an application configuration database. Responsive to detecting the registered system management event during execution of one application of the set of applications, the process identifies applications of the set of applications associated with the registered system management event that are executing. The process then terminates the applications of the set of applications associated with the registered system management event that are executing. Responsive to terminating the applications of the set of applications associated with the registered system managing event that are executing, the process then executes a handler that processes the registered system management event. | 08-19-2010 |
20110076670 | DETECTION OF ANALYTES VIA NANOPARTICLE-LABELED SUBSTANCES WITH ELECTROMAGNETIC READ-WRITE HEADS - A first set of antibodies are bonded to a substrate, and are exposed to and bonded with target antigens. A second set of antibodies are bonded to nanoparticles, and the nanoparticle labeled antibodies are exposed to the targeted antigens. An electromagnetic write-head magnetizes the nanoparticles, and then a read-sensor detects the freshly magnetized nanoparticles. The substrate comprises a flexible film or a Peltier material to allow selective heating and cooling of the antigens and antibodies. Nanoparticles of different magnetic properties may be selectively paired with antibodies associated with different antigens to allow different antigens to be detected upon a single scan by the read-sensor. | 03-31-2011 |
20110076782 | READ-AFTER-WRITE DETECTION OF ANALYTES VIA NANOPARTICLE-LABELED SUBSTANCES - Embodiments of the invention relate to magnetizing and detecting nanoparticle-labeled antigens on biosample tracks deposited on a tape media. An aspect of the invention comprises apparatus and methods for labeling antigens with demagnetized nanoparticles, magnetizing the nanoparticles with an electromagnetic write head, and detecting the antigens via the magnetized nanoparticles by reading the tape media with a read sensor in a read-after-write operation. The write head and read sensor are part of a head-module of magnetic tape drive. Target antigens are attached to the biosample tracks by antibodies. Nanoparticles of differing magnetic properties may be selectively paired with antibodies associated with different antigens to allow multiple antigens to be detected upon a single scan by the read sensor. | 03-31-2011 |
20110077869 | CIRCUIT FOR DETECTING ANALYTES VIA NANOPARTICLE-LABELED SUBSTANCES WITH ELECTROMAGNETIC READ-WRITE HEADS - A circuit for detecting antigens on biosample tracks comprising a processor, an electromagnetic write head for magnetizing nanoparticles attached to the antigens via antibodies in response to a write signal from the processor, and a first amplifier for supplying power to the write head. The circuit further comprises a magneto-resistive read sensor for detecting the magnetized nanoparticles upon receiving a read signal from the processor, and a second amplifier for supplying power to the read sensor. The write head and read sensor may be part of a head module in a magnetic tape drive. Nanoparticles of differing magnetic properties may be selectively paired with antibodies associated with different antigens to allow different antigens to be detected upon a single scan by the read-sensor. | 03-31-2011 |
20110077902 | SERVO CONTROL CIRCUIT FOR DETECTING ANALYTES VIA NANOPARTICLE-LABELED SUBSTANCES WITH ELECTROMAGNETIC READ-WRITE HEADS - A circuit for controlling an electromagnetic head module to detect antigens on a biosample track comprising a processor for receiving position-error-servo signal from the PES read sensor, a write head for magnetizing nanoparticles attached to antigens, and a read sensor for detecting the nanoparticle-labeled antigens. The circuit may further comprise an X-axis actuator for controlling the head module in the direction perpendicular to the track and an Y-axis actuator coupled to the head module and the X-axis actuator for controlling the head module in the direction of the track. Target antigens are attached to the biosample track and nanoparticles via antibodies. | 03-31-2011 |
20110282844 | CLIENT-SERVER MULTIMEDIA ARCHIVING SYSTEM WITH METADATA ENCAPSULATION - A system, method and computer program product for archiving image, audio, and text data with metadata encapsulation in a client-server storage library is described. The server receives and holds the images, audio, or text to be archived in an image, audio or text logical partition which includes a directory of the images, audio, or text. The information is encapsulated in a metadata wrapper and stored in the library as a closed image, audio, or text file along with a closed copy of the directory. The closed image, audio, or text directory is also stored in the client. The images may be encapsulated in MXF, DICOM, Tape Archive (TAR) or GZIP formats. The storage library may have magnetic tapes, magnetic disks or optical disks as storage media. | 11-17-2011 |
20120143828 | AUTOMATED FILE RELOCATION - A processor-implemented method, system and/or computer program product for managing computer file storage is presented. A file, which is designated for storage, is received. Upon determining that the file exceeds a pre-determined size, the file is stored in a pre-designated folder that is reserved for oversized files. This pre-designated folder is protected such that any file stored within the pre-designated folder is prevented from being moved into archival storage. | 06-07-2012 |
