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Shohei Hata
YOKOHAMA, JP
1. 20090219728 SUBMOUNT AND ITS MANUFACTURING METHOD - Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a 09-03-20092. 20090126991 SUBSTRATE FOR MOUNTING ELECTRONIC PART AND ELECTRONIC PART 05-21-2009
3. 20080233349 Functional Device - low-cost MEMS functional device by improving air tightness of a jointed section by anode junction in wafer level packaging for MEMS 09-25-2008
4. 20080217752 Functional Device Package - packaging structure for hermitically sealing a functional device by solder connection at a wafer level in which a first Si 09-11-2008
