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Eiji Sakamoto
FUJISAWA, JP
1. 20080233349 Functional Device - low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS 09-25-20082. 20080217752 Functional Device Package - packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si 09-11-2008