20120147738 | COMMUNICATING INFORMATION IN AN INFORMATION HANDLING SYSTEM - A node communicates with a first network through a link aggregation of at least one primary port and at least one backup port. The link aggregation is for rerouting a communication with the first network to occur through the backup port in response to a malfunction in the communication through the primary port. In response to a malfunction in the communication through the backup port, the node communicates with a second network. | 06-14-2012 |
20120158882 | HIGHLY SCALABLE AND DISTRIBUTED DATA SHARING AND STORAGE - Embodiments of the disclosure relate to storing and sharing data in a scalable distributed storing system using parallel file systems. An exemplary embodiment may comprise a network, a storage node coupled to the network for storing data, a plurality of application nodes in device and system modalities coupled to the network, and a parallel file structure disposed across the storage node and the application nodes to allow data storage, access and sharing through the parallel file structure. Other embodiments may comprise interface nodes for accessing data through various file access protocols, a storage management node for managing and archiving data, and a system management node for managing nodes in the system. | 06-21-2012 |
20120326318 | BURIED METAL-SEMICONDUCTOR ALLOY LAYERS AND STRUCTURES AND METHODS FOR FABRICATION THEREOF - A method for forming a metal-semiconductor alloy layer uses particular thermal annealing conditions to provide a stress free metal-semiconductor alloy layer through interdiffusion of a buried semiconductor material layer and a metal-semiconductor alloy forming metal layer that contacts the buried semiconductor material layer within an aperture through a capping layer beneath which is buried the semiconductor material layer. A resulting semiconductor structure includes the metal-semiconductor alloy layer that further includes an interconnect portion beneath the capping layer and a contiguous via portion that penetrates at least partially through the capping layer. Such a metal-semiconductor alloy layer may be located interposed between a substrate and a semiconductor device having an active doped region. | 12-27-2012 |
20120329244 | Capping Coating for 3D Integration Applications - A structure for a semiconductor component is provided having a bi-layer capping coating integrated and built on supporting layer to be transferred. The bi-layer capping protects the layer to be transferred from possible degradation resulting from the attachment and removal processes of the carrier assembly used for layer transfer. A wafer-level layer transfer process using this structure is enabled to create three-dimensional integrated circuits. | 12-27-2012 |
20140018265 | CARTRIDGE FOR STORING BIOSAMPLE PLATES AND USE IN AUTOMATED DATA STORAGE SYSTEMS - In one embodiment, a biosample storage cartridge includes an enclosure having a same form factor as a data tape cartridge configured for use in an automated tape library; and a holder disposed in the enclosure. In another embodiment, a biosample storage cartridge includes an enclosure and a holder disposed in the enclosure; the holder is configured to receive one or more biosamples, the cartridge is structurally configured to be picked by a picker of an access robot that is configured to pick a data tape cartridge in an automated tape library. In still another embodiment, an analytical system includes a bioanalysis drive configured to perform bioanalysis on one or more biosamples received from at least one biosample storage cartridge. | 01-16-2014 |
20140080118 | SAMPLE ASSEMBLY WITH AN ELECTROMAGNETIC FIELD TO ACCELERATE THE BONDING OF TARGET ANTIGENS AND NANOPARTICLES - Described are embodiments of an invention for a sample assembly with an electrical conductor for generating an electromagnetic field to speed up the tagging of target antigens with antiparticles for detection of the antigens by electromagnetic read heads. A sample assembly includes a surface with a first set of antibodies bonded thereon. Target antigens are bonded with the first set of antibodies. A second set of antibodies bonded to nanoparticles are exposed to the sample surface to bond with the target antigens. The electrical conductor generates an electromagnetic field that moves the nanoparticle-labeled antibodies toward the antigens to shorten the time to complete their bonding process. | 03-20-2014 |
20140094114 | BIOSAMPLE CARTRIDGE WITH RADIAL SLOTS FOR STORING BIOSAMPLE CARRIERS AND USING IN AUTOMATED DATA STORAGE SYSTEMS - Embodiments of the disclosure relate to a biosample cartridge that includes radial slots for storing biosample carriers. The biosample cartridge has the same form factor as data tape cartridges used in automated tape libraries to allow the biosample cartridge to be handled by the same robotic mechanisms that handle the data tape cartridges. One aspect of the disclosure concerns a biosample cartridge that includes a rotatable biosample carrier holder. The biosample carrier holder includes radial slots for receiving biosample carriers which contain biosamples scanned and analyzed by automated tape libraries. | 04-03-2014 |
20150015246 | CALIBRATING READ SENSORS OF ELECTROMAGNETIC READ-WRITE HEADS - Described are embodiments to calibrate read sensors, which in turn may ensure that the equipment utilized to detect antigens is reliable and accurate. If it is determined that a read sensor is degraded a method of calibrating a read sensor of a read head may be used. | 01-15-2015 |