Patent application number | Description | Published |
20080217771 | Metallic electrode forming method and semiconductor device having metallic electrode - A metallic electrode forming method includes: forming a bed electrode on a substrate; forming a protective film with an opening on the bed electrode to expose the bed electrode from the opening; forming a metallic film covering the protective film and the opening; mounting the substrate on an adsorption stage, and measuring a surface shape of the metallic film by a surface shape measuring means; deforming the substrate by a deforming means so that a difference between the principal surface and a cutting surface is within a predetermined range; measuring a surface shape of the principal surface, and determining whether the difference is within a predetermined range; and cutting the substrate along with the cutting surface so that the metallic film is patterned to be a metallic electrode. | 09-11-2008 |
20100288636 | Laminated gas sensor and method of producing the same - A laminated gas sensor for exhaust gases improving thermal shock resistance, durability and reliability without permitting characteristics of the exhaust gas sensor to be particularly lowered is provided. A laminated gas sensor comprising a solid electrolyte layer ( | 11-18-2010 |
20100311191 | Metallic electrode forming method and semiconductor device having metallic electrode - A metallic electrode forming method includes: forming a bed electrode on a substrate; forming a protective film with an opening on the bed electrode to expose the bed electrode from the opening; forming a metallic film covering the protective film and the opening; mounting the substrate on an adsorption stage, and measuring a surface shape of the metallic film by a surface shape measuring means; deforming the substrate by a deforming means so that a difference between the principal surface and a cutting surface is within a predetermined range; measuring a surface shape of the principal surface, and determining whether the difference is within a predetermined range; and cutting the substrate along with the cutting surface so that the metallic film is patterned to be a metallic electrode. | 12-09-2010 |
20110042741 | Semiconductor device having semiconductor chip and metal plate and method for manufacturing the same - A semiconductor device includes a first protection film for covering a first metal wiring. A second protection film is disposed on the first protection film, which is covered with a solder layer. Even if a crack is generated in the second protection film before the solder layer is formed on the second protection film, the crack is restricted from proceeding into the first protection film. | 02-24-2011 |
20110198733 | SEMICONDUCTOR DEVICE AND METHOD OF PATTERNNING RESIN INSULATION LAYER ON SUBSTRATE OF THE SAME - In a method of manufacturing a semiconductor device, an electrode layer is formed on a surface of a semiconductor substrate, and a resin insulation layer is formed on the surface of the semiconductor substrate so that the electrode layer can be covered with the resin insulation layer. A tapered hole is formed in the insulation layer by using a tool bit having a rake angle of zero or a negative value. The tapered hole has an opening defined by the insulation layer, a bottom defined by the electrode layer, and a side wall connecting the opening to the bottom. | 08-18-2011 |
20110207241 | Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatus - A formation method of a metallic electrode of a semiconductor device is disclosed. The method includes: acquiring data about surface shape of a surface part of a semiconductor substrate; and causing a deformation device to deform the semiconductor substrate based on the data so that a distance between a cutting plane and the surface part falls within a required accuracy in cutting amount. In deforming the semiconductor substrate, multiple actuators are used as the deformation device. A pitch of the multiple actuators is set to a value that is greater than one-half of wavelength of spatial frequency of a thickness distribution of the semiconductor substrate and that is less than or equal to the wavelength. | 08-25-2011 |
20110207264 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes cutting a part of a resin insulating layer formed on a surface of a semiconductor substrate with a cutting tool. The cutting the part of the resin insulating layer includes cutting a portion of the resin insulating layer that has a surface on which a metal layer is disposed. The cutting the portion of the resin insulating layer is performed in such a manner that, in a stress distribution inside the resin insulating layer along an edge portion of the cutting tool and a peripheral portion of the edge portion, a width at 90% of a maximum value is not more than 1.3 μm. | 08-25-2011 |
20150048510 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate and a metal film formed on the semiconductor substrate. The metal film includes a Ni base and a material having condensation energy higher than that of Ni. In a method of manufacturing a semiconductor device, a semiconductor substrate and a target, which is formed by melting P in Ni, are prepared, and sputtering is performed with the target while a portion of the semiconductor substrate where the metal film is to be formed is heated to a temperature of from 280° C. inclusive to 870° C. inclusive. | 02-19-2015 |
Patent application number | Description | Published |
20110215492 | MANUFACTURING METHOD OF ASPHERIC SURFACE LENS - Provided is an aspheric lens manufacturing method by which an aspheric lens having a desired shape can be manufactured with high accuracy regardless of the shape of a glass molding without reducing productivity. The aspheric lens manufacturing method for forming the aspheric lens by pressing and machining a glass material includes a pressing step for pressing the glass material to thereby form the aspheric surface, the flat surface of the peripheral portion of the aspheric surface, and the side surface continuous to the flat surface at the same time and form the glass molding, a mounting step for mounting the glass molding in a work holder which holds and positions the glass molding by being in contact with the flat surface and the side surface of the glass molding formed in the pressing step, and a machining step for machining an other surface of the glass molding mounted in the work holder in the mounting step to thereby form the other surface into a predetermined surface shape. | 09-08-2011 |
20120128936 | GLASS OPTICAL ELEMENT AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a glass optical element includes the steps of: feeding molten glass onto a lower mold part; and compression-molding the molten glass using an upper mold part and the lower mold part. The upper mold part is provided with a recess for forming a positioning protrusion of the glass optical element. A surface of the recess includes a first region where a protective film against the molten glass is formed, and a second region where the protective film is not formed and the upper mold part is exposed. In the step of compression-molding the molten glass, after the molten glass enters the recess, the molten glass is compression-molded in a state where a part of the molten glass and the second region do not contact each other, to thereby form the positioning protrusion of the glass optical element. | 05-24-2012 |
20120128937 | GLASS OPTICAL ELEMENT, METHOD OF PRODUCING THEREOF AND MOLD - A mold for use in production of a glass optical element includes an upper mold and a lower mold on which a molten glass is dropped, the lower mold being provided with a molding surface for press molding the molten glass with the upper mold. A recess for forming a positioning protrusion on the glass optical element is provided at an outer side of the molding surface. An inclined section is provided at an inner circumferential surface of the recess closer to the molding surface. The inclined section is inclined such that, when the molten glass dropped on the molding surface spreads toward the outer side, the molten glass enters the recess while maintaining contact with the inclined section. | 05-24-2012 